Department of Materials Science and Engineering

Research Output 1973 2020

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Conference contribution

Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation

Tseng, Y. W., Hung, F-Y. & Lui, T-S., 2016 Jan 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390675. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wire
Plating
Electric properties
Acoustic impedance
Packaging
2 Citations (Scopus)

VGCF/carbon composites for plasma-facing materials

Lake, M. L. & Ting, J. M., 1993 Dec 1, Proceedings of SPIE - The International Society for Optical Engineering. Khounsary, A. M. (ed.). Publ by Society of Photo-Optical Instrumentation Engineers, p. 196-205 10 p. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 1997).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Facings
carbon fibers
Carbon fibers
Vapors
vapors
2 Citations (Scopus)

Using the simplified 3D DIC method to measure the deformation of 3D surface

Tung, S. H., Kuo, J-C., Shih, M. H. & Sung, W. P., 2012 Jan 1, Frontiers of Manufacturing and Design Science II. p. 3945-3949 5 p. (Applied Mechanics and Materials; vol. 121-126).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Correlation methods
Geometry

Use of nanoindentation for investigating the nanostructure of dentin tissue

Wu, B. H., Chung, C. J., Han, C. F., Chen, T. Y. F., Chuang, S. F., Li, W. L. & Lin, J. F., 2011 Dec 1, Mechanics of Biological Systems and Materials - Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics. p. 153-158 6 p. (Conference Proceedings of the Society for Experimental Mechanics Series; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nanoindentation
Nanostructures
Focused ion beams
Tissue
Transmission electron microscopy

The wetting interaction between electroless NiP deposit/Cu substrate and SnAg solder

Hsieh, P. & Lin, K-L., 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. p. 29-32 4 p. 6117224

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Wetting
Deposits
Substrates
Growth kinetics

The study of Sn-45Bi-2.6Zn alloy before and after thermal aging

Zhou, S., Yang, C. H., Shen, Y. A., Lin, S. & Nishikawa, H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 333-336 4 p. 8733417. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal aging
Eutectics
Elongation
Ternary systems
Soldering alloys
1 Citation (Scopus)

The striated deformation of Sn solders under high frequency resonant vibration

Chuang, C. M., Lui, T. S. & Chen, L. H., 2001 Jan 1, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 328-334 7 p. 984005. (Advances in Electronic Materials and Packaging 2001).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Vibrations (mechanical)
Natural frequencies
Cracks
Fracture toughness
3 Citations (Scopus)

The properties of Ti-doped ZnO films before and after annealing in the different atmosphere

Lin, S. S. & Huang, J-L., 2006 Jan 1, Heat Treatment of Materials, AHTM ' 05 - Proceedings of the 3rd Asian Conference on Heat Treatment of Materials. Trans Tech Publications Ltd, p. 571-576 6 p. (Solid State Phenomena; vol. 118).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Annealing
atmospheres
annealing
direct current
electrical resistivity

The primary results of the N2/Ar micro-plasma exposure on second degree wound healing

Ngo, M. H., Shao, P. L. & Liao, J. D., 2015 Jan 1, 5th International Conference on Biomedical Engineering in Vietnam. Toi, V. V. & Phuong, T. H. L. (eds.). Springer Verlag, p. 151-154 4 p. (IFMBE Proceedings; vol. 46).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plasmas
1 Citation (Scopus)

The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads

Lin, H. W., Lu, J. L., Liu, C. M., Chen, C., Tu, K. N., Chen, D. & Kuo, J-C., 2012 Dec 1, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. p. 90-93 4 p. 6420285. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electroplating
Intermetallics
Soldering alloys
Crystals
Metals
3 Citations (Scopus)

The physics of Cu pillar bump interconnect under electromigration stress testing

Hsiao, Y. H., Chen, C. F., Yang, P. F., Lee, C. C., Liu, M. C., Lin, K-L., Chen, C. W. & Factor, B. J., 2014 Nov 18, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 6962759. (Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Soldering alloys
Physics
Testing
Intermetallics

The microstructure and fracture behavior of Sn-3Ag-o.5Cu solder joints

Wang, T. S., Liu, S. C., Huang, Y. L., Lin, K-L. & Lai, Y. S., 2008 Dec 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 293-296 4 p. 4784286. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fracture energy
Ductile fracture
Microstructure
Intermetallics

The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Niu, X. & Lin, K. L., 2017 Sep 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 80-88 9 p. 8046412. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
Wetting
Electron probe microanalysis
Substrates

The magnetic anisotropy properties of Ga0.93Mn0.07As by low-temperature annealing

Lee, W., Chen, Y-F., Huang, J-L., Huang, B., Kuo, C., Chin, T. & Ku, H., 2006 Dec 1, INTERMAG 2006 - IEEE International Magnetics Conference. 1 p. 4261600. (INTERMAG 2006 - IEEE International Magnetics Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating

