Projects per year
Personal profile
Education
- 1999 PhD, Mechanical Engineering, Massachusetts Institute of Technology
Research Interests
- Solid Mechanics
Experience
- 1999年8月 ~ 2003年8月 國立成功大學機械工程學系助理教授
- 2003年8月 ~ 2007年7月 國立成功大學機械工程學系副教授
- 2007年8月 ~ 迄今 國立成功大學機械工程學系教授
- 2010年8月 ~ 2011年7月 美國麻省理工學院機械系訪問教授
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
-
SDG 3 Good Health and Well-being -
SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure -
SDG 11 Sustainable Cities and Communities -
SDG 12 Responsible Consumption and Production
Fingerprint
Dive into the research topics where Kuo-Shen Chen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 40 Finished
-
從元件至整廠階層之智慧機械智能化研究：領域知識建立、預診模型發展,及虛實整合人機介面之開發
Chen, K.-S. (PI)
21-08-01 → 22-07-31
Project: Research project
-
工具機資訊整合與整廠智能化研究: 狀態監控模組, 故障診斷方法, 以及資訊整合於整廠任務規劃
Chen, K.-S. (PI)
20-08-01 → 21-07-31
Project: Research project
-
智慧切削感測模組之實現, 加工訊號領域知識建立, 以及結合人工智慧於工具機刀具狀態診斷
Chen, K.-S. (PI)
19-08-01 → 20-07-31
Project: Research project
-
-
-
Development of bifurcation prediction and process emulation for warpage prediction in fan-out wafer level packaging based on material equivalence
Chen, K. S., Lee, Y. C., Chen, C. Y. & Hsu, S. F., 2026, (Accepted/In press) In: International Journal of Advanced Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
Open Access -
Performance Analysis of Ultra-Wideband Indoor Localization for Smart Factory Applications
Liao, C. M., Chen, K. S., Liang, Y. C., Wang, Z. C. & Vechet, S., 2026, In: Procedia Computer Science. 277, p. 801-810 10 p.Research output: Contribution to journal › Conference article › peer-review
Open Access -
A Novel FOWLP Process Emulator for Predicting Time-Dependent Plastic Effects in Multi-Step Accumulated Thermal-Mechanical Asymmetric Warpage
Hsu, S. F. & Chen, K. S., 2025, 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025. Institute of Electrical and Electronics Engineers Inc., p. 155-156 2 p. (2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Link opens in a new tab Citation (Scopus) -
Development of Process Emulator for Warpage Prediction in Fan-out Wafer Level Packaging
Chen, K. S., Lee, Y. C., Chen, C. Y. & Hsu, S. F., 2025, 2025 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2025. 2025 ed. Institute of Electrical and Electronics Engineers Inc.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Link opens in a new tab Citation (Scopus) -
Mechanical Properties Characterization of Silicon Carbide Coated Graphite Composites for MOCVD Structural Design
Chen, K. S., Huang, H. T., Liu, W. J., Liu, T. E., Wei, Y. H. & Ho, C.-J., 2025, 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025. Institute of Electrical and Electronics Engineers Inc., p. 333-334 2 p. (2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Link opens in a new tab Citation (Scopus)