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Research Output 2003 2019

  • 615 Citations
  • 13 h-Index
  • 66 Article
  • 39 Conference contribution
  • 1 Editorial
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Conference contribution
2018

Application of Electron Channeling Contrast Image on Analysis of Dislocation Structures Induced by Indentation in Nickel Single Crystal

Huang, F. Y. & Kuo, J-C., 2018 Sep 9, 19th International Microscopy Congress 2018 (IMC19). Sydney, Australia

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of process parameters on dimension of single-track ss316l deposited by direct energy deposition

Chen, Y. T. & Kuo, J-C., 2018 Aug 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Texture simulation of cold-rolled F.C.C. metals by using taylor model

Hsiao, S. C. & Kuo, J-C., 2018 Aug 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2017

Application of Electron Channeling Contrast Imaging-Investigation of dislocations in deformed bcc metal

Wu, T. Y. & Kuo, J-C., 2017 Nov 5, IUMRS International Conference in Asia (IUMRS-ICA 2017) in Symposium E3 of Advanced Steels. Taipei, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of Atomic Number on Spatial Resolution of Transmission Electron Backscatter Diffraction

Kuo, C. W. & Kuo, J-C., 2017 Aug 4, The 2nd International Conference on Advanced Functional Materials. Los Angeles, USA

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of Mg Addition on the Grain Growth Behavior of Austenite in SS400

Lai, C. T., Wu, H. Y., Huang, F. Y., Hsiao, Z. W., Su, Y. H. F., Kuo, J-C. & Lai, H. H., 2017 Nov 5, IUMRS International Conference in Asia (IUMRS-ICA 2017). Taipei, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of Stacking Fault Energy on Cold-Rolling Texture and Microstructure of FCC Metals

Kuo, J-C., Hsiao, Z. W. & Chen, H. J., 2017 Mar 22, BIT’s 5th Annual Conference of AnalytiX-2017. Fukuoka, Japan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microstructure and Deformation Characteristics of MnS in 1215MS Steel at 1050°C

Huang, F. Y., Su, Y. H. F. & Kuo, J-C., 2017 May 29, International Conference on Mining, Material, and Metallurgical Engineering (ICMMME). Tokyo, Japan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2016

Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper

Shia, Z. W., Kuo, C. W., Kuo, T. Y. & Kuo, J-C., 2016 Aug 1, International Conference & Exhibition on Advanced & Nano Materials (ICANM). Montreal, Quebec, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rapid SNP Genotyping of TMIGD1 Gene in Tsaiya Duck Using Lateral-flow Immunoassay with Primer Extension and Nano-gold

Lin, C. W., Kuo, J-C. & Huang, H. L., 2016 Jul 25, 10th Asia-Pacific Biotech Congress. Bangkok, Thailand

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2015

Application of transmission-EBSD on Copper nanotwin Structure

Shih, J. W., Chen, D. & Kuo, J-C., 2015 Jul 8, International Workshop on Advanced and In-situ Microscopies of Functional Nanomaterials and Devices. Hamburg, German

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging

Chiu, W. L., Lu, C. L., Lin, H. W., Liu, C. M., Huang, Y. S., Lu, T. L., Liu, T. C., Hsiao, H. Y., Chen, C., Kuo, J-C. & Tu, K. N., 2015 May 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 518-522 5 p. 7111069. (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallizing
Packaging
Fabrication
Single crystals
Crystal growth
2014

Effect of Deformation on Crystallographic Texture in Cold-Rolled FePd Alloy

Lin, H. P. & Kuo, J-C., 2014 Aug 24, 17th International Conference on Textures of Materials (ICOTOM-17). Dresden, German

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Investigation of ceria truncated nano-tetrahedron island, triangular plate stack structure, and columns made by using electron beam deposition

Wu, M. H., Huang, J-L., Kuo, J-C. & Lii, D. F., 2014 Jan 1, Proceedings of the 2nd International Conference on Intelligent Technologies and Engineering Systems, ICITES 2013. Chen, C-Y., Yang, C-F. & Juang, J. (eds.). Springer Verlag, p. 323-329 7 p. (Lecture Notes in Electrical Engineering; vol. 293).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cerium compounds
Electron beams
Physical vapor deposition
Surface morphology
Transmission electron microscopy
2013

