• 490 Citations
  • 6 h-Index
20122019

Research output per year

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Personal profile

Education

  • 2015 Ph.D., Dept. of ECE, Texas A&M University, USA
  • 2005 M.S., Dept. of EE, National Cheng Kung University
  • 2003 B.S., Dept. of EE, Nationcal Cheng Kung University

Experience

  • 2018/08 ~ present Assistant Professor, National Cheng Kung University
  • 2017/01 ~ 2018/08 Postdoctoral Research Fellow, IMEC, Belgium (associate with KU Leuven)
  • 2015/07 ~ 2016/05 Research, Design, and Development Engineer Ш, Baker Hughes Incorporated, Houston, Texas, USA
  • 2010/08 ~ 2015/07 Doctoral Research Assistant, Department of ECE, TAMU, College Station, Texas, USA
  • 2010/01 ~ 2010/07 Research Assistant, Department of Computer Science, NCKU, Tainan, Taiwan
  • 2005/10 ~ 2010/01 Research and Development Engineer, Industrial Technology Research Institute, Tainan, Taiwan

Research Interests

  • Design, simulation, and characterization of MEMS acoustic devices eg. pMUT, MEMS acoustic mirror, and photoacoucstic transducers
  • Design, simulation, and characterization of both acoustic and mechanical properties for membrane type actuators and sensors
  • Theory and implementation of acoustic tomography with 2D ultrasound transducer array for nondestructive testing system, signal processing and 3D imaging reconstruction
  • Mechanism of ultrasound neuron stimulation through multi-index neuron stimulation monitoring system

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Projects

Research Output

  • 490 Citations
  • 6 h-Index
  • 18 Conference contribution
  • 9 Article

Characterization of polymer-based piezoelectric micromachined ultrasound transducers for short-range gesture recognition applications

Gijsenbergh, P., Halbach, A., Jeong, Y., Torri, G. B., Billen, M., Demi, L., Huang, C-H., Cheyns, D., Rottenberg, X. & Rochus, V., 2019 May 29, In : Journal of Micromechanics and Microengineering. 29, 7, 074001.

Research output: Contribution to journalArticle

  • 2 Citations (Scopus)

    A Subject-Specific Acoustic Collimator for Multi-Index Ultrasound Neuron Modulation System

    Huang, C. H., Haouari, R., Gao, H., Rochus, V. & Rottenberg, X., 2018 Dec 17, 2018 IEEE International Ultrasonics Symposium, IUS 2018. IEEE Computer Society, 8580081. (IEEE International Ultrasonics Symposium, IUS; vol. 2018-October).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Coupled multiphysics circuital modelling of micro-opto-mechanical pressure sensor systems

    Troia, B., Huang, C. H., Mao, S., Gao, H., Figeys, B., Jansen, R., Rochus, V. & Rottenberg, X., 2018 Jan 1, MOEMS and Miniaturized Systems XVII. Park, Y-H., Zappe, H. & Piyawattanametha, W. (eds.). SPIE, 1054518. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 10545).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)

    Design, modelling, and characterization of display compatible pMUT device

    Huang, C. H., Gao, H., Torri, G. B., Mao, S., Jeong, Y., Cheyns, D., Rochus, V. & Rottenberg, X., 2018 May 30, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Institute of Electrical and Electronics Engineers Inc., p. 1-4 4 p. (2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2 Citations (Scopus)

    Design and test of a 3D printed acoustic fresnel lens

    Torri, G. B., Signorelli, M., Huang, C. H., Haouari, R., Mao, S. & XRottenberg, X., 2018 May 30, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Institute of Electrical and Electronics Engineers Inc., p. 1-4 4 p. (2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution