International Curriculum for Advanced Materials Program

Research Output

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2017

Effect of microstructure on ionic conduction of Composite Electrolytes consisting of doped ceria and carbonates

Fung, K. Z., Ni, C. T., Tsai, S. Y. & Tang, J. Y., 2017 May 30, ECS Transactions. Kawada, T. & Singhal, S. C. (eds.). 1 ed. Electrochemical Society Inc., p. 371-376 6 p. (ECS Transactions; vol. 78, no. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Effect of Stacking Fault Energy on Cold-Rolling Texture and Microstructure of FCC Metals

Kuo, J-C., Hsiao, Z. W. & Chen, H. J., 2017 Mar 22, BIT’s 5th Annual Conference of AnalytiX-2017. Fukuoka, Japan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrochromic device with functions of rapid switching duty cycle and infrared suppression

Chu, C. H., Wu, H. W., Huang, J. L. & Chiu, C. T., 2017 Jul 21, Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017. Meen, T-H., Lam, A. D. K-T. & Prior, S. D. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 349-352 4 p. 7988424. (Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Improved electrical performance of organic thin-film transistors with modified high-K dielectrics

Wu, F. C., Yeh, B. L., Chou, T. H., Chen, J. S., Tsai, M. R., Cheng, H. L. & Chou, W. Y., 2017 Aug 8, AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 183-186 4 p. 8006115. (AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

In situ synchrotron X-ray diffraction study on the rehydrogenation behavior of MgH2 -LiAlH4 composites

Lin, I. C. & Tsai, W. T., 2017 Jul 21, Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017. Meen, T-H., Lam, A. D. K-T. & Prior, S. D. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 1918-1921 4 p. 7988326. (Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Light-bias interaction of zinc-Tin oxide (ZTO) thin film transistor for charge-Trapping memory application

Chen, J-S., Li, J. T., Liu, L. C., Ke, P. H. & Jeng, J. S., 2017 Aug 8, AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 62-65 4 p. 8006077. (AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microstructure and Deformation Characteristics of MnS in 1215MS Steel at 1050°C

Huang, F. Y., Su, Y. H. F. & Kuo, J-C., 2017 May 29, International Conference on Mining, Material, and Metallurgical Engineering (ICMMME). Tokyo, Japan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Niu, X. & Lin, K. L., 2017 Sep 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 80-88 9 p. 8046412. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2018

Application of Electron Channeling Contrast Image on Analysis of Dislocation Structures Induced by Indentation in Nickel Single Crystal

Huang, F. Y. & Kuo, J-C., 2018 Sep 9, 19th International Microscopy Congress 2018 (IMC19). Sydney, Australia

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of micro-plasma parameters to different kind of solutions for biomedical applications

Hien, N. T. M., Linh, H. Q., Thuy, N. N. S. & Liao, J-D., 2018 Jan 1, 6th International Conference on the Development of Biomedical Engineering in Vietnam, BME6. Vo Van, T., Nguyen Le, T. A. & Nguyen Duc, T. (eds.). Springer Verlag, p. 259-262 4 p. (IFMBE Proceedings; vol. 63).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of process parameters on dimension of single-track ss316l deposited by direct energy deposition

Chen, Y. T. & Kuo, J-C., 2018 Aug 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Improved contact lens injection molding production by 3D printed conformal cooling channels

Lin, Y. F., Wu, J. R., Liu, B. H., Wei, W. C. J., Wang, A. B. & Luo, R. C., 2018 Feb 1, SII 2017 - 2017 IEEE/SICE International Symposium on System Integration. Institute of Electrical and Electronics Engineers Inc., p. 89-94 6 p. (SII 2017 - 2017 IEEE/SICE International Symposium on System Integration; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Texture simulation of cold-rolled F.C.C. metals by using taylor model

Hsiao, S. C. & Kuo, J-C., 2018 Aug 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T. & Lin, K. L., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 226-229 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2019

Adaptive sliding mode control for synchronization of unified hyperchaotic systems

Li, W. L., Liang, W. L. & Chang, K. M., 2019 Aug, 2019 24th International Conference on Methods and Models in Automation and Robotics, MMAR 2019. Institute of Electrical and Electronics Engineers Inc., p. 93-98 6 p. 8864640. (2019 24th International Conference on Methods and Models in Automation and Robotics, MMAR 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution