Wafer Cutting Machine

    Facility/equipment: EquipmentCenter for Micro/Nano Science and Technology

    • Location

      No.1, University Road, Tainan City 701, Taiwan (R.O.C.) 701

      Taiwan

    Description

    Disco DAD-321 is produced by Disco Co. Ltd. Japan. It plays an important role from the zero-level package to the first-level package in the field of the microelectronic package. It can cut the wafer chip by chip precisely. Nevertheless, it offers three options of the substrate, glass, quartz and polymer, to the user. The practical operation is very simple as follows: first, to replace the knife, switch the power, align the height of the sample, and set the correction line. Then you can proceed the cutting operation. There is some limits illustrated in the following, to reserve 1~2 mm of margin, not suite for the materials resolvable in water; and the correction line available for the cutting.

    Details

    NameWafer Cutting Machine
    Acquisition date00-12-30

    Fingerprint

    polymer
    glass
    quartz
    substrate
    water
    cutting (process)
    material
    microelectronics