Master Degree Program on Nano-Integrated-Circuit Engineering

Organization profile

Organisation profile

The fields of research in the Nano-Integrated Circuit Engineering Program of National Cheng Kung University are focused on 1) nanoelectronic device design and technology and 2) sensors. As semiconductor devices continue to shrink, mainly for cost reduction in industry, many issues have continuously surfaced. Besides manufacturing challenges, ever increasing transistor density and computation have raised the concern on power consumption. To expedite further nanoelectronic development, especially for growing mobile market, low power electronics are on demand, which requires novel devices to fulfill the low power strategy while the performance is not compromised. This Nano-IC Program has developed several novel green electronic devices. Another field of sensors has just been started. We have worked on novel materials including promising 2D materials for photo detectors. Other experiments of nanoelectronic devices for general sensor applications are under progress.

Fingerprint Dive into the research topics where Master Degree Program on Nano-Integrated-Circuit Engineering is active. These topic labels come from the works of this organisation's members. Together they form a unique fingerprint.

High electron mobility transistors Engineering & Materials Science
Light emitting diodes Engineering & Materials Science
Metals Chemical Compounds
Photodetectors Engineering & Materials Science
light emitting diodes Physics & Astronomy
Substrates Engineering & Materials Science
Temperature Engineering & Materials Science
Electric potential Engineering & Materials Science

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Projects 1995 2018

Research Output 1980 2019

A high-performance Pd nanoparticle (NP)/WO3 thin-film-based hydrogen sensor

Lee, C. & Liu, W-C., 2019 Jul 1, In : IEEE Electron Device Letters. 40, 7, p. 1194-1197 4 p., 8709960.

Research output: Contribution to journalArticle

Hydrogen
Nanoparticles
Thin films
Vacuum evaporation
Thermal evaporation

Air-stable gelatin composite memory devices on a paper substrate

Chang, Y. C., Lee, C. J., Wang, L. W. & Wang, Y-H., 2019 Feb 1, In : Organic Electronics. 65, p. 77-81 5 p.

Research output: Contribution to journalArticle

gelatins
Gelatin
Data storage equipment
composite materials
air
1 Citation (Scopus)

Aluminum-nanosphere-stacked MgNiO metal-semiconductor-metal ultraviolet photodetectors

Lee, H-Y., Lin, C. W. & Lee, C-T., 2019 Jan 30, In : Journal of Alloys and Compounds. 773, p. 210-216 7 p.

Research output: Contribution to journalArticle

Nanospheres
Photodetectors
Aluminum
Metals
Semiconductor materials

Student theses

Analysis of the Multi-Vt FD-SOI MOSFETs and SRAM Application

Author: 政邑, 陳., 2018 Jan 16

Supervisor: Chiang, M. (Supervisor)

Student thesis: Master's Thesis

Characterization and Analysis of Oxide Interface Charge for FinFETs

Author: 如諒, 賴., 2017 Jun 21

Supervisor: Chiang, M. (Supervisor)

Student thesis: Master's Thesis

Characterization and Modeling of Via Resistance for FinFETs

Author: 博任, 楊., 2018 Feb 7

Supervisor: Chiang, M. (Supervisor)

Student thesis: Master's Thesis