驊登 李

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Hwa-Teng Lee

Professor Emeritus

Calculated based on number of publications stored in Pure and citations from Scopus
1988 …2023

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  • 2009

    Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder

    Lee, H. T., Chen, Y. F., Hong, T. F. & Shih, K. T., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 875-878 4 p. 5416420. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    14 Citations (Scopus)

  • Evolution of Ag3Sn compounds in solidification of eutectic Sn-3.5Ag solder

    Lee, H. T., Chen, Y. F., Hong, T. F. & Shih, K. T., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 646-649 4 p. 5270669. (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    6 Citations (Scopus)

  • Microstructural evolution of Sn-3.5Ag solder with lanthanum addition

    Lee, H. T., Chen, Y. F., Hong, T. F., Shih, K. T. & Hsu, C. W., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 617-622 6 p. 5270676. (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • 2008

    Effect of in addition on Sn-Ag-Sb lead-free solder system

    Lee, H. T., Lee, F. F., Hong, T. F. & Chen, H. W., 2008, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 191-194 4 p. 4784261. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    3 Citations (Scopus)

  • Influence of lanthanum addition on microstructure and Properties of Sn-3.5Ag solder system

    Lee, H. T., Chen, Y. F., Hong, T. F. & Huang, Y. J., 2008, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 183-186 4 p. 4784259. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    1 Citation (Scopus)
  • 2007

    The feasibility study of micro-EDM hole-drilling method for measuring residual stress

    Hsu, F. C., Lee, H.-T., Tai, T. Y., Lin, Y. F. & Klocke, F., 2007 Jan 1, Proceedings of the 15th International Symposium on Electromachining, ISEM 2007. Sundaram, M. M., Rajurkar, K. P. & Resnick, R. L. (eds.). Industrial and Management Systems Engineering, p. 205-209 5 p. (Proceedings of the 15th International Symposium on Electromachining, ISEM 2007).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • The influence of working parameters and size effect on surface roughness during EDM process

    Tai, T. Y., Lee, H.-T. & Hsu, F. C., 2007, Proceedings of the 15th International Symposium on Electromachining, ISEM 2007. Industrial and Management Systems Engineering, p. 93-97 5 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    2 Citations (Scopus)
  • 2002

    Influence of Sb addition on microstructural evolution of Sn-Ag solder

    Lee, H. T., Chen, M. H., Hu, S. Y. & Li, C. S., 2002, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 139-144 6 p. 1188827. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    3 Citations (Scopus)
  • 2001

    Study on microstructure and shear strength of Sn-Ag-Sb solder joints

    Lee, H. T., Liao, T. L. & Chen, M. H., 2001, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 315-322 8 p. 984003. (Advances in Electronic Materials and Packaging 2001).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    13 Citations (Scopus)