Research Output per year
Research Output 1988 2019
2009
6
Citations
(Scopus)
Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder
Lee, H-T., Chen, Y. F., Hong, T. F. & Shih, K. T., 2009 Dec 1, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 875-878 4 p. 5416420. (Proceedings of the Electronic Packaging Technology Conference, EPTC).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
solders
Cooling
cooling
Soldering alloys
solidification
6
Citations
(Scopus)
Evolution of Ag3Sn compounds in solidification of eutectic Sn-3.5Ag solder
Lee, H-T., Chen, Y. F., Hong, T. F. & Shih, K. T., 2009 Nov 25, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 646-649 4 p. 5270669. (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Soldering alloys
Eutectics
Solidification
Cooling
Needles
Microstructural evolution of Sn-3.5Ag solder with lanthanum addition
Lee, H-T., Chen, Y. F., Hong, T. F., Shih, K. T. & Hsu, C. W., 2009 Nov 25, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 617-622 6 p. 5270676. (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Microstructural evolution
Lanthanum
Soldering alloys
Microhardness
Coarsening
2008
Effect of in addition on Sn-Ag-Sb lead-free solder system
Lee, H-T., Lee, F. F., Hong, T. F. & Chen, H. W., 2008 Dec 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 191-194 4 p. 4784261. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Indium
Soldering alloys
Atoms
Intermetallics
Microstructure
1
Citation
(Scopus)
Influence of lanthanum addition on microstructure and Properties of Sn-3.5Ag solder system
Lee, H-T., Chen, Y. F., Hong, T. F. & Huang, Y. J., 2008 Dec 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 183-186 4 p. 4784259. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Lanthanum
Soldering alloys
Microstructure
Microhardness
Coarsening
2007
The feasibility study of micro-EDM hole-drilling method for measuring residual stress
Hsu, F. C., Lee, H-T., Tai, T. Y., Lin, Y. F. & Klocke, F., 2007 Jan 1, Proceedings of the 15th International Symposium on Electromachining, ISEM 2007. Sundaram, M. M., Rajurkar, K. P. & Resnick, R. L. (eds.). Industrial and Management Systems Engineering, p. 205-209 5 p. (Proceedings of the 15th International Symposium on Electromachining, ISEM 2007).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Residual stresses
Drilling
Electric discharge machining
Tool steel
Stress measurement
1
Citation
(Scopus)
The influence of working parameters and size effect on surface roughness during EDM process
Tai, T. Y., Lee, H-T. & Hsu, F. C., 2007, Proceedings of the 15th International Symposium on Electromachining, ISEM 2007. Industrial and Management Systems Engineering, p. 93-97 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Surface roughness
Surface topography
Electrodes
2002
3
Citations
(Scopus)
Influence of Sb addition on microstructural evolution of Sn-Ag solder
Lee, H-T., Chen, M. H., Hu, S. Y. & Li, C. S., 2002 Jan 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 139-144 6 p. 1188827. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Microstructural evolution
Soldering alloys
Atoms
Cooling
Ductility
2001
8
Citations
(Scopus)
Study on microstructure and shear strength of Sn-Ag-Sb solder joints
Lee, H-T., Liao, T. L. & Chen, M. H., 2001 Jan 1, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 315-322 8 p. 984003. (Advances in Electronic Materials and Packaging 2001).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Shear strength
Soldering alloys
Microstructure
Soldering
Testing