Wire Bonding

    Facility/equipment: EquipmentCenter for Micro/Nano Science and Technology

    • LocationShow on map

      No.1, University Road, Tainan City 701, Taiwan (R.O.C.) 701


    Equipments Details


    Microelectronic packaging is made in the electronic products that need various kinds of electronic elements assembling and joining. Electronic packaging , the single chip must connect the outside signal to the leadframe through the metal line, and wrap up and cover it. IC chip must be designed and connected with external circuit, can just give play to the function that there should be normally. So the purpose to utilize w ire bonder is to connect the electrical bonding-pad and inner lead of leadframe or gold carry board bonding-pad with gold line, in order to reach the function that the electric signal connects. This centre apparatus of the w ire bonder is belongs to single point welding mode to connect the electric signal of chip.


    NameWire Bonding
    Acquisition date02-04-12


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