Equipments Details
Description
"1.Mask screen size inspection, surface defects inspection.
2.Component cross-sectional structure inspection.
3.Line width measurement of semiconductor process.
4.Multilayer structure stacking dislocation inspection.
5.Dislocation and over-etching inspection.
6.Observation of biological tissue morphology.
7.Observation of internal structure of living cells over time."
2.Component cross-sectional structure inspection.
3.Line width measurement of semiconductor process.
4.Multilayer structure stacking dislocation inspection.
5.Dislocation and over-etching inspection.
6.Observation of biological tissue morphology.
7.Observation of internal structure of living cells over time."
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