Tainan Hydraulics Laboratory

Organization profile

Organisation profile

Tainan Hydraulics Laboratory (THL) was founded by a joint venture between the National Hydraulic Research Institute, Ministry of Economic Affairs (MOEA) and the Taiwan Provincial College of Engineer (predecessor of National Cheng Kung University (NCKU)) in 1950. b01 Water Resources Bureau, the Water Conservancy Agency and the Taipei Water Resource Specific Committee were merged into one new unit named Water Resources Agency (MRA), MOEA on March 28, 2002, THL was affiliated to MRA accordingly.

Fingerprint Dive into the research topics where Tainan Hydraulics Laboratory is active. These topic labels come from the works of this organisation's members. Together they form a unique fingerprint.

Taiwan Agriculture & Biology
Decapoda Agriculture & Biology
Solitons Engineering & Materials Science
Water Engineering & Materials Science
sodium-potassium-exchanging ATPase Agriculture & Biology
shrimp Agriculture & Biology
Beaches Engineering & Materials Science
salinity Agriculture & Biology

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Profiles

No photo of Yin Chang

Yin Chang

Person: Academic

20102014
No photo of Ping Chen

Ping Chen

Person: Academic

20122015
No photo of Chia-Yan Cheng

Chia-Yan Cheng

Person: Academic

20072015

Research Output 1993 2019

Adaptive process control of the changeover point for injection molding process

Chen, Y. S., Wu, K. T., Tsai, M. H., Hwang, S. J., Lee, H. H., Peng, H. S. & Chu, H. Y., 2019 Jan 1, (Accepted/In press) In : Journal of Low Frequency Noise Vibration and Active Control.

Research output: Contribution to journal › Article

Open Access
injection molding
Injection molding
Process control
Viscosity
viscosity

Applying a 3-D image measurement technique exploring the deformation of net cage under wave–current interaction

Chen, Y. Y., Yang, B-D. & Chen, Y. T., 2019 Feb 1, In : Ocean Engineering. 173, p. 823-834 12 p.

Research output: Contribution to journal › Article

Mooring
Shielding
Imaging systems
Numerical models

Effects of substrate structure on the warpage of flip chip IC packages

Lee, Y. S., Lin, P. Y., Wu, K. T., Lee, H. H. & Hwang, S. J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 66-70 5 p. 8625738. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Substrates
Thermal effects
Thermal expansion
Electromagnetic compatibility
Encapsulation