Reactive Ion Etching

    Facility/equipment: EquipmentCenter for Micro/Nano Science and Technology

    • LocationShow on map

      No.1, University Road, Tainan City 701, Taiwan (R.O.C.) 701


    Equipments Details


    The etching process is usually employed to remove some material from wafer surface in the semiconductor manufacture. To obtain the needed pattern, the etching process is performed by using corrosive material. Generally, the etching methods are divided into wet and dry etching. However, the dry etching, also called plasma etching, is the most used to anisotropy etching.


    NameReactive Ion Etching
    Acquisition date13-12-30


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