Department of Materials Science and Engineering

Research Output 1973 2020

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Conference contribution
1 Citation (Scopus)

The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

Yeh, F. J., Chiu, T. C. & Lin, K-L., 2012, 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 6507860

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal cycling
Multilayers
Atoms
Electron spectroscopy
Metallizing
4 Citations (Scopus)

The introduction of MEMS packaging technology

Hsieh, C. T., Ting, J-M., Yang, C. & Chung, C-K., 2002 Jan 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 300-306 7 p. 1188855. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Packaging
Biochemistry
Consumer electronics
Modems
1 Citation (Scopus)

The investigations of InAs quantum dots overgrown on in 0.1Ga0.9As surfactant layer and 10° off-angle (100) GaAs substrate

Tang, S. F., Hsu, M. Y., Chiang, C. D., Su, C. C., Liu, C. P. & Fang, Y. C., 2008 Mar 31, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV. 68001E. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6800).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Surfactant
Gallium Arsenide
Quantum Dots
Surface-Active Agents
Semiconductor quantum dots
1 Citation (Scopus)

The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating

Kuo, Y. L. & Lin, K-L., 2011 Dec 1, APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials. p. 193-198 6 p. 6105698. (Proceedings - International Symposium on Advanced Packaging Materials).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nickel plating
Soldering alloys
Eutectics
Kinetics
Temperature

The magnetic anisotropy properties of Ga0.93Mn0.07As by low-temperature annealing

Lee, W., Chen, Y-F., Huang, J-L., Huang, B., Kuo, C., Chin, T. & Ku, H., 2006 Dec 1, INTERMAG 2006 - IEEE International Magnetics Conference. 1 p. 4261600. (INTERMAG 2006 - IEEE International Magnetics Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Niu, X. & Lin, K. L., 2017 Sep 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 80-88 9 p. 8046412. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
Wetting
Electron probe microanalysis
Substrates

The microstructure and fracture behavior of Sn-3Ag-o.5Cu solder joints

Wang, T. S., Liu, S. C., Huang, Y. L., Lin, K-L. & Lai, Y. S., 2008 Dec 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 293-296 4 p. 4784286. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fracture energy
Ductile fracture
Microstructure
Intermetallics
3 Citations (Scopus)

The physics of Cu pillar bump interconnect under electromigration stress testing

Hsiao, Y. H., Chen, C. F., Yang, P. F., Lee, C. C., Liu, M. C., Lin, K-L., Chen, C. W. & Factor, B. J., 2014 Nov 18, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 6962759. (Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Soldering alloys
Physics
Testing
Intermetallics
1 Citation (Scopus)

The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads

Lin, H. W., Lu, J. L., Liu, C. M., Chen, C., Tu, K. N., Chen, D. & Kuo, J-C., 2012 Dec 1, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. p. 90-93 4 p. 6420285. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electroplating
Intermetallics
Soldering alloys
Crystals
Metals

The primary results of the N2/Ar micro-plasma exposure on second degree wound healing

Ngo, M. H., Shao, P. L. & Liao, J. D., 2015 Jan 1, 5th International Conference on Biomedical Engineering in Vietnam. Toi, V. V. & Phuong, T. H. L. (eds.). Springer Verlag, p. 151-154 4 p. (IFMBE Proceedings; vol. 46).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plasmas
3 Citations (Scopus)

The properties of Ti-doped ZnO films before and after annealing in the different atmosphere

Lin, S. S. & Huang, J-L., 2006 Jan 1, Heat Treatment of Materials, AHTM ' 05 - Proceedings of the 3rd Asian Conference on Heat Treatment of Materials. Trans Tech Publications Ltd, p. 571-576 6 p. (Solid State Phenomena; vol. 118).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Annealing
atmospheres
annealing
direct current
electrical resistivity
1 Citation (Scopus)

The striated deformation of Sn solders under high frequency resonant vibration

Chuang, C. M., Lui, T. S. & Chen, L. H., 2001 Jan 1, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 328-334 7 p. 984005. (Advances in Electronic Materials and Packaging 2001).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Vibrations (mechanical)
Natural frequencies
Cracks
Fracture toughness

The study of Sn-45Bi-2.6Zn alloy before and after thermal aging

Zhou, S., Yang, C. H., Shen, Y. A., Lin, S. & Nishikawa, H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 333-336 4 p. 8733417. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal aging
Eutectics
Elongation
Ternary systems
Soldering alloys

The wetting interaction between electroless NiP deposit/Cu substrate and SnAg solder

Hsieh, P. & Lin, K-L., 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. p. 29-32 4 p. 6117224

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Wetting
Deposits
Substrates
Growth kinetics

Use of nanoindentation for investigating the nanostructure of dentin tissue

Wu, B. H., Chung, C. J., Han, C. F., Chen, T. Y. F., Chuang, S. F., Li, W. L. & Lin, J. F., 2011 Dec 1, Mechanics of Biological Systems and Materials - Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics. p. 153-158 6 p. (Conference Proceedings of the Society for Experimental Mechanics Series; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nanoindentation
Nanostructures
Focused ion beams
Tissue
Transmission electron microscopy
2 Citations (Scopus)

Using the simplified 3D DIC method to measure the deformation of 3D surface

Tung, S. H., Kuo, J-C., Shih, M. H. & Sung, W. P., 2012 Jan 1, Frontiers of Manufacturing and Design Science II. p. 3945-3949 5 p. (Applied Mechanics and Materials; vol. 121-126).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Correlation methods
Geometry
2 Citations (Scopus)

VGCF/carbon composites for plasma-facing materials

Lake, M. L. & Ting, J. M., 1993 Dec 1, Proceedings of SPIE - The International Society for Optical Engineering. Khounsary, A. M. (ed.). Publ by Society of Photo-Optical Instrumentation Engineers, p. 196-205 10 p. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 1997).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Facings
carbon fibers
Carbon fibers
Vapors
vapors

Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation

Tseng, Y. W., Hung, F-Y. & Lui, T-S., 2016 Jan 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390675. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wire
Plating
Electric properties
Acoustic impedance
Packaging