Department of Materials Science and Engineering

Research Output 1982 2019

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Conference contribution
2019

A novel TLP bonding based on sub-micron Ga particles

Lin, S., Liao, H. M., Yeh, C. Y. & Yang, C. H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 240-241 2 p. 8733446. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gallium
Liquids
Metallurgy
Nickel
Packaging

Development of Sn-Bi-In-Ga quaternary low-Temperature solders

Yang, C. H., Zhou, S., Lin, S. & Nishikawa, H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 367-369 3 p. 8733565. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gallium
Indium
Soldering alloys
Intermetallics
Temperature

The study of Sn-45Bi-2.6Zn alloy before and after thermal aging

Zhou, S., Yang, C. H., Shen, Y. A., Lin, S. & Nishikawa, H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 333-336 4 p. 8733417. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal aging
Eutectics
Elongation
Ternary systems
Soldering alloys
2018

Application of Electron Channeling Contrast Image on Analysis of Dislocation Structures Induced by Indentation in Nickel Single Crystal

Huang, F. Y. & Kuo, J-C., 2018 Sep 9, 19th International Microscopy Congress 2018 (IMC19). Sydney, Australia

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of micro-plasma parameters to different kind of solutions for biomedical applications

Hien, N. T. M., Linh, H. Q., Thuy, N. N. S. & Liao, J-D., 2018 Jan 1, 6th International Conference on the Development of Biomedical Engineering in Vietnam, BME6. Vo Van, T., Nguyen Le, T. A. & Nguyen Duc, T. (eds.). Springer Verlag, p. 259-262 4 p. (IFMBE Proceedings; vol. 63).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plasmas
Gases
Plasma jets
Oncology
Beam plasma interactions

Effect of process parameters on dimension of single-track ss316l deposited by direct energy deposition

Chen, Y. T. & Kuo, J-C., 2018 Aug 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric current-induced plastic deformation: An in situ experimental study

Liu, Y. C. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 197-198 2 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric currents
Plastic deformation
Electromigration
Twinning
Current density

Fabrication of field-sequential color display using predesigned Ferroelectric liquid crystals

Liu, C-Y., Zhang, Y. S. & Liu, J. H., 2018 Jan 1, TechConnect Briefs 2018 - Informatics, Electronics and Microsystems. Laudon, M., Case, F., Romanowicz, B. & Case, F. (eds.). TechConnect, p. 189-192 4 p. (TechConnect Briefs 2018 - Advanced Materials; vol. 4).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Liquid Crystals
Liquid crystals
Ferroelectric materials
Display devices
Color

Ga-based submicron particle and applications

Liao, H. M., Yeh, C. Y. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 396-398 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sonochemistry
Organic solvents
Oxides
Intermetallics
Solid solutions

Improved contact lens injection molding production by 3D printed conformal cooling channels

Lin, Y. F., Wu, J. R., Liu, B. H., Wei, W. C. J., Wang, A. B. & Luo, R. C., 2018 Feb 1, SII 2017 - 2017 IEEE/SICE International Symposium on System Integration. Institute of Electrical and Electronics Engineers Inc., p. 89-94 6 p. (SII 2017 - 2017 IEEE/SICE International Symposium on System Integration; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

contact lenses
Contact lenses
Injection Molding
injection molding
Injection molding

Mechanical properties of Sn-Bi-In-Ga low melting temperature solder alloys

Yang, C. H., Zhou, S., Nishikawa, H. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 409-410 2 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Melting point
Mechanical properties
Chemical elements
Yield stress

Texture simulation of cold-rolled F.C.C. metals by using taylor model

Hsiao, S. C. & Kuo, J-C., 2018 Aug 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T. & Lin, K-L., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 226-229 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Soldering alloys
Failure modes
Alloying
Nanohardness
2017

Application of Electron Channeling Contrast Imaging-Investigation of dislocations in deformed bcc metal

Wu, T. Y. & Kuo, J-C., 2017 Nov 5, IUMRS International Conference in Asia (IUMRS-ICA 2017) in Symposium E3 of Advanced Steels. Taipei, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of Atomic Number on Spatial Resolution of Transmission Electron Backscatter Diffraction

Kuo, C. W. & Kuo, J-C., 2017 Aug 4, The 2nd International Conference on Advanced Functional Materials. Los Angeles, USA

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Effect of doping element on the interfacial reaction behavior of Ag alloy wires bonding on Al pad after HTST and TCT tests

