Research output per year
Research output per year
Personal profile
Education
- 國立清華大學電子工程 博士
- 國立成功大學材料工程 碩士
- 私立中原大學機械工程 學士
Experience
- 2020/02 - Associate Professor, Department of Mechanical Engineering, National Cheng Kung University, Taiwan.
- 2010/2/1 - 2020/01/31 Professor, Department of Mechanical Engineering, Chung Yuan Christian University, Taiwan.
- 2006/10 - 2009/01 Furnace Department RD manager, Powerchip Semiconductor Company.
- 2004/09 - 2006/09 Researcher, Electronic & Optoelectronic system research Laboratories , Industrial Technology Research Institute.
- 1995/09 - 2002/08 Integration technical manager, BEOL Technology Division, Taiwan Semiconductor Manufacturing Company.
Research Interests
- VLSI process integration
- nano material application
- metal corrosion analysis
- solar cell and hydrogen generation
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Microstructure of ternary Sn-Bi-xCu alloy on mechanical properties, current endurance and corrosion morphology via cycling corrosion test
Ho, C. Y., Chi, H. Y. & Wen Su, Y., 2025 Jan 5, In: Journal of Alloys and Compounds. 1010, 176767.Research output: Contribution to journal › Article › peer-review
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Experimental demonstration of the electrostatic induction and contact electrification for the ventilator-like of rotary nanogeneration
Ho, C. Y. & Tsai, C. Y., 2024 May 1, In: Sensors and Actuators A: Physical. 370, 115201.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
Exploring the energy harvest of droplet flow over inducted film for the rainy-shiny solar panel application
Ho, C. Y., Su, C. Y. & Hu, W. Z., 2024 Mar, In: Materials Today Communications. 38, 107609.Research output: Contribution to journal › Article › peer-review
2 Citations (Scopus) -
Microstructures of ternary Sn-Bi-xZn alloys on mechanical and electrochemical properties analysis for connection packaging
Ho, C. Y., Chou, H. W., Chi, H. Y. & Liao, G. H., 2024 Oct 15, In: Journal of Alloys and Compounds. 1002, 175288.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
Analysis of Panel Warping for multilayer RDL Process and Extraction of Dielectric Properties of Photosensitive Polyimide on Fan-out Panel Level Packaging
Ho, C. Y., Po-Yang & Hung, 2023, IMPACT 2023 - International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 92-94 3 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution