• 340 Citations
  • 11 h-Index
19952020

Research output per year

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Research Output

  • 340 Citations
  • 11 h-Index
  • 31 Article
  • 27 Conference contribution
  • 2 Patent
2020

Injection molding process control of servo-hydraulic system

Lin, C. Y., Shen, F. C., Wu, K. T., Lee, H. H. & Hwang, S. J., 2020 Jan 1, In : Applied Sciences (Switzerland). 10, 1, 71.

Research output: Contribution to journalArticle

Open Access
2019

Adaptive process control of the changeover point for injection molding process

Chen, Y. S., Wu, K. T., Tsai, M. H., Hwang, S. J., Lee, H. H., Peng, H. S. & Chu, H. Y., 2019 Jan 1, (Accepted/In press) In : Journal of Low Frequency Noise Vibration and Active Control.

Research output: Contribution to journalArticle

Open Access
1 Citation (Scopus)

Effects of substrate structure on the warpage of flip chip IC packages

Lee, Y. S., Lin, P. Y., Wu, K. T., Lee, H. H. & Hwang, S. J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 66-70 5 p. 8625738. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Injection Molding Process Control of Servo-Hydraulic System

Lin, C. Y., Shen, F. C., Wu, K. T., Hwang, S. J. & Lee, H. H., 2019 Oct, 2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019. Meen, T-H. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 242-245 4 p. 8942784. (2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Observation of fiber orientation in injection molded long-fiber reinforced composites

Aditya, R., Hwang, S. J. & Lee, H. H., 2019 Feb 6, Proceedings of PPS-34: 34th International Conference of the Polymer Processing Society - Conference Papers. Liu, S-J. (ed.). American Institute of Physics Inc., 030029. (AIP Conference Proceedings; vol. 2065).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
2018

Finite element analysis of multi-level interconnection under cyclic thermomechanical loads

Wu, K. T., Hwang, S. J., Lee, H. H. & Lin, B. Y., 2018 Feb 1, In : Microsystem Technologies. 24, 2, p. 1003-1016 14 p.

Research output: Contribution to journalArticle

2017
4 Citations (Scopus)

Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Wu, K. T., Hwang, S. J. & Lee, H. H., 2017 Aug 1, In : Journal of Electronic Materials. 46, 8, p. 5094-5106 13 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2016

Design with white light-emitting diodes for an automotive low-beam projector headlamp

Chiang, Y. Y., Hwang, S. J., Lee, H. H., Hwang, D. Y. & Liao, C. C., 2016 Jan 1, In : Sensors and Materials. 28, 9, p. 1035-1042 8 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2 Citations (Scopus)
2014

Study on induction heating coil for uniform mold cavity surface heating

Sung, Y. T., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2014 Feb 14, In : Advances in Mechanical Engineering. 2014, 349078.

Research output: Contribution to journalArticle

4 Citations (Scopus)

Thermal simulation of System in Package (SiP) in soak zone of reflow process

Deng, S. S., Hwang, S. J. & Lee, H. H., 2014 Jan 1, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 238-241 4 p. 7048402. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2013

Design and development of oral appliance for obstructive sleep apnea

Lai, Y. B., Huang, D. Y., Hwang, S-J., Lee, H-H. & Chang, Y. S., 2013 Feb 20, Innovation for Applied Science and Technology. p. 1540-1546 7 p. (Applied Mechanics and Materials; vol. 284-287).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Molded underfill for flip chip package

Chen, Y. K., Wu, G. T., Hwang, S-J., Lee, H-H. & Hwang, D. Y., 2013 Dec 1, 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013 - Proceedings. p. 310-314 5 p. 6706663. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
41 Citations (Scopus)
2012

Design of induction heating module for uniform cavity surface heating

Sung, Y. T., Lin, Y. N., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2012 Jan 1, 70th Annual Technical Conference of the Society of Plastics Engineers 2012, ANTEC 2012. Society of Plastics Engineers, p. 1427-1436 10 p. (Annual Technical Conference - ANTEC, Conference Proceedings; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Development of liquid spray process in a rapid prototyping machine

