Wafer Cutting Machine

    Facility/equipment: EquipmentCenter for Micro/Nano Science and Technology

    • LocationShow on map

      No.1, University Road, Tainan City 701, Taiwan (R.O.C.) 701


    Equipments Details


    Disco DAD-321 is produced by Disco Co. Ltd. Japan. It plays an important role from the zero-level package to the first-level package in the field of the microelectronic package. It can cut the wafer chip by chip precisely. Nevertheless, it offers three options of the substrate, glass, quartz and polymer, to the user. The practical operation is very simple as follows: first, to replace the knife, switch the power, align the height of the sample, and set the correction line. Then you can proceed the cutting operation. There is some limits illustrated in the following, to reserve 1~2 mm of margin, not suite for the materials resolvable in water; and the correction line available for the cutting.


    NameWafer Cutting Machine
    Acquisition date00-12-30


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