Kuo, Y. L. & Lin, K-L., 2011 Dec 1, APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials. p. 193-198 6 p. 6105698. (Proceedings - International Symposium on Advanced Packaging Materials).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nickel plating
Soldering alloys
Eutectics
Kinetics
Temperature
1 Citation (Scopus)

The investigations of InAs quantum dots overgrown on in 0.1Ga0.9As surfactant layer and 10° off-angle (100) GaAs substrate

Tang, S. F., Hsu, M. Y., Chiang, C. D., Su, C. C., Liu, C. P. & Fang, Y. C., 2008 Mar 31, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV. 68001E. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6800).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Surfactant
Gallium Arsenide
Quantum Dots
Surface-Active Agents
Semiconductor quantum dots
4 Citations (Scopus)

The introduction of MEMS packaging technology

Hsieh, C. T., Ting, J-M., Yang, C. & Chung, C-K., 2002 Jan 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 300-306 7 p. 1188855. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Packaging
Biochemistry
Consumer electronics
Modems
1 Citation (Scopus)

The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

Yeh, F. J., Chiu, T. C. & Lin, K-L., 2012, 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 6507860

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal cycling
Multilayers
Atoms
Electron spectroscopy
Metallizing

The Influence of Grain Boundary and Triple Junction on Plastic Deformation

Liao, Y. Y. & Kuo, J-C., 2008 Jan 3, 14th International Symposium Plasticity. Hawaii, USA.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing

Chen, C. W., Lin, K-L., Chiu, Y. T., Kao, C. L., Lee, C. W. & Yang, P. F., 2014 Jan 30, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., p. 518-521 4 p. 7028325. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
Copper
Electric currents
Current density
4 Citations (Scopus)

The growth and segregation of intermetallic compounds in the bulk of flip chip Sn2.4Ag solder joint under electrical current stressing

Wang, W. C., Lin, K-L., Chiu, Y. T. & Lai, Y. S., 2013 Sep 9, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. p. 1600-1605 6 p. 6575785. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
Scanning electron microscopy
Electromigration
Metallizing
2 Citations (Scopus)

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T. & Lin, K. L., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 226-229 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Soldering alloys
Failure modes
Alloying
Nanohardness

The electromigration investigation on the newly developed Pb-free Sn-Zn-Ag-Al-Ga solder ball interconnect

Lin, K. L. & Lin, G. P., 2007 Oct 22, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. p. 1467-1471 5 p. 4250075. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Soldering alloys
Metallizing
Polychlorinated biphenyls
Ball grid arrays
10 Citations (Scopus)

The electromigration and thermomigration behaviors of Pb-free flip chip Sn-3Ag-0.5Cu solder bumps

Lin, K. L. & Kuo, S. M., 2006 Dec 22, Proceedings - IEEE 56th Electronic Components and Technology Conference. p. 667-672 6 p. 1645722. (Proceedings - Electronic Components and Technology Conference; vol. 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Soldering alloys
Thermal gradients
Cathodes
Heat losses

The effects of annealing and Si content on the charge-discharge characteristics of Al-Si thin film with pre-deposited Al layer

Wu, C. H., Hung, F-Y., Lui, T-S. & Chen, L. H., 2011 Jul 26, TMS 2011 - 140th Annual Meeting and Exhibition, Supplemental Proceedings. p. 127-134 8 p. (TMS Annual Meeting; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Annealing
Thin films
annealing
thin films
Anodes

The crystallization characteristics and photoluminescence properties of ZnO/Ag nanoflower arrays

Hu, Z. S., Hung, F. Y., Chang, S. J. & Chen, K. J., 2012 Nov 19, Technical Digest - 25th International Vacuum Nanoelectronics Conference, IVNC 2012Om. p. 176-180 5 p. 6316893. (Technical Digest - 25th International Vacuum Nanoelectronics Conference, IVNC 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nanoflowers
Zinc oxide
Photoluminescence
Crystallization
Zinc
5 Citations (Scopus)

The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Chen, Y. F., Yang, P. F., Huang, L. & Lin, K-L., 2014 Sep 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 419-424 6 p. 6897319. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chlorine Compounds
Sheet molding compounds
Chlorine
Wire
Corrosion
7 Citations (Scopus)

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Yang, P. F., Huang, L., Hung, C. P., Uegaki, S. & Lin, K-L., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 497-501 5 p. 7486877. (2016 International Conference on Electronics Packaging, ICEP 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chlorine Compounds
Sheet molding compounds
Chlorine
Wire
Corrosion

