E-beam Evaporator can coating diferent thin film layer on silicon wafer, glass substrate and piezoelectric material surface. The main evaporator thin films have metal, nonmetal and oxide, etc. and once can input 4 inch wafer 15 PCS. The uniformity of this thin film on wafer can control in 5 % difference. Depend on that can plate thin film of more than one layer on wafer in demand.Au, Al, Ni, Pt, Ti, Cr, and Ag ( minimum uniform thickness 100 A)
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