Lin, Y. W., Su, M. C., Huang, W. H., Chiu, Y. T., Shih, T. P. & Lin, K-L., 2017 Feb 21, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., p. 613-619 7 p. 7861553. (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Surface chemistry
Chemical elements
Doping (additives)
Wire
Ions

Effect of Mg Addition on the Grain Growth Behavior of Austenite in SS400

Lai, C. T., Wu, H. Y., Huang, F. Y., Hsiao, Z. W., Su, Y. H. F., Kuo, J-C. & Lai, H. H., 2017 Nov 5, IUMRS International Conference in Asia (IUMRS-ICA 2017). Taipei, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Effect of microstructure on ionic conduction of Composite Electrolytes consisting of doped ceria and carbonates

Fung, K-Z., Ni, C. T., Tsai, S. Y. & Tang, J. Y., 2017 May 30, ECS Transactions. Kawada, T. & Singhal, S. C. (eds.). 1 ed. Electrochemical Society Inc., p. 371-376 6 p. (ECS Transactions; vol. 78, no. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ionic conduction
Cerium compounds
Carbonates
Electrolytes
Microstructure

Effect of Stacking Fault Energy on Cold-Rolling Texture and Microstructure of FCC Metals

Kuo, J-C., Hsiao, Z. W. & Chen, H. J., 2017 Mar 22, BIT’s 5th Annual Conference of AnalytiX-2017. Fukuoka, Japan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrochromic device with functions of rapid switching duty cycle and infrared suppression

Chu, C. H., Wu, H. W., Huang, J-L. & Chiu, C. T., 2017 Jul 21, Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017. Meen, T-H., Lam, A. D. K-T. & Prior, S. D. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 349-352 4 p. 7988424. (Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

infrared suppression
Electrochromic devices
Light modulation
retarding
Infrared radiation

Improved electrical performance of organic thin-film transistors with modified high-K dielectrics

Wu, F. C., Yeh, B. L., Chou, T. H., Chen, J-S., Tsai, M. R., Cheng, H-L. & Chou, W-Y., 2017 Aug 8, AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 183-186 4 p. 8006115. (AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thin film transistors
Polyimides
Hafnium
Surface tension
Permittivity

In situ synchrotron X-ray diffraction study on the rehydrogenation behavior of MgH2 -LiAlH4 composites

Lin, I. C. & Tsai, W-T., 2017 Jul 21, Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017. Meen, T-H., Lam, A. D. K-T. & Prior, S. D. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 1918-1921 4 p. 7988326. (Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Synchrotrons
X-Ray Diffraction
Hydrogen
synchrotrons
X ray diffraction

Light-bias interaction of zinc-Tin oxide (ZTO) thin film transistor for charge-Trapping memory application

Chen, J-S., Li, J. T., Liu, L. C., Ke, P. H. & Jeng, J. S., 2017 Aug 8, AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 62-65 4 p. 8006077. (AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Charge trapping
Thin film transistors
Zinc oxide
Tin oxides
Oxide films

Microstructure and Deformation Characteristics of MnS in 1215MS Steel at 1050°C

Huang, F. Y., Su, Y. H. F. & Kuo, J-C., 2017 May 29, International Conference on Mining, Material, and Metallurgical Engineering (ICMMME). Tokyo, Japan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Revisit the electromigration effect: In situ synchrotron X-ray and scanning electron microscopy and ab initio calculations

Lin, S., Liu, Y. C., Chiu, S. J., Liu, Y. T. & Lee, H. Y., 2017 Jun 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 517-518 2 p. 7939436. (2017 International Conference on Electronics Packaging, ICEP 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Synchrotrons
X rays
Scanning electron microscopy
X ray diffraction analysis

The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Niu, X. & Lin, K-L., 2017 Sep 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Institute of Electrical and Electronics Engineers Inc., p. 80-88 9 p. 8046412

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
Wetting
Electron probe microanalysis
Substrates
2016
4 Citations (Scopus)

3D printing of low melting temperature alloys by fused deposition modeling

Hsieh, P. C., Tsai, C. H., Liu, B. H., Wei, W. C. J., Wang, A. B. & Luo, R. C., 2016 May 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., p. 1138-1142 5 p. 7474915. (Proceedings of the IEEE International Conference on Industrial Technology; vol. 2016-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Melting point
Printing
Metals
Polymers
Fabrication

A novel approach for forming ductile Cu-to-Cu interconnection

Yeh, C. Y., Kuo, Y. K. & Lin, S., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 479-484 6 p. 7486873. (2016 International Conference on Electronics Packaging, ICEP 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electronics packaging
Electronics industry
Silicon
Processing
Soldering alloys
3 Citations (Scopus)

