• 321 Citations
  • 10 h-Index
19952019
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Personal profile

Education

  • 1989 PhD, Department of Civil Engineering, University of Iowa

Research Interests

  • Finite Element Simulations
  • Systems Biology
  • Taguchi Methods

Experience

  • 1990/08 ~ present Associate Professor, Department of Engineering Science, National Cheng Kung University

Fingerprint Dive into the research topics where Huei-Huang Lee is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 2 Similar Profiles
Sheet molding compounds Engineering & Materials Science
Encapsulation Engineering & Materials Science
Molding Engineering & Materials Science
Packaging Engineering & Materials Science
Injection molding Engineering & Materials Science
Taguchi methods Engineering & Materials Science
Temperature Engineering & Materials Science
Adhesion Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Projects 1995 2016

高效率均勻加熱感應加熱熱水器的開發

Lee, H.

15-06-0116-05-31

Project: Research project

CMOS影像感測器薄膜堆疊結構模擬分析與改善

Lee, H.

11-08-0112-07-31

Project: Research project

晶圓接合加工模擬與實驗

Lee, H.

10-08-0111-07-31

Project: Research project

覆晶底部封膠材料基本性質的量測

Lee, H.

08-08-0109-07-31

Project: Research project

Research Output 1996 2019

  • 321 Citations
  • 10 h-Index
  • 30 Article
  • 24 Conference contribution
  • 2 Patent

Adaptive process control of the changeover point for injection molding process

Chen, Y. S., Wu, K. T., Tsai, M. H., Hwang, S. J., Lee, H. H., Peng, H. S. & Chu, H. Y., 2019 Jan 1, (Accepted/In press) In : Journal of Low Frequency Noise Vibration and Active Control.

Research output: Contribution to journalArticle

Open Access
injection molding
Injection molding
Process control
Viscosity
viscosity

Effects of substrate structure on the warpage of flip chip IC packages

Lee, Y. S., Lin, P. Y., Wu, K. T., Lee, H. H. & Hwang, S. J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 66-70 5 p. 8625738. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Substrates
Thermal effects
Thermal expansion
Electromagnetic compatibility
Encapsulation

Observation of fiber orientation in injection molded long-fiber reinforced composites

Aditya, R., Hwang, S-J. & Lee, H-H., 2019 Feb 6, Proceedings of PPS-34: 34th International Conference of the Polymer Processing Society - Conference Papers. Liu, S-J. (ed.). American Institute of Physics Inc., 030029. (AIP Conference Proceedings; vol. 2065).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

fiber orientation
injection
composite materials
fibers
glass fibers
Open Access
Camera lenses
Ultraviolet radiation
Light emitting diodes
Diodes
light emitting diodes

Finite element analysis of multi-level interconnection under cyclic thermomechanical loads

Wu, K. T., Hwang, S. J., Lee, H. H. & Lin, B. Y., 2018 Feb 1, In : Microsystem Technologies. 24, 2, p. 1003-1016 14 p.

Research output: Contribution to journalArticle

Energy release rate
Finite element method
strain energy release rate
Delamination
Strain energy