Projects per year
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Finished
A Research of 2.5d/3d Ic Placement Approaches to Globally Optimize Wirelength and Routability for Multiple Dies
23-08-01 → 24-07-31
Project: Research project
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A Research of 2.5d/3d Ic Placement Approaches to Globally Optimize Wirelength and Routability for Multiple Dies
22-08-01 → 23-07-31
Project: Research project
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A fence-region driven die placement approach and a post-placement optimization flow for macros( II )
22-04-01 → 23-03-31
Project: Research project
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A Research of 2.5d/3d Ic Placement Approaches to Globally Optimize Wirelength and Routability for Multiple Dies
21-08-01 → 22-07-31
Project: Research project
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Wirelength-Driven Routability-Aware Die Placement and Package Routing through Better Bump Assignment in the Interposer-Based 3d Ic
20-08-01 → 21-07-31
Project: Research project
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Wirelength-Driven Routability-Aware Die Placement and Package Routing through Better Bump Assignment in the Interposer-Based 3d Ic
19-08-01 → 20-07-31
Project: Research project
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A Routability-Driven Floorplanner Following Pre-Assigned Module Constraint for a Monolithic 3d Ic with a Given Stacking Mode
18-08-01 → 19-07-31
Project: Research project
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A Routability-Driven Floorplanner Following Pre-Assigned Module Constraint for a Monolithic 3d Ic with a Given Stacking Mode
17-08-01 → 18-07-31
Project: Research project
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考量三維晶片平面規畫與除錯之低功耗動態調整電壓與頻率之設計方法-子計畫四:在三維晶片考量多重電壓源之整合型電源線規劃與平面規劃
15-08-01 → 16-07-31
Project: Research project
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考量三維晶片平面規畫與除錯之低功耗動態調整電壓與頻率之設計方法-子計畫四:在三維晶片考量多重電壓源之整合型電源線規劃與平面規劃
14-08-01 → 15-07-31
Project: Research project
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考量三維晶片平面規畫與除錯之低功耗動態調整電壓與頻率之設計方法-子計畫四:在三維晶片考量多重電壓源之整合型電源線規劃與平面規劃
13-08-01 → 14-07-31
Project: Research project
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具易測試及除錯特性之智慧型低功率多核心系統之設計技術研發:從電子系統層級至矽晶片層級-子計畫五:考量低功率及溫度最佳化之智慧型多核心平面規劃器(1/3)
10-08-01 → 11-07-31
Project: Research project
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