The application of a digital image correlation method for crack observation

Shih, M. H., Tung, S. H., Kuo, J-C. & Sung, W. P., 2006 Jan 1, Proceedings of the 8th International Conference on Computational Structures Technology, CST 2006. Civil-Comp Press, Vol. 83.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Correlation methods
Cracks
Monitoring
Strain gages
Concrete construction

Texture simulation of cold-rolled F.C.C. metals by using taylor model

Hsiao, S. C. & Kuo, J-C., 2018 Aug 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tensile properties of a friction stir processed Al-Cu 2218 alloy at elevated temperatures and related microstructural characteristics

Chen, S. T., Lui, T-S. & Chen, L. H., 2010 May 21, TMS 2010 - 139th Annual Meeting and Exhibition - Supplemental Proceedings. p. 129-138 10 p. (TMS Annual Meeting; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

tensile properties
Tensile properties
Grain boundary sliding
friction
Friction
1 Citation (Scopus)

Tensile mechanical properties and the ductile-to-brittle transition behavior of Mg-Li-Ai-Zn alloy

Yang, C. W., Lui, T-S. & Chen, L. H., 2010 May 21, Magnesium Technology 2010 - Held During TMS 2010 Annual Meeting and Exhibition. p. 455-459 5 p. (Magnesium Technology).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mechanical properties
Elongation
Phase interfaces
Temperature
Tensile strain

Tensile mechanical properties and brittle effect of austempered Cr-Mo alloy steel

Chen, C. Y., Hung, F-Y., Lui, T-S. & Chen, L. H., 2013 Apr 26, 4th International Symposium on High-Temperature Metallurgical Processing - Held During the TMS 2013 Annual Meeting and Exhibition. p. 299-306 8 p. (TMS Annual Meeting).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Alloy steel
salt baths
Bainite
Salts
steels
4 Citations (Scopus)

TEM validation of CD AFM image reconstruction: Part II

Dahlen, G. A., Liu, H. C., Osborn, M., Osborne, J. R., Tracy, B. & Del Rosario, A., 2008 Dec 1, Metrology, Inspection, and Process Control for Microlithography XXII. 69220K. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6922).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Image Reconstruction
Transmission Electron Microscopy
image reconstruction
Image reconstruction
atomic force microscopy
14 Citations (Scopus)

TEM validation of CD AFM image reconstruction

Dahlen, G. A., Mininni, L., Osborn, M., Liu, B. H., Osborne, J. R., Tracy, B. & Del Rosario, A., 2007 Oct 15, Metrology, Inspection, and Process Control for Microlithography XXI. PART 1 ed. 651818. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6518, no. PART 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Atomic Force Microscopy
Critical Dimension
Image Reconstruction
Transmission Electron Microscopy
image reconstruction
1 Citation (Scopus)

Synthesis of GaN nanowires using gold nanoparticles on plasma-activated silicon substrate

Lee, K. H., Lo, P. L. & Chen, I. G., 2009 Dec 1, Nanoscale One-Dimensional Electronic and Photonic Devices 3, NODEPD 3. 10 ed. p. 79-82 4 p. (ECS Transactions; vol. 25, no. 10).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nanowires
Gold
Nanoparticles
Plasmas
Silicon
3 Citations (Scopus)

SYNTHESIS AND SINTERING OF ZIRCONIA FINE POWDERS BY HYDROTHERMAL REACTIONS FROM ZIRCONIUM METAL AND HIGH-TEMPERATURE HIGH-PRESSURE SOLUTIONS.

Yoshimura, M. & Somiya, S., 1982 Dec 1, Materials Science Monographs. Elsevier Scientific Publ Co, p. 417-422 6 p. (Materials Science Monographs; vol. 14).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Study of AZO thin films under different annealing atmosphere on structural, optical and electrical properties by RF magnetron sputtering

Lin, Y. M., Chu, C. H., Wu, H. W. & Huang, J-L., 2015 Jan 1, IMECS 2015 - International MultiConference of Engineers and Computer Scientists 2015. Feng, D. D., Ao, S. I., Douglas, C., Ao, S. I., Douglas, C., Lee, J-A., Ao, S. I. & Castillo, O. (eds.). Newswood Limited, p. 807-810 4 p. (Lecture Notes in Engineering and Computer Science; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Magnetron sputtering
Structural properties
Electric properties
Optical properties
Annealing

Structures and opto-electrical characteristics of ZITO thin films

Hung, F. Y., Chen, K. J., Chang, S. J., Young, S. J. & Hu, Z. S., 2009 Dec 1, 2009 International Semiconductor Device Research Symposium, ISDRS '09. 5378181. (2009 International Semiconductor Device Research Symposium, ISDRS '09).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thin films

Structure control of bioactive titanate nanomesh layers fabricated on laser irradiated Ti-based bulk metallic glass using hydrothermal-electrochemical method

Maruyama, S., Sugiyama, N., Yoshimura, M., Shinonaga, T., Tsukamoto, M., Abe, N., Wada, T., Wang, X., Inoue, A., Okada, K. & Matsushita, N., 2011 Dec 1, Nanofunctional Materials, Nanostructures and Nanodevices for Biomedical Applications II. p. 134-139 6 p. (Materials Research Society Symposium Proceedings; vol. 1316).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallic glass
metallic glasses
activity (biology)
Lasers
Current density

Strain Distribution Analysis Using Digital- Image-Correlation Techniques

Tung, S. H., Kuo, J-C. & Shih, M. H., 2005 Dec 19, The Eighteenth KKCNN Symposium on Civil Engineering-NTU 29. Kaohsiung, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Statistical analysis on bonding strength and failure mechanism of plasma-sprayed HA coating with reinforced intermediate layers

Yang, C. W. & Lui, T. S., 2008 Jan 1, Multi-functional Materials and Structures - International Conference on Multifunctional Materials and Structures. Trans Tech Publications, p. 1007-1010 4 p. (Advanced Materials Research; vol. 47-50 PART 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sprayed coatings
Adhesives
Statistical methods
Composite coatings
Yttria stabilized zirconia

Static analysis of spiral-grooved gas film face seal in microsystem

Nguyen, C. C., Jao, H. C. & Li, W. L., 2015 Jan 1, 2015 IFToMM World Congress Proceedings, IFToMM 2015. National Taiwan University, (2015 IFToMM World Congress Proceedings, IFToMM 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microsystems
Static analysis
Seals
Gases
Lubrication
2 Citations (Scopus)

Stable Pt/Ge/Au ohmic contact to n-GaAs with a Ta-Si-N barrier

Chen, J. S., Kolawa, E., Ruiz, R. P. & Nicolet, M. A., 1993 Dec 1, III-V Electronic and Photonic Device Fabrication and Performance. Jones, K. S., Pearton, S. J. & Kanber, H. (eds.). Publ by Materials Research Society, p. 255-260 6 p. (Materials Research Society Symposium Proceedings; vol. 300).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ohmic contacts
electric contacts
barrier layers
Annealing
annealing
4 Citations (Scopus)

Stability of Bi2O3-based ionic conductor and its application on composite cathode

Tsai, S. Y., Fung, K. Z., Ni, C. T. & Chang, Y. F., 2015 Jan 1, Solid Oxide Fuel Cells 14, SOFC 2015. Singhal, S. C. & Eguchi, K. (eds.). 1 ed. Electrochemical Society Inc., p. 867-874 8 p. (ECS Transactions; vol. 68, no. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yttrium oxide
Bismuth
Cathodes
Composite materials
Solid oxide fuel cells (SOFC)

Squeeze film characteristics of circular contacts at constant squeeze velocity motion with non-newtonian lubricants

Chu, L. M., Li, W. L. & Hsu, H. C., 2011 Jul 4, Advanced Research on Mechanical Engineering, Industry and Manufacturing Engineering. p. 147-151 5 p. (Applied Mechanics and Materials; vol. 63-64).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Elastohydrodynamic lubrication
Lubrication
Lubricants
Hydrodynamics
Film thickness

Spark plasma sintering of PbTe thermoelectric bulk materials with small grains

Kuo, C. H., Hwang, C-S., Ku, J. R., Jeng, M. S. & Tsau, F. H., 2008 Aug 20, 2008 Proceedings of the ASME Micro/Nanoscale Heat Transfer International Conference, MNHT 2008. p. 1191-1193 3 p. (2008 Proceedings of the ASME Micro/Nanoscale Heat Transfer International Conference, MNHT 2008; vol. PART B).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Spark plasma sintering
sparks
sintering
Powders
comminution
1 Citation (Scopus)

SINTERING OF SYNTHETIC MICA BY A HYDROTHERMAL HOT ISOSTATIC PROCESS.

Hattori, T., Mohri, J. I., Yoshimura, M. & Somiya, S., 1984 Dec 1, Materials Science Monographs. Upadhyaya, G. S. (ed.). Elsevier, p. 153-155 3 p. (Materials Science Monographs).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mica
Sintering
Hot isostatic pressing
Phosphates
Temperature
1 Citation (Scopus)

Self-assembled Zn/ZnO dots on silicon by RF magnetron sputter

Liang, Y. H. & Liu, C. P., 2007 Dec 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 158-159 2 p. 4456152. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silicon

Self-assembled alternating nano-scaled layers

Wu, W. Y. & Ting, J. M., 2004 Jan 1, 2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004. Nano Science and Technology Institute, p. 448-451 4 p. (2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004; vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sputter deposition
Sputtering
Diamonds
Microstructure
Carbon