Huang, C. H., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2012 Nov 26, Advanced Manufacturing Focusing on Multi-Disciplinary Technologies. p. 365-375 11 p. (Advanced Materials Research; vol. 579).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2011

Design of induction heating module for uniform cavity surface heating

Sung, Y. T., Lin, Y. N., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2011 Jan 1, 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011. Society of Plastics Engineers, p. 2054-2057 4 p. (Annual Technical Conference - ANTEC, Conference Proceedings; vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Development of an apparatus for measuring normal adhesion force during TPU injection molding process

Chen, J. Y., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2011 Aug 23, 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011. p. 1512-1517 6 p. (Annual Technical Conference - ANTEC, Conference Proceedings; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling of viscoelastic behavior of an epoxy molding compound during and after curing

Lin, Y. J., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2011 Nov 1, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 1, 11, p. 1755-1760 6 p., 6036160.

Research output: Contribution to journalArticle

12 Citations (Scopus)

On mold corner effects of EMC adhesion for IC encapsulation process

Yeh, C. H., Deng, C. H., Lee, H. H., Hwang, S. J. & Huang, D. Y., 2011 Dec 1, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. p. 280-283 4 p. 6117263. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Volume shrinkage characterization of underfill materials

Deng, S. S., Ho, C. Y., Lee, H-H., Hwang, S-J. & Hwang, D. Y., 2011 Dec 1, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 1, 1, p. 76-82 7 p., 5674109.

Research output: Contribution to journalArticle

3 Citations (Scopus)
2010

Copper plating process for through silicon via with high aspect ratio in advanced packaging

Huang, Y. H., Lee, H-H., Hwang, S-J. & Huang, D. Y., 2010 Jun 25, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 9-14 6 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Warpage simulations with P-V-T-C equation and experiments of fan-out wafer level package after encapsulation process

Deng, S. S., Hwang, S-J., Lee, H-H., Huang, D. Y. & Shen, G. S., 2010 Dec 1, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699590. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2009

Effects of defrosting period on mold adhesion force of epoxy molding compound

Chen, H. Z., Lee, W. H., Lee, H-H., Huang, D. Y., Chang, S. J. & Hwang, S-J., 2009 Mar 1, In : Asia-Pacific Journal of Chemical Engineering. 4, 2, p. 161-168 8 p.

Research output: Contribution to journalArticle

Integrated microfluidic system for electrochemical sensing of urinary proteins

Liu, C. Y., Rick, J., Chou, T. C., Lee, H-H. & Lee, G. B., 2009 Jan 1, In : Biomedical Microdevices. 11, 1, p. 201-211 11 p.

Research output: Contribution to journalArticle

11 Citations (Scopus)

Simulation and analysis of fiber orientation in injection molded bipolar plates for fuel cell

Lin, Y. J., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2009, 67th Annual Technical Conference of the Society of Plastics Engineers 2009, ANTEC 2009. Vol. 4. p. 2092-2097 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Simulation and experiments of fan-out wafer level package during encapsulation

Deng, S. S., Hwang, S-J., Lee, H-H., Huang, D. Y., Chen, Y. R. & Shen, G. S., 2009 Dec 1, IMPACT Conference 2009 International 3D IC Conference - Proceedings. p. 48-51 4 p. 5382306. (IMPACT Conference 2009 International 3D IC Conference - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2008

Application of dynamic masking on rapid prototyping

Chen, C. N., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2008, Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture. Trans Tech Publications Ltd, Vol. 594. p. 261-272 12 p. (Materials Science Forum; vol. 594).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Post-mold cure process simulation of IC packaging

Shue, C. H., Hwang, S. J., Lee, H. H., Huang, D. Y. & Lee, Y. J., 2008 Dec 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 106-110 5 p. 4784241. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
1 Citation (Scopus)
2007

Circulating polymerase chain reaction chips utilizing multiple-membrane activation

Wang, C. H., Chen, Y. Y., Liao, C. S., Hsieh, T. M., Luo, C. H., Wu, J. J., Lee, H. H. & Lee, G. B., 2007 Feb 1, In : Journal of Micromechanics and Microengineering. 17, 2, p. 367-375 9 p., 024.

Research output: Contribution to journalArticle

17 Citations (Scopus)

Control of hot runner type micro injection molding module

Yang, C. C., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2007 Dec 1, Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON. p. 2928-2933 6 p. 4460054. (IECON Proceedings (Industrial Electronics Conference)).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Development of an external-type microinjection molding module for thermoplastic polymer

Chang, P. C., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2007 Apr 12, In : Journal of Materials Processing Technology. 184, 1-3, p. 163-172 10 p.

Research output: Contribution to journalArticle

21 Citations (Scopus)

Mold adhesion force measurement

Lee, H-H., Hwang, S-J., Huang, D. Y. & Lin, Y. J., 2007 Dec 1, 2007 Proceedings of the ASME InterPack Conference, IPACK 2007. p. 51-58 8 p. (2007 Proceedings of the ASME InterPack Conference, IPACK 2007; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Prediction of flow induced lead deflection of leadframe assemblies in plastic encapsulation during molding

Chen, J. Y., Teng, S. Y., Hwang, S. J., Lee, H. H., Huang, D. Y., Lin, Y. J., Chen, S., Shen, G. S. & Wu, L., 2007 Dec 1, Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT. 4441395. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The development of paddle shift analysis for IC packaging processing

Chen, S., Shen, G. S., Chen, J. Y., Teng, S. Y., Hwang, S-J., Lin, Y. J., Lee, H-H. & Huang, D. Y., 2007 Dec 1, Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07. 4283565. (Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2006

3-D magnetic tweezers for investigation of mechanical properties of single DNA molecules

Chiou, C. H., Huang, Y. Y., Chiang, M. H., Lee, H-H. & Lee, G. B., 2006 Oct 24, 19th IEEE International Conference on Micro Electro Mechanical Systems. p. 142-145 4 p. 1627756. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Design and verification of a clamping system for micro-injection molding machine

Change, P. C., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2006 Dec 1, In : Transactions of the Canadian Society for Mechanical Engineering. 30, 3, p. 413-428 16 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Microfluidic pH-sensing chips integrated with pneumatic fluid-control devices

Lin, C. F., Lee, G. B., Wang, C. H., Lee, H. H., Liao, W. Y. & Chou, T. C., 2006 Feb 15, In : Biosensors and Bioelectronics. 21, 8, p. 1468-1475 8 p.

Research output: Contribution to journalArticle

32 Citations (Scopus)

Micromachined flow-through polymerase chain reaction chip utilizing multiple membrane-activated micropumps

Wang, C. H., Chen, Y. Y., Liao, C. S., Lee, H-H. & Lee, G. B., 2006 Oct 24, 19th IEEE International Conference on Micro Electro Mechanical Systems. p. 374-377 4 p. 1627814. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

New fabrication process for monolithic probes with integrated heaters for nanothermal machining

Chiou, C. H., Chang, S. J., Lee, G. B. & Lee, H. H., 2006 Jan 10, In : Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers. 45, 1 A, p. 208-214 7 p.

Research output: Contribution to journalArticle

6 Citations (Scopus)

New magnetic tweezers for investigation of the mechanical properties of single DNA molecules

Chiou, C. H., Huang, Y. Y., Chiang, M. H., Lee, H-H. & Lee, G. B., 2006 Mar 14, In : Nanotechnology. 17, 5, p. 1217-1224 8 p.

Research output: Contribution to journalArticle

54 Citations (Scopus)

Prediction of process induced warpage of electronic package by P-V-T-C equation and Taguchi method

Chen, J. Y., Teng, S. Y., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2006 Dec 1, 2006 International Conference on Electronic Materials and Packaging, EMAP. 4430640. (2006 International Conference on Electronic Materials and Packaging, EMAP).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2005
11 Citations (Scopus)