A novel mechanism of silver microflakes sinter joining

Zhang, H., Nagao, S., Lin, S., Yokoi, E., Chen, C. & Suganuma, K., 2016 May 2, China Semiconductor Technology International Conference 2016, CSTIC 2016. Wu, H., Lung, H-L., Shi, Y., Chen, D., Huang, D., Wang, Q., Wu, K., Zhang, Y., Claeys, C., Liang, S., Huang, R., Zhang, B., Song, P., Yan, J., Lin, Q. & Lai, K. (eds.). Institute of Electrical and Electronics Engineers Inc., 7463950. (China Semiconductor Technology International Conference 2016, CSTIC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver
Joining
Sintering
Diffusion bonding
Nucleation
1 Citation (Scopus)

Ceramic feedstocks for additive manufacturing

Fan, N. C., Wei, W. C. J., Liu, B. H., Wang, A. B. & Luo, R. C., 2016 May 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., p. 1147-1151 5 p. 7474917. (Proceedings of the IEEE International Conference on Industrial Technology; vol. 2016-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3D printers
Feedstocks
Powders
Alumina
Polymers

Cu-based alloys for 3DP by melt extrusion process

Chou, C. S., Wei, W. C. J., Liu, B. H., Wang, A. B. & Luo, R. C., 2016 May 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., p. 1152-1157 6 p. 7474918. (Proceedings of the IEEE International Conference on Industrial Technology; vol. 2016-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3D printers
Extrusion
Thermal insulation
Heating rate
Feedstocks
3 Citations (Scopus)

Design and test of additive manufacturing for coating thermoplastic PEEK material

Liu, C. Y., Hsieh, Y. W., Sun, T. J., Zeng, J. W., Wang, A. B., Lee, N. T., Chau, S. W., Wei, W. C., Liu, B. H. & Luo, R. C., 2016 May 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., p. 1158-1162 5 p. 7474919. (Proceedings of the IEEE International Conference on Industrial Technology; vol. 2016-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3D printers
Polyether ether ketones
Thermoplastics
Coatings
Rapid prototyping

Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper

Shia, Z. W., Kuo, C. W., Kuo, T. Y. & Kuo, J-C., 2016 Aug 1, International Conference & Exhibition on Advanced & Nano Materials (ICANM). Montreal, Quebec, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrical tensile test

Hsueh, H. W., Hung, F-Y., Lui, T-S. & Chen, L. H., 2016 Jan 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390694

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Reliability analysis
Wire
Current density
Embrittlement
Grain growth

Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition

Tsai, W-T., Yang, J. J. & Cheng, C. L., 2016 Jan 1, Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016. Avestia Publishing

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Carbon Dioxide
Aspect Ratio
Aspect ratio
Carbon dioxide
carbon dioxide
1 Citation (Scopus)

Glass and hot extrusion by ME module for 3D additive manufacturing

Wang, P. W., Chou, C. S., Wei, W. C. J., Liu, B. H., Liu, A., Wang, A. B. & Luo, R. C., 2016 May 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., p. 1167-1171 5 p. 7474920. (Proceedings of the IEEE International Conference on Industrial Technology; vol. 2016-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3D printers
Extrusion
Thermal insulation
Glass
Nozzles

Optimization of micro-plasma parameters for wound healing

Hien, N. T. M., Linh, H. Q. & Liao, J-D., 2016 Dec 12, BME-HUST 2016 - 3rd International Conference on Biomedical Engineering. Institute of Electrical and Electronics Engineers Inc., p. 146-149 4 p. 7782095. (BME-HUST 2016 - 3rd International Conference on Biomedical Engineering).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plasmas
Cell culture
Tissue
Cell proliferation
Fibroblasts

Rapid SNP Genotyping of TMIGD1 Gene in Tsaiya Duck Using Lateral-flow Immunoassay with Primer Extension and Nano-gold

Lin, C. W., Kuo, J-C. & Huang, H. L., 2016 Jul 25, 10th Asia-Pacific Biotech Congress. Bangkok, Thailand

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Yang, P. F., Huang, L., Hung, C. P., Uegaki, S. & Lin, K-L., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 497-501 5 p. 7486877. (2016 International Conference on Electronics Packaging, ICEP 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chlorine Compounds
Sheet molding compounds
Chlorine
Wire
Corrosion

Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation

Tseng, Y. W., Hung, F-Y. & Lui, T-S., 2016 Jan 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390675

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wire
Plating
Electric properties
Acoustic impedance
Packaging
2015

Application of transmission-EBSD on Copper nanotwin Structure

Shih, J. W., Chen, D. & Kuo, J-C., 2015 Jul 8, International Workshop on Advanced and In-situ Microscopies of Functional Nanomaterials and Devices. Hamburg, German

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Conductivity enhancement and thin-film processing of Li4Ti5O12(LTO) Spinel for Li battery applications

Tsai, S. Y., Fung, K-Z. & Ni, C. T., 2015, Batteries. 2 ed. Electrochemical Society Inc., Vol. 68. p. 37-43 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Annealing
Thin films
Processing
Redox reactions
Electrochemical properties
1 Citation (Scopus)

Dependence of electrical properties on thermal reduction of protecting oxides for SOFC interconnect applications

Tsai, S. Y., Fung, K-Z., Ni, C. T. & Ho, H. C., 2015 Jan 1, Solid Oxide Fuel Cells 14, SOFC 2015. Eguchi, K. & Singhal, S. C. (eds.). 1 ed. Electrochemical Society Inc., p. 1641-1647 7 p. (ECS Transactions; vol. 68, no. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Solid oxide fuel cells (SOFC)
Electric properties
Oxides
Crystal structure
Annealing

Effect of different properties of Cu(In1-xGax)Se2 thin films synthesized by femtosecond and nanosecond pulsed laser deposition

Tsai, M. G., Chen, C. C., Chen, Y. J., Chen, I-G., Qi, X-D., Huang, J-C., Lin, C. Y. & Cheng, C. W., 2015 Jan 1, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XX. Roth, S., Xu, X., Nakata, Y. & Neuenschwander, B. (eds.). SPIE, 935019. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 9350).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Pulsed Laser Deposition
Femtosecond
Pulsed laser deposition
pulsed laser deposition
Thin Films

Effects of surface forces on pure squeeze elastohydrodynamic lubrication motion of circular contacts with coated layer

Chu, L. M., Li, W-L., Chen, Q. D., Yu, C. C. & Yeh, C. Y., 2015 Jan 1, Tribology Engineering. Horng, J-H., Wei, C-C. & Hwang, Y-L. (eds.). Trans Tech Publications Ltd, p. 104-109 6 p. (Key Engineering Materials; vol. 642).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Elastohydrodynamic lubrication
Film thickness
Solvation
Finite element method

Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging

Chiu, W. L., Lu, C. L., Lin, H. W., Liu, C. M., Huang, Y. S., Lu, T. L., Liu, T. C., Hsiao, H. Y., Chen, C., Kuo, J-C. & Tu, K. N., 2015 May 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 518-522 5 p. 7111069. (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallizing
Packaging
Fabrication
Single crystals
Crystal growth
4 Citations (Scopus)

Stability of Bi2O3-based ionic conductor and its application on composite cathode

Tsai, S. Y., Fung, K-Z., Ni, C. T. & Chang, Y. F., 2015, Solid Oxide Fuel Cells 14, SOFC 2015. 1 ed. Electrochemical Society Inc., Vol. 68. p. 867-874 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yttrium oxide
Bismuth
Cathodes
Composite materials
Solid oxide fuel cells (SOFC)

Static analysis of spiral-grooved gas film face seal in microsystem

Nguyen, C. C., Jao, H. C. & Li, W-L., 2015, 2015 IFToMM World Congress Proceedings, IFToMM 2015. National Taiwan University

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microsystems
Static analysis
Seals
Gases
Lubrication
2 Citations (Scopus)

Study of AZO thin films under different annealing atmosphere on structural, optical and electrical properties by RF magnetron sputtering

Lin, Y. M., Chu, C. H., Wu, H. W. & Huang, J-L., 2015 Jan 1, IMECS 2015 - International MultiConference of Engineers and Computer Scientists 2015. Feng, D. D., Ao, S. I., Douglas, C., Ao, S. I., Douglas, C., Lee, J-A., Ao, S. I. & Castillo, O. (eds.). Newswood Limited, p. 807-810 4 p. (Lecture Notes in Engineering and Computer Science; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Magnetron sputtering
Structural properties
Electric properties
Optical properties
Annealing

The primary results of the N2/Ar micro-plasma exposure on second degree wound healing

Ngo, M. H., Shao, P. L. & Liao, J-D., 2015 Jan 1, 5th International Conference on Biomedical Engineering in Vietnam. Toi, V. V. & Phuong, T. H. L. (eds.). Springer Verlag, p. 151-154 4 p. (IFMBE Proceedings; vol. 46).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plasmas