Engineering & Materials Science
MEMS
100%
Residual stresses
52%
Mobile robots
43%
Plasma enhanced chemical vapor deposition
39%
Characterization (materials science)
39%
Nanoindentation
35%
Chemical mechanical polishing
35%
Rapid thermal annealing
34%
Silicon
30%
Mechanical properties
28%
Electrostatics
27%
Oxide films
25%
Fracture toughness
23%
Temperature
23%
Fans
22%
Navigation
22%
Plasmas
20%
Structural integrity
20%
Silicon nitride
20%
Sensors
20%
Mechanics
19%
Light emitting diodes
19%
Electromechanical coupling
18%
Derivatives
18%
Structural design
17%
Rubber
17%
Peeling
17%
Stiffness
17%
Cantilever beams
16%
Polydimethylsiloxane
16%
Indentation
16%
Robots
16%
Glass
16%
Packaging
16%
Servomotors
15%
Electron beam lithography
15%
Nitrides
15%
Vibration control
15%
Buckling
15%
Demonstrations
15%
Vapors
15%
Thin films
14%
Elastomers
14%
Testing
14%
Elastic moduli
13%
Reactive ion etching
13%
Materials properties
13%
Defects
13%
Substrates
13%
Chemical Compounds
Residual Stress
53%
Simulation
32%
Liquid Film
31%
Rapid Thermal Annealing
26%
Nitride
21%
Strength
19%
Mechanics
16%
Fracture Strength
15%
Fracture Toughness
14%
Plasma Enhanced Chemical Vapour Deposition
13%
Glass
11%
Young's Modulus
11%
Force
11%
Oxide
10%
Viscoelasticity
9%
Curing
9%
Annealing
9%
Heat Transfer
9%
Error
8%
Thermal Expansion Coefficient
7%
Stress Relaxation
7%
Surface
7%
Turbine
7%
Etching
7%
Fracture Mechanics
6%
Mechanical Fatigue
6%
Energy
6%
Environment
6%
Voltage
6%
Creep
6%
Shape
5%
Reduction
5%
Laser Ablation
5%
Plasma
5%
Pressure
5%
Buffer Solution
5%
Physics & Astronomy
microelectromechanical systems
31%
residual stress
20%
nanoindentation
18%
characterization
18%
mechanical properties
18%
fracture strength
14%
silicon nitrides
13%
annealing
12%
positioning
11%
silicon
11%
oxide films
11%
vibration
10%
commands
10%
performance
9%
indentation
9%
vapor deposition
8%
actuation
8%
modules
7%
nitrides
7%
rubber
6%
integrity
6%
tensile stress
6%
robots
6%
robot control
6%
structural reliability
6%
crack propagation
6%
fabrication
6%
simulation
6%
design analysis
5%
data reduction
5%
glass
5%
temperature
5%
machine tools
5%
predictions
5%
modulus of elasticity
5%
etching
5%
wafers
5%
elastomers
5%
touch
5%
formulations
5%
shock
5%
electrostatics
5%
retarding
5%
vapors
5%
engineering
5%
warpage
5%
