• 340 Citations
  • 11 h-Index
19952020

Research output per year

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Research Output

  • 340 Citations
  • 11 h-Index
  • 31 Article
  • 27 Conference contribution
  • 2 Patent
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Conference contribution
2019

Effects of substrate structure on the warpage of flip chip IC packages

Lee, Y. S., Lin, P. Y., Wu, K. T., Lee, H. H. & Hwang, S. J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 66-70 5 p. 8625738. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Injection Molding Process Control of Servo-Hydraulic System

Lin, C. Y., Shen, F. C., Wu, K. T., Hwang, S. J. & Lee, H. H., 2019 Oct, 2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019. Meen, T-H. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 242-245 4 p. 8942784. (2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Observation of fiber orientation in injection molded long-fiber reinforced composites

Aditya, R., Hwang, S. J. & Lee, H. H., 2019 Feb 6, Proceedings of PPS-34: 34th International Conference of the Polymer Processing Society - Conference Papers. Liu, S-J. (ed.). American Institute of Physics Inc., 030029. (AIP Conference Proceedings; vol. 2065).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2014

Thermal simulation of System in Package (SiP) in soak zone of reflow process

Deng, S. S., Hwang, S. J. & Lee, H. H., 2014 Jan 1, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 238-241 4 p. 7048402. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2013

Design and development of oral appliance for obstructive sleep apnea

Lai, Y. B., Huang, D. Y., Hwang, S-J., Lee, H-H. & Chang, Y. S., 2013 Feb 20, Innovation for Applied Science and Technology. p. 1540-1546 7 p. (Applied Mechanics and Materials; vol. 284-287).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Molded underfill for flip chip package

Chen, Y. K., Wu, G. T., Hwang, S-J., Lee, H-H. & Hwang, D. Y., 2013 Dec 1, 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013 - Proceedings. p. 310-314 5 p. 6706663. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2012

Design of induction heating module for uniform cavity surface heating

Sung, Y. T., Lin, Y. N., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2012 Jan 1, 70th Annual Technical Conference of the Society of Plastics Engineers 2012, ANTEC 2012. Society of Plastics Engineers, p. 1427-1436 10 p. (Annual Technical Conference - ANTEC, Conference Proceedings; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Development of liquid spray process in a rapid prototyping machine

Huang, C. H., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2012 Nov 26, Advanced Manufacturing Focusing on Multi-Disciplinary Technologies. p. 365-375 11 p. (Advanced Materials Research; vol. 579).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2011

Design of induction heating module for uniform cavity surface heating

Sung, Y. T., Lin, Y. N., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2011 Jan 1, 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011. Society of Plastics Engineers, p. 2054-2057 4 p. (Annual Technical Conference - ANTEC, Conference Proceedings; vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Development of an apparatus for measuring normal adhesion force during TPU injection molding process

Chen, J. Y., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2011 Aug 23, 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011. p. 1512-1517 6 p. (Annual Technical Conference - ANTEC, Conference Proceedings; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

On mold corner effects of EMC adhesion for IC encapsulation process

Yeh, C. H., Deng, C. H., Lee, H. H., Hwang, S. J. & Huang, D. Y., 2011 Dec 1, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. p. 280-283 4 p. 6117263. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2010

Copper plating process for through silicon via with high aspect ratio in advanced packaging

Huang, Y. H., Lee, H-H., Hwang, S-J. & Huang, D. Y., 2010 Jun 25, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 9-14 6 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Warpage simulations with P-V-T-C equation and experiments of fan-out wafer level package after encapsulation process

Deng, S. S., Hwang, S-J., Lee, H-H., Huang, D. Y. & Shen, G. S., 2010 Dec 1, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699590. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2009

Simulation and analysis of fiber orientation in injection molded bipolar plates for fuel cell

Lin, Y. J., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2009, 67th Annual Technical Conference of the Society of Plastics Engineers 2009, ANTEC 2009. Vol. 4. p. 2092-2097 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Simulation and experiments of fan-out wafer level package during encapsulation

Deng, S. S., Hwang, S-J., Lee, H-H., Huang, D. Y., Chen, Y. R. & Shen, G. S., 2009 Dec 1, IMPACT Conference 2009 International 3D IC Conference - Proceedings. p. 48-51 4 p. 5382306. (IMPACT Conference 2009 International 3D IC Conference - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2008

Application of dynamic masking on rapid prototyping

Chen, C. N., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2008, Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture. Trans Tech Publications Ltd, Vol. 594. p. 261-272 12 p. (Materials Science Forum; vol. 594).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Post-mold cure process simulation of IC packaging

Shue, C. H., Hwang, S. J., Lee, H. H., Huang, D. Y. & Lee, Y. J., 2008 Dec 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 106-110 5 p. 4784241. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2007

Control of hot runner type micro injection molding module

Yang, C. C., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2007 Dec 1, Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON. p. 2928-2933 6 p. 4460054. (IECON Proceedings (Industrial Electronics Conference)).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Mold adhesion force measurement

Lee, H-H., Hwang, S-J., Huang, D. Y. & Lin, Y. J., 2007 Dec 1, 2007 Proceedings of the ASME InterPack Conference, IPACK 2007. p. 51-58 8 p. (2007 Proceedings of the ASME InterPack Conference, IPACK 2007; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Prediction of flow induced lead deflection of leadframe assemblies in plastic encapsulation during molding

Chen, J. Y., Teng, S. Y., Hwang, S. J., Lee, H. H., Huang, D. Y., Lin, Y. J., Chen, S., Shen, G. S. & Wu, L., 2007 Dec 1, Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT. 4441395. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The development of paddle shift analysis for IC packaging processing

Chen, S., Shen, G. S., Chen, J. Y., Teng, S. Y., Hwang, S-J., Lin, Y. J., Lee, H-H. & Huang, D. Y., 2007 Dec 1, Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07. 4283565. (Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2006

3-D magnetic tweezers for investigation of mechanical properties of single DNA molecules

Chiou, C. H., Huang, Y. Y., Chiang, M. H., Lee, H-H. & Lee, G. B., 2006 Oct 24, 19th IEEE International Conference on Micro Electro Mechanical Systems. p. 142-145 4 p. 1627756. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Micromachined flow-through polymerase chain reaction chip utilizing multiple membrane-activated micropumps

Wang, C. H., Chen, Y. Y., Liao, C. S., Lee, H-H. & Lee, G. B., 2006 Oct 24, 19th IEEE International Conference on Micro Electro Mechanical Systems. p. 374-377 4 p. 1627814. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Prediction of process induced warpage of electronic package by P-V-T-C equation and Taguchi method

Chen, J. Y., Teng, S. Y., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2006 Dec 1, 2006 International Conference on Electronic Materials and Packaging, EMAP. 4430640. (2006 International Conference on Electronic Materials and Packaging, EMAP).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2004

Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging

Hong, L. C., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2004 Dec 1, 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics. p. 78-84 7 p. (2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)
2002

Effects of process parameters on the mold adhesion force in IC encapsulation process

Hwang, S-J., Lee, H-H., Chuang, C. H. & Huang, D. Y., 2002 Jan 1, 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., p. 166-171 6 p. 990381. (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Wire density effect on wire sweep analysis for IC packaging

Pei, C. C., Su, F., Hwang, S-J., Huang, D. Y. & Lee, H-H., 2002 Jan 1, 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., p. 160-165 6 p. 990380. (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)