Co-Sputter Deposition System

    Facility/equipment: EquipmentCenter for Micro/Nano Science and Technology

    • Location

      No.1, University Road, Tainan City 701, Taiwan (R.O.C.) 701

      Taiwan

    Description

    When depositing a compound material or alloy material by the traditional sputtering system, a compoundet is always needed to be fabricate d. The fabricating process for the target is complex and the control for the composition of compound materials is also not difficult. The advantage for the co -sputtering system is the compound materials can be deposited by multi targets at the same time. T he parameters for each target can be adjusted individually. The thin film with optimal quality, repeatability and uniformity can be obtained. The substrate can also be heated to 500℃. The equipped electrodes are two DC guns and one RF gun.

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    sputtering
    direct current
    electrodes
    thin films