International Curriculum for Advanced Materials Program

Research Output

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Nucleation and growth of epitaxial silicide in nanowire of silicon

Chou, Y. C., Lu, K. C. & Tu, K. N., 2010 May 5, INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings. p. 22-23 2 p. 5424463. (INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

On strain-induced grain growth using modified Monte Carlo method and digital image correlation technique

Lin, W. G. & Kuo, J. C., 2007 Jan 1, Recrystallization and Grain Growth III - Proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX and GG III. PART 2 ed. Trans Tech Publications Ltd, p. 1121-1126 6 p. (Materials Science Forum; vol. 558-559, no. PART 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

On the Passive Role of Grain Boundaries in Deformation Processing

Kuo, J-C. & Chen, D., 2006 Jul 17, 12th International Symposium Plasticity. Halifax, Nova Scotia, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Optimization of micro-plasma parameters for wound healing

Hien, N. T. M., Linh, H. Q. & Liao, J-D., 2016 Dec 12, BME-HUST 2016 - 3rd International Conference on Biomedical Engineering. Institute of Electrical and Electronics Engineers Inc., p. 146-149 4 p. 7782095. (BME-HUST 2016 - 3rd International Conference on Biomedical Engineering).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Oxidation of metallic Mn thin films prepared in butyimethylpyrrolidinium bis(trifluoromethyisuifony)imide ionic liquid and the pseudo-capacitive performance of the anodized oxide electrodes

Chang, J. K., Huang, C. H., Tsai, W. T., Sun, I. W. & Chen, P. Y., 2008 Dec 22, ECS Transactions - Electrochemistry of Novel Electrode Materials for Energy Conversion and Storage. 25 ed. p. 165-174 10 p. (ECS Transactions; vol. 6, no. 25).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Phase transformation of Cu@Ag core-shell nanoparticles upon heating

Tsai, C. H., Chen, S. Y., Song, J. M., Chen, I-G. & Lee, H. Y., 2012 Dec 1, 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012. 6523432. (2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phase transformation of metallic nanoparticle deposits for the electrodes of flexible electronics

Kao, T. H., Song, J. M., Wang, J. Y. & Chen, I-G., 2010 Dec 1, 2010 IEEE CPMT Symposium Japan, ICSJ10. 5680473. (2010 IEEE CPMT Symposium Japan, ICSJ10).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Physical method to shape a nano-structured Au substrate for surface enhanced Raman scattering

Lin, Y. Y., Chu, Y. H. & Liao, J. D., 2010 Dec 14, XXII International Conference on Raman Spectroscopy, ICORS 2010. p. 923-924 2 p. (AIP Conference Proceedings; vol. 1267).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Preparation and characterization of cubic and rod-shapedindium tin oxide powdersusing thehydrothermal process

Hsu, K. C., Liao, J. D., Xie, Z. Z. & Fu, Y. S., 2014 Jan 1, Applied Science and Precision Engineering Innovation. p. 64-68 5 p. (Applied Mechanics and Materials; vol. 479-480).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Preparation and characterization of cubic and rod-shaped indium tin oxide powders using the hydrothermal process

Hsu, K. C., Liao, J-D., Xie, Z. Z. & Fu, Y. S., 2013 Mar 19, Information, Communication and Engineering. p. 430-434 5 p. (Applied Mechanics and Materials; vol. 311).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Preparation and hydrogen storage performance of Pd nanoparticles decorated carbon nanotubes

Chang, J. K., Chen, C. Y. & Tsai, W. T., 2009 Dec 1, Hydrogen Production, Transport, and Storage 3. 10 ed. p. 33-40 8 p. (ECS Transactions; vol. 19, no. 10).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Preparation and properties of a high temperature, flexible and colorless ITO coated polyimide substrate

Li, T. L. & Hsu, S. L. C., 2007 Dec 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 354-355 2 p. 4456250. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Preparation of highly concentrated and stable suspensions of silver nanoparticles by an organic base catalyzed reduction reaction

Wu, R. T. & Hsu, S. L. C., 2007 Dec 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 196-197 2 p. 4456171. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Preparation of perovskite conductive LaNiO3 films by sol-gel techniques

Lai, P. Y. & Chen, J. S., 2006 Jan 1, Science and Technology of Nonvolatile Memories. Materials Research Society, p. 31-36 6 p. (Materials Research Society Symposium Proceedings; vol. 933).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rapid SNP Genotyping of TMIGD1 Gene in Tsaiya Duck Using Lateral-flow Immunoassay with Primer Extension and Nano-gold

Lin, C. W., Kuo, J-C. & Huang, H. L., 2016 Jul 25, 10th Asia-Pacific Biotech Congress. Bangkok, Thailand

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Recent CD AFM probe developments for sub-45 nm technology nodes

Liu, B. H., Osborne, J. R., Dahlen, G. A., Greschner, J., Bayer, T., Kalt, S. & Fritz, G., 2008 Dec 1, Metrology, Inspection, and Process Control for Microlithography XXII. 69222J. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6922).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Recrystallization of Ag and Ag-La alloy wire in wire bonding process

Hsueh, H. W., Hung, F-Y. & Lui, T-S., 2013 Oct 29, Materials and Measurement. p. 151-157 7 p. (Advanced Materials Research; vol. 804).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Removed organic solderability preservative (OSPs) by Ar/O2 microwave plasma to improve solder joint in thermal compression flip chip bonding

Peng, J. W., Chen, Y. S., Chen, Y., Liang, J. L., Lin, K. L. & Lee, Y. L., 2014 Sep 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 1584-1589 6 p. 689750. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Room-temperature diamond seeding and microwave plasma enhanced CVD growth of nanodiamond with a tungsten interfacial layer

Chu, Y. C., Jiang, G., Chang, C., Ting, J. M., Lee, H. L. & Tzeng, Y., 2011 Dec 1, 2011 11th IEEE International Conference on Nanotechnology, NANO 2011. p. 1367-1370 4 p. 6144477. (Proceedings of the IEEE Conference on Nanotechnology).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Self-assembled alternating nano-scaled layers

Wu, W. Y. & Ting, J. M., 2004 Jan 1, 2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004. Nano Science and Technology Institute, p. 448-451 4 p. (2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004; vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Self-assembled Zn/ZnO dots on silicon by RF magnetron sputter

Liang, Y. H. & Liu, C. P., 2007 Dec 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 158-159 2 p. 4456152. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Spark plasma sintering of PbTe thermoelectric bulk materials with small grains

Kuo, C. H., Hwang, C-S., Ku, J. R., Jeng, M. S. & Tsau, F. H., 2008 Aug 20, 2008 Proceedings of the ASME Micro/Nanoscale Heat Transfer International Conference, MNHT 2008. p. 1191-1193 3 p. (2008 Proceedings of the ASME Micro/Nanoscale Heat Transfer International Conference, MNHT 2008; vol. PART B).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Squeeze film characteristics of circular contacts at constant squeeze velocity motion with non-newtonian lubricants

Chu, L. M., Li, W. L. & Hsu, H. C., 2011 Jul 4, Advanced Research on Mechanical Engineering, Industry and Manufacturing Engineering. p. 147-151 5 p. (Applied Mechanics and Materials; vol. 63-64).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stability of Bi2O3-based ionic conductor and its application on composite cathode

Tsai, S. Y., Fung, K. Z., Ni, C. T. & Chang, Y. F., 2015 Jan 1, Solid Oxide Fuel Cells 14, SOFC 2015. Singhal, S. C. & Eguchi, K. (eds.). 1 ed. Electrochemical Society Inc., p. 867-874 8 p. (ECS Transactions; vol. 68, no. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Stable Pt/Ge/Au ohmic contact to n-GaAs with a Ta-Si-N barrier

Chen, J. S., Kolawa, E., Ruiz, R. P. & Nicolet, M. A., 1993 Dec 1, III-V Electronic and Photonic Device Fabrication and Performance. Jones, K. S., Pearton, S. J. & Kanber, H. (eds.). Publ by Materials Research Society, p. 255-260 6 p. (Materials Research Society Symposium Proceedings; vol. 300).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Static analysis of spiral-grooved gas film face seal in microsystem

Nguyen, C. C., Jao, H. C. & Li, W. L., 2015 Jan 1, 2015 IFToMM World Congress Proceedings, IFToMM 2015. National Taiwan University, (2015 IFToMM World Congress Proceedings, IFToMM 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Statistical analysis on bonding strength and failure mechanism of plasma-sprayed HA coating with reinforced intermediate layers

Yang, C. W. & Lui, T. S., 2008 Jan 1, Multi-functional Materials and Structures - International Conference on Multifunctional Materials and Structures. Trans Tech Publications, p. 1007-1010 4 p. (Advanced Materials Research; vol. 47-50 PART 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Strain Distribution Analysis Using Digital- Image-Correlation Techniques

Tung, S. H., Kuo, J-C. & Shih, M. H., 2005 Dec 19, The Eighteenth KKCNN Symposium on Civil Engineering-NTU 29. Kaohsiung, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Structures and opto-electrical characteristics of ZITO thin films

Hung, F. Y., Chen, K. J., Chang, S. J., Young, S. J. & Hu, Z. S., 2009 Dec 1, 2009 International Semiconductor Device Research Symposium, ISDRS '09. 5378181. (2009 International Semiconductor Device Research Symposium, ISDRS '09).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Study of AZO thin films under different annealing atmosphere on structural, optical and electrical properties by RF magnetron sputtering

Lin, Y. M., Chu, C. H., Wu, H. W. & Huang, J-L., 2015 Jan 1, IMECS 2015 - International MultiConference of Engineers and Computer Scientists 2015. Feng, D. D., Ao, S. I., Douglas, C., Ao, S. I., Douglas, C., Lee, J-A., Ao, S. I. & Castillo, O. (eds.). Newswood Limited, p. 807-810 4 p. (Lecture Notes in Engineering and Computer Science; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Synthesis of GaN nanowires using gold nanoparticles on plasma-activated silicon substrate

Lee, K. H., Lo, P. L. & Chen, I. G., 2009 Dec 1, Nanoscale One-Dimensional Electronic and Photonic Devices 3, NODEPD 3. 10 ed. p. 79-82 4 p. (ECS Transactions; vol. 25, no. 10).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

TEM validation of CD AFM image reconstruction: Part II

Dahlen, G. A., Liu, H. C., Osborn, M., Osborne, J. R., Tracy, B. & Del Rosario, A., 2008 Dec 1, Metrology, Inspection, and Process Control for Microlithography XXII. 69220K. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6922).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

TEM validation of CD AFM image reconstruction

Dahlen, G. A., Mininni, L., Osborn, M., Liu, B. H., Osborne, J. R., Tracy, B. & Del Rosario, A., 2007 Oct 15, Metrology, Inspection, and Process Control for Microlithography XXI. PART 1 ed. 651818. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6518, no. PART 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Tensile mechanical properties and brittle effect of austempered Cr-Mo alloy steel

Chen, C. Y., Hung, F. Y., Lui, T. S. & Chen, L. H., 2013 Jan 1, 4th International Symposium on High-Temperature Metallurgical Processing - Held During the TMS 2013 Annual Meeting and Exhibition. Minerals, Metals and Materials Society, p. 299-306 8 p. (TMS Annual Meeting).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tensile mechanical properties and the ductile-to-brittle transition behavior of Mg-Li-Ai-Zn alloy

Yang, C. W., Lui, T-S. & Chen, L. H., 2010 May 21, Magnesium Technology 2010 - Held During TMS 2010 Annual Meeting and Exhibition. p. 455-459 5 p. (Magnesium Technology).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Tensile properties of a friction stir processed Al-Cu 2218 alloy at elevated temperatures and related microstructural characteristics

Chen, S. T., Lui, T-S. & Chen, L. H., 2010 May 21, TMS 2010 - 139th Annual Meeting and Exhibition - Supplemental Proceedings. p. 129-138 10 p. (TMS Annual Meeting; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Texture simulation of cold-rolled F.C.C. metals by using taylor model

Hsiao, S. C. & Kuo, J-C., 2018 Aug 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The application of a digital image correlation method for crack observation

Shih, M. H., Tung, S. H., Kuo, J-C. & Sung, W. P., 2006 Jan 1, Proceedings of the 8th International Conference on Computational Structures Technology, CST 2006. Civil-Comp Press, Vol. 83.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Yang, P. F., Huang, L., Hung, C. P., Uegaki, S. & Lin, K-L., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 497-501 5 p. 7486877. (2016 International Conference on Electronics Packaging, ICEP 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Chen, Y. F., Yang, P. F., Huang, L. & Lin, K-L., 2014 Sep 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 419-424 6 p. 6897319. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

The crystallization characteristics and photoluminescence properties of ZnO/Ag nanoflower arrays

Hu, Z. S., Hung, F. Y., Chang, S. J. & Chen, K. J., 2012 Nov 19, Technical Digest - 25th International Vacuum Nanoelectronics Conference, IVNC 2012Om. p. 176-180 5 p. 6316893. (Technical Digest - 25th International Vacuum Nanoelectronics Conference, IVNC 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The effects of annealing and Si content on the charge-discharge characteristics of Al-Si thin film with pre-deposited Al layer

Wu, C. H., Hung, F-Y., Lui, T-S. & Chen, L. H., 2011 Jul 26, TMS 2011 - 140th Annual Meeting and Exhibition, Supplemental Proceedings. p. 127-134 8 p. (TMS Annual Meeting; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The electromigration and thermomigration behaviors of Pb-free flip chip Sn-3Ag-0.5Cu solder bumps

Lin, K. L. & Kuo, S. M., 2006 Dec 22, Proceedings - IEEE 56th Electronic Components and Technology Conference. p. 667-672 6 p. 1645722. (Proceedings - Electronic Components and Technology Conference; vol. 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

The electromigration investigation on the newly developed Pb-free Sn-Zn-Ag-Al-Ga solder ball interconnect

Lin, K. L. & Lin, G. P., 2007 Oct 22, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. p. 1467-1471 5 p. 4250075. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T. & Lin, K. L., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 226-229 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

The growth and segregation of intermetallic compounds in the bulk of flip chip Sn2.4Ag solder joint under electrical current stressing

Wang, W. C., Lin, K-L., Chiu, Y. T. & Lai, Y. S., 2013 Sep 9, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. p. 1600-1605 6 p. 6575785. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing

Chen, C. W., Lin, K-L., Chiu, Y. T., Kao, C. L., Lee, C. W. & Yang, P. F., 2014 Jan 30, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., p. 518-521 4 p. 7028325. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The Influence of Grain Boundary and Triple Junction on Plastic Deformation

Liao, Y. Y. & Kuo, J-C., 2008 Jan 3, 14th International Symposium Plasticity. Hawaii, USA.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

Yeh, F. J., Chiu, T. C. & Lin, K-L., 2012, 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 6507860

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

The introduction of MEMS packaging technology

Hsieh, C. T., Ting, J-M., Yang, C. & Chung, C-K., 2002 Jan 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 300-306 7 p. 1188855. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)