Projects per year
Personal profile
Education
- 2002 PhD, Department of Computer Science, National Chiao Tung University
Research Interests
- Design Automation for Nanometer Ics
Experience
- 2002~2007 Assistant Manager, EDA Technology, R&D Center, Realtek Semiconductor Corporation, Taiwan
- 2007~2012 Assistant Professor, Department of Electrical Engineering, National Cheng Kung University
- 2012~present Associate Professor, Department of Electrical Engineering, National Cheng Kung University
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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A fence-region driven die placement approach and a post-placement optimization flow for macros( I )
21-04-01 → 22-03-31
Project: Research project
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A Research of 2.5d/3d Ic Placement Approaches to Globally Optimize Wirelength and Routability for Multiple Dies
23-08-01 → 24-07-31
Project: Research project
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A Research of 2.5d/3d Ic Placement Approaches to Globally Optimize Wirelength and Routability for Multiple Dies
22-08-01 → 23-07-31
Project: Research project
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A fence-region driven die placement approach and a post-placement optimization flow for macros( II )
22-04-01 → 23-03-31
Project: Research project
-
A Research of 2.5d/3d Ic Placement Approaches to Globally Optimize Wirelength and Routability for Multiple Dies
21-08-01 → 22-07-31
Project: Research project
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An Effective Analytical Placement Approach to Handle Fence Region Constraint
Lin, J. M., Chen, Y. C., Lin, W. Y., Chen, P. Y., Tsai, C. F., Fu, D. S. & Lin, C. L., 2025 Apr 9, Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2024. Institute of Electrical and Electronics Engineers Inc., 21. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Timing-Driven Analytical Placement According to Expected Cell Distribution Range
Lin, J. M., Chang, Y. Y. & Huang, W. L., 2024 Mar 12, ISPD 2024 - Proceedings of the 2024 International Symposium on Physical Design. Association for Computing Machinery, p. 177-184 8 p. (Proceedings of the International Symposium on Physical Design).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
HyPlace-3D: A Hybrid Placement Approach for 3D ICs Using Space Transformation Technique
Lin, J. M., Lin, Y. C., Kung, H. & Lin, W. Y., 2023, 2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Multilevel Fixed-Outline Component Placement and Graph-Based Ball Assignment for System in Package
Lin, J. M., Tsai, T. L. & Tsai, T. C., 2023 Sept 1, In: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 31, 9, p. 1308-1319 12 p.Research output: Contribution to journal › Article › peer-review
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Routability-Driven Orientation-Aware Analytical Placement for System in Package
Lin, J. M., Tsai, T. C. & Shen, R. T., 2023, 2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus)