Kuo-Hsing Kao

Personal profile

Education

2013 PhD, Electrical Engineering, KULeuven, Belgium

Research Interests

Semiconductor Physics and Devices

Experience

2009~2013 PhD researcher, Inter-university Microelectronic Centre (imec), Belgium
2014~present Assistant Professor, Department of Electrical Engineering, National Cheng Kung University, Taiwan

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Projects

5 Finished

量子電子元件與人工智慧於半導體產業之應用 : 機器學習導向之量子傳輸模擬及與現今半導體製程相容之新穎元件製作(2/5)

Kao, K.

19-02-01 → 20-01-31

Project: Research project

無摻雜場效電晶體: 非平衡態格林函數量子傳輸模擬與實驗

Kao, K.

17-08-01 → 18-07-31

Project: Research project

空乏型量子井場效電晶體: 理論計算與實驗製作

Kao, K.

16-08-01 → 17-07-31

Project: Research project

具殼層淺參雜(深度小於5奈米且陡峭度 ~ 0.7奈米每10倍變化)之量子電子元件於節能電子的應用(I)

Kao, K.

15-08-01 → 16-07-31

Project: Research project

型變鍺錫量子穿隧電晶體之物理模型與元件模擬

Kao, K.

14-08-01 → 15-07-31

Project: Research project

Research Output

709 Citations
14 h-Index
28 Article
18 Conference contribution
1 Paper
1 Comment/debate
2 More
- 1 Conference article
- 1 Patent

A Comprehensive Kinetical Modeling of Polymorphic Phase Distribution of Ferroelectric-Dielectrics and Interfacial Energy Effects on Negative Capacitance FETs

Tang, Y. T., Fan, C. L., Kao, Y. C., Modolo, N., Su, C. J., Wu, T. L., Kao, K. H., Wu, P. J., Hsaio, S. W., Useinov, A., Su, P., Wu, W. F., Huang, G. W., Shieh, J. M., Yeh, W. K. & Wang, Y. H., 2019 Jun, 2019 Symposium on VLSI Technology, VLSI Technology 2019 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., p. T222-T223 8776508. (Digest of Technical Papers - Symposium on VLSI Technology; vol. 2019-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Demonstration of annealing-free metal-insulator-semiconductor (mis) ohmic contacts on a gan substrate using low work-function metal ytterbium (yb) and al₂o₃ interfacial layer

Wu, T. L., Tseng, Y. Y., Huang, C. F., Chen, Z. S., Lin, C. C., Chung, C. J., Huang, P. K. & Kao, K. H., 2019 May, WiPDA Asia 2019 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia. Institute of Electrical and Electronics Engineers Inc., 8760323. (WiPDA Asia 2019 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fabrication of omega-gated negative capacitance finfets and SRAM

Sung, P. J., Su, C. J., Lu, D. D., Luo, S. X., Kao, K. H., Ciou, J. Y., Jao, C. Y., Hsu, H. S., Wang, C. J., Hong, T. C., Liao, T. H., Fang, C. C., Wang, Y. S., Huang, H. F., Li, J. H., Huang, Y. C., Hsueh, F. K., Wu, C. T., Ma, W. C. Y., Huang, K. P. & 6 others, Lee, Y. J., Chao, T. S., Li, J. Y., Wu, W. F., Yeh, W. K. & Wang, Y. H., 2019 Apr, 2019 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2019. Institute of Electrical and Electronics Engineers Inc., 8804663. (2019 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Impact of Semiconductor Permittivity Reduction on Electrical Characteristics of Nanoscale MOSFETs

Chen, S. H., Lian, S. W., Wu, T. R., Chang, T. R., Liou, J. M., Lu, D. D., Kao, K. H., Chen, N. Y., Lee, W. J. & Tsai, J. H., 2019 Jun, In : IEEE Transactions on Electron Devices. 66, 6, p. 2509-2512 4 p., 8704283.

Research output: Contribution to journal › Article

Voltage Transfer Characteristic Matching by Different Nanosheet Layer Numbers of Vertically Stacked Junctionless CMOS Inverter for SoP/3D-ICs applications

Sung, P. J., Chang, C. Y., Chen, L. Y., Kao, K. H., Su, C. J., Liao, T. H., Fang, C. C., Wang, C. J., Hong, T. C., Jao, C. Y., Hsu, H. S., Luo, S. X., Wang, Y. S., Huang, H. F., Li, J. H., Huang, Y. C., Hsueh, F. K., Wu, C. T., Huang, Y. M., Hou, F. J. & 16 others, Luo, G. L., Huang, Y. C., Shen, Y. L., Ma, W. C. Y., Huang, K. P., Lin, K. L., Samukawa, S., Li, Y., Huang, G. W., Lee, Y. J., Li, J. Y., Wu, W. F., Shieh, J. M., Chao, T. S., Yeh, W. K. & Wang, Y. H., 2019 Jan 16, 2018 IEEE International Electron Devices Meeting, IEDM 2018. Institute of Electrical and Electronics Engineers Inc., p. 21.4.1-21.4.4 8614553. (Technical Digest - International Electron Devices Meeting, IEDM; vol. 2018-December).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution