Hwa-Teng Lee

Professor

Department of Mechanical Engineering

Phone886 6 2757575 ext 62154
Emailhtlee@mail.ncku.edu.tw
Websitehttp://140.116.71.175/

1762 Citations
21 h-Index

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Research Output 1988 2019

1762 Citations
21 h-Index
82 Article
10 Conference contribution
2 Letter
1 Conference article

10 results
Publication Year, Title (descending)

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2009

6 Citations (Scopus)

Effect of cooling rate on Ag₃Sn formation in Sn-Ag based lead-free solder

Lee, H-T., Chen, Y. F., Hong, T. F. & Shih, K. T., 2009 Dec 1, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 875-878 4 p. 5416420. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

solders

Cooling

cooling

Soldering alloys

solidification

6 Citations (Scopus)

Evolution of Ag₃Sn compounds in solidification of eutectic Sn-3.5Ag solder

Lee, H-T., Chen, Y. F., Hong, T. F. & Shih, K. T., 2009 Nov 25, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 646-649 4 p. 5270669. (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Soldering alloys

Eutectics

Solidification

Cooling

Needles

Microstructural evolution of Sn-3.5Ag solder with lanthanum addition

Lee, H-T., Chen, Y. F., Hong, T. F., Shih, K. T. & Hsu, C. W., 2009 Nov 25, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 617-622 6 p. 5270676. (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Microstructural evolution

Lanthanum

Soldering alloys

Microhardness

Coarsening

2008

Effect of in addition on Sn-Ag-Sb lead-free solder system

Lee, H-T., Lee, F. F., Hong, T. F. & Chen, H. W., 2008 Dec 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 191-194 4 p. 4784261. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Indium

Soldering alloys

Atoms

Intermetallics

Microstructure

1 Citation (Scopus)

Influence of lanthanum addition on microstructure and Properties of Sn-3.5Ag solder system

Lee, H-T., Chen, Y. F., Hong, T. F. & Huang, Y. J., 2008 Dec 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 183-186 4 p. 4784259. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lanthanum

Soldering alloys

Microstructure

Microhardness

Coarsening

2007

The feasibility study of micro-EDM hole-drilling method for measuring residual stress

Hsu, F. C., Lee, H-T., Tai, T. Y., Lin, Y. F. & Klocke, F., 2007, Proceedings of the 15th International Symposium on Electromachining, ISEM 2007. Industrial and Management Systems Engineering, p. 205-209 5 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Residual stresses

Drilling

Electric discharge machining

Tool steel

Stress measurement

1 Citation (Scopus)

The influence of working parameters and size effect on surface roughness during EDM process

Tai, T. Y., Lee, H-T. & Hsu, F. C., 2007, Proceedings of the 15th International Symposium on Electromachining, ISEM 2007. Industrial and Management Systems Engineering, p. 93-97 5 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Surface roughness

Surface topography

Electrodes

2002

3 Citations (Scopus)

Influence of Sb addition on microstructural evolution of Sn-Ag solder

Lee, H-T., Chen, M. H., Hu, S. Y. & Li, C. S., 2002 Jan 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 139-144 6 p. 1188827. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Microstructural evolution

Soldering alloys

Atoms

Cooling

Ductility

2001

8 Citations (Scopus)

Study on microstructure and shear strength of Sn-Ag-Sb solder joints

Lee, H-T., Liao, T. L. & Chen, M. H., 2001 Jan 1, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 315-322 8 p. 984003. (Advances in Electronic Materials and Packaging 2001).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shear strength

Soldering alloys

Microstructure

Soldering

Testing

1988

Moving grid method for the computation of recirculating flow

Lee, D. & Lee, H-T., 1988, Unknown Host Publication Title. Publ by American Soc of Mechanical Engineers (ASME), p. 485-489 5 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution