Organization profile

Organisation profile

The Institute of Microelectronics Engineering was established and supported with the approval of the Educational Adminstration in 2000, because of its outstanding research achievement and educational thrusts in modern microelectronics areas. We strongly support broad-based interdisciplinary research and collaborate with the companies in the Tainan Science-based Park on state-of-the-art subjects. With the designed diversified curriculum, we expect that our graduates will have the proficiency in mathematics, science, and engineering neccessary to develop solution of problems encountered in future practice. We are pleased that you are interested in the Institute of Microelectronics, and truly encourage and welcome you to join us in exploring the fascinating research areas. With our abundant research fruits and excellent faculties, we have been agreed by the Educational Adminstration to set the Institute of Microelectronics Engineering and admitted students from 2000. Besides continuing the high quality research fruits, we will cooperate with the companies in the Tainan Science-based Park on related subjects. Through this curriculum design, we hope that our student can do well on both practical and theoretical sides. And we wholeheartedly welcome you who are interested in our field to apply.

Fingerprint The fingerprint is based on mining the text of the scientific documents related to the associated persons. Based on that an index of weighted terms is created, which defines the key subjects of research unit

High electron mobility transistors Engineering & Materials Science
Electric potential Engineering & Materials Science
high electron mobility transistors Physics & Astronomy
Metals Chemical Compounds
Transconductance Engineering & Materials Science
Light emitting diodes Engineering & Materials Science
Transistors Engineering & Materials Science
Electric breakdown Engineering & Materials Science

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Projects 1996 2018

Research Output 1980 2018

Absorption of high-frequency power by using graphene films

Lin, G. S., Chen, L. S. & Houng, M., 2018 Oct 1, Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. Lam, A. D. K-T., Prior, S. D. & Meen, T-H. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 87-89 3 p. 8479120

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Graphene
Screen printing
Microstrip lines
Sheet resistance
Communication

A comprehensive study of polymorphic phase distribution of ferroelectric-dielectrics and interfacial layer effects on negative capacitance FETs for Sub-5 nm node

Tang, Y. T., Su, C. J., Wang, Y. S., Kao, K-H., Wu, T. L., Sung, P. J., Hou, F. J., Wang, C. J., Yeh, M. S., Lee, Y. J., Wu, W. F., Huang, G. W., Shieh, J. M., Yeh, W. K. & Wang, Y-H., 2018 Oct 25, 2018 IEEE Symposium on VLSI Technology, VLSI Technology 2018. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-June. p. 45-46 2 p. 8510696

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hafnium oxides
Ferroelectric films
Ferroelectricity
VLSI circuits
Field effect transistors

A current-mode-logic-based frequency divider with ultra-wideband and octet phases

Tang, S. D., Lin, Y. S., Huang, W. H., Lu, C. L. & Wang, Y-H., 2018 Jan 1, In : Progress In Electromagnetics Research M. 68, p. 89-98 10 p.

Research output: Contribution to journalArticle

Frequency dividing circuits
Computer circuits
Resonant circuits
Emitter coupled logic circuits
Ultra-wideband (UWB)