Effect of Boron Content on Glass Forming Ability of Fe-B-Y-Nb Alloys

Lin, F. W., Kuo, J-C. & Chen, I. G., 2013 Jun 30, The 20th International Symposium on Metastable, Amorphous and Nanostructured Materials. Torino, Italy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2012
1 Citation (Scopus)

Application of digital image correlation (DIC) on magnetostriction of Fe-Pd alloy

Chiue, J. Y., Lin, H. P. & Kuo, J-C., 2012 Jan 30, THERMEC 2011. p. 1937-1942 6 p. (Materials Science Forum; vol. 706-709).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Magnetostriction
magnetostriction
vacuum melting
Vacuum
Magnetic fields

Effect of Pulse Plating Frequency on Microstructure of Electrodeposited Copper Film

Huang, F. Y., Lin, H. P. & Kuo, J-C., 2012 Oct 21, 16th APCCC. Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Interfacial Reaction and Corrosion Resistance of 2205 Duplex Stainless Steel and Multicomponent FeCrNiCoMnAl High Entropy Alloy in Molten Aluminum

Yang, H. H., Kuo, J-C. & Tsai, W. T., 2012 Oct 21, 16th APCCC. Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads

Lin, H. W., Lu, J. L., Liu, C. M., Chen, C., Tu, K. N., Chen, D. & Kuo, J-C., 2012 Dec 1, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. p. 90-93 4 p. 6420285. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electroplating
Intermetallics
Soldering alloys
Crystals
Metals
2 Citations (Scopus)

Using the simplified 3D DIC method to measure the deformation of 3D surface

Tung, S. H., Kuo, J-C., Shih, M. H. & Sung, W. P., 2012 Jan 1, Frontiers of Manufacturing and Design Science II. p. 3945-3949 5 p. (Applied Mechanics and Materials; vol. 121-126).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Correlation methods
Geometry
2011

Application of the digital image correlation method to micro hole drilling

Tung, S. H., Shih, M. H. & Kuo, J-C., 2011 Dec 1, Proceedings of the 13th International Conference on Civil, Structural and Environmental Engineering Computing. (Proceedings of the 13th International Conference on Civil, Structural and Environmental Engineering Computing).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Correlation methods
Residual stresses
Drilling
Forging
Strain gages

Effect of Accelerating Voltage and Probe Current on EBSD Spatial Resolutions

Chen, D. & Kuo, J-C., 2011 May 22, 5th Congress of the International Union of Microbeam Analysis Societies (IUMAS-V). Seoul Olympic Parktel, Seoul, Korea

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of Annealing Temperature on Microstructures and Magnetic Properties for Ferromagnetic Shape Memory Fe-Pd Alloys

Hsu, C-W., Ng, Y. & Kuo, J-C., 2011 Sep 19, IUMRS-ICA 2011暨100年中國材料科學學會年會. Taipei, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of Pulse Plating Frequency on Electrical and Mechanical Properties of Electrodeposited Copper Films

Lin, Y-W., Chen, J-J. & Kuo, J-C., 2011 Sep 19, IUMRS-ICA 2011暨100年中國材料科學學會年會. Taipei, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of Pulse Plating Frequency on Properties of Electrodeposited Copper Films

Lin, Y-W., Chen, D. & Kuo, J-C., 2011 Nov 20, International Thin Films Conference TACT 2011. Kenting, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling Phase Transformation in Hot Rolled Low Carbon Steel

Su, B., Luo, S-J., Pan, Y-T. & Kuo, J-C., 2011 Sep 19, IUMRS-ICA 2011暨100年中國材料科學學會年會. Taipei, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2010

EBSD Characterization of Intermetallic Layers in Cu/Sn/Cu Joints

Chen, D., Ho, C-E. & Kuo, J-C., 2010 Jul 11, Thin Film 2010. Harbin, China

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Effect of plating current density and frequency on the crystallographic texture of electrodeposited copper

Lin, Y. W., Kuo, J-C., Lui, K. T. & Chen, D., 2010 Feb 9, THERMEC 2009. p. 2841-2845 5 p. (Materials Science Forum; vol. 638-642).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

plating
Plating
Copper
Current density
textures
2009
2 Citations (Scopus)

Effects of electromigration on grain rotation behavior of SnAg solders

Lin, H. W., Chen, C., Kuo, J-C. & Chen, C. C., 2009 Dec 1, IMPACT Conference 2009 International 3D IC Conference - Proceedings. p. 166-168 3 p. 5382151. (IMPACT Conference 2009 International 3D IC Conference - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Soldering alloys
Current density
Tin
Electron diffraction

Evaluation of the joint roughness coefficient using the digital image correlation method

Tung, S. H., Shih, M. H. & Kuo, J-C., 2009 Dec 1, Proceedings of the 12th International Conference on Civil, Structural and Environmental Engineering Computing. (Proceedings of the 12th International Conference on Civil, Structural and Environmental Engineering Computing).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Correlation methods
Surface roughness
Lasers
Shear strength
Costs

Fabrication of electrodeposited iron–palladium films

Lin, H-P., Chiue, J-Y., Kuo, J-C., Chang, J-K. & Tsai, W-T., 2009 Oct 4, 216th ECS Meeting, Vienna. Austria

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2008

The Influence of Grain Boundary and Triple Junction on Plastic Deformation

Liao, Y. Y. & Kuo, J-C., 2008 Jan 3, 14th International Symposium Plasticity. Hawaii, USA.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2007
2 Citations (Scopus)

On strain-induced grain growth using modified Monte Carlo method and digital image correlation technique

Lin, W. G. & Kuo, J-C., 2007, Recrystallization and Grain Growth III - Proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX and GG III. PART 2 ed. Vol. 558-559. p. 1121-1126 6 p. (Materials Science Forum; vol. 558-559, no. PART 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Grain growth
Monte Carlo methods
Bicrystals
Compaction
Aluminum
2006
1 Citation (Scopus)

Calibration of the image distortion induced error for a plane strain field measured using digital image correlation techniques

Tung, S. H., Kuo, J-C. & Shih, M. H., 2006 Dec 1, Proceedings of the 5th International Conference on Engineering Computational Technology. (Proceedings of the 5th International Conference on Engineering Computational Technology).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Calibration
Photogrammetry
Digital cameras
Tensors
Interpolation

Fabrication and characterization of Electrodeposited Aluminum Nanocrystalline

Chen, D., Wang, H. H. & Kuo, J-C., 2006 Nov 20, Joint Conference of the Asian Crystallographic Association and the Crystallographic Society of Japan. Epochal Tsukuba, Japan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

On the Passive Role of Grain Boundaries in Deformation Processing

Kuo, J-C. & Chen, D., 2006 Jul 17, 12th International Symposium Plasticity. Halifax, Nova Scotia, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The application of a digital image correlation method for crack observation

Shih, M. H., Tung, S. H., Kuo, J-C. & Sung, W. P., 2006 Jan 1, Proceedings of the 8th International Conference on Computational Structures Technology, CST 2006. Civil-Comp Press, Vol. 83.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Correlation methods
Cracks
Monitoring
Strain gages
Concrete construction
2005

Strain Distribution Analysis Using Digital- Image-Correlation Techniques

Tung, S. H., Kuo, J-C. & Shih, M. H., 2005 Dec 19, The Eighteenth KKCNN Symposium on Civil Engineering-NTU 29. Kaohsiung, Taiwan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2003

Microstructure mechanics: Investigation on deformation behavior of grain boundaries

Kuo, J-C., Raabe, D., Zaefferer, S., Roters, F., Zhao, Z. & Winning, M., 2003 Jul 7, 10th International Symposium Plasticity 03: Plasticity and its Current Applications. Quebec City, Canada

Research output: Chapter in Book/Report/Conference proceedingConference contribution