International Curriculum for Advanced Materials Program

Research Output

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Editorial
2015

Macroscopic/Mesoscopic Computational Materials Science Modeling and Engineering

Lu, J. M., Ting, J. M., Li, M. & Kogan, E., 2015 Jan 1, In : Mathematical Problems in Engineering. 2015, 319626.

Research output: Contribution to journalEditorial

2014

Corrosion prevention and environment protection of materials for a new era

Huang, H. H., Yeh, T. K., Kuo, J-C., Wang, C. J. & Tsai, W-T., 2014 Jan 1, In : Corrosion Engineering Science and Technology. 49, 2, 1 p.

Research output: Contribution to journalEditorial

1 Citation (Scopus)

Preface: The biennial TACT international thin films conference (TACT 2013)

Lee, J. W., He, J. L., Chang, K. S., Chang, Y. Y., Greczyński, G., Huang, H. H., Kuo, Y. L., Shih, S. J., Wang, C. H. & Wu, F. B., 2014 Jan 1, In : Surface and Coatings Technology. 259, PB, p. 113-114 2 p.

Research output: Contribution to journalEditorial

2013

Preface (TACT 2011 Special Issue)

Huang, J. L., Ting, J. M., Hsieh, J. H., Feng, Z. C., Chu, J. P., Park, H. H., Liu, C. P. & Kusano, E., 2013 Feb 1, In : Thin Solid Films. 529, 1 p.

Research output: Contribution to journalEditorial

The Biennial Taiwan Association for Coating and Thin Film Technology (TACT)

Ting, J. M., Huang, J. L., Lu, F. H., Lee, J. W., Wong, M. S., Park, H. H., Veprek, S., Okamoto, K., Huang, J. H. & Yamamoto, K., 2013 Sep 25, In : Surface and Coatings Technology. 231, 1 p.

Research output: Contribution to journalEditorial

2010

Foreword: Pb-free solders and emerging interconnect and packaging technologies

Lin, K-L., Kang, S. K., Duh, J. G., Lee, A., Bieler, T., Turbini, L., Sidhu, R., Guo, F. & Anderson, I., 2010 Dec 1, In : Journal of Electronic Materials. 39, 12, 1 p.

Research output: Contribution to journalEditorial

3 Citations (Scopus)
2008

Cluster issue on microplasmas

Chao, C. C., Liao, J. D. & Chang, J. E., 2008 Oct 7, In : Journal of Physics D: Applied Physics. 41, 19, 190301.

Research output: Contribution to journalEditorial

2 Citations (Scopus)
2006

Journal of Electronic Materials: Foreword

Chawla, N., Chada, S., Kang, S. K., Kao, C. R., Lin, K-L., Lucas, J. & Turbini, L., 2006 Dec 1, In : Journal of Electronic Materials. 35, 12, 1 p.

Research output: Contribution to journalEditorial

2 Citations (Scopus)