Kuo-Shen Chen

Professor

  • 1657 Citations
  • 23 h-Index
19972020

Research output per year

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Research Output

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Conference contribution
2020

Design and realization of a performance and reliability evaluation module for commercialized anti-lock braking systems

Wu, J. H., Guo, S. H., Chen, K. S. & Tsai, M. C., 2020 Jan 1, Mechatronics 2019: Recent Advances Towards Industry 4.0. Szewczyk, R., Nowicki, M., Ostaszewska-Lizewska, A. & Krejsa, J. (eds.). Springer Verlag, p. 237-245 9 p. (Advances in Intelligent Systems and Computing; vol. 1044).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2019

Design and Realization of a Novel Elastomer Characterization System for Precision Positioning Application

Lin, P. C., Cheng, Y. F. & Chen, K. S., 2019 Jan 23, Proceedings of the 2018 18th International Conference on Mechatronics - Mechatronika, ME 2018. Maga, D., Stefek, A. & Brezina, T. (eds.). Institute of Electrical and Electronics Engineers Inc., 8624672. (Proceedings of the 2018 18th International Conference on Mechatronics - Mechatronika, ME 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Finite Element Input Shaping Design for Vibration Suppression of Mechatronics Systems

Chen, W., Chen, K. S. & Tsai, M. C., 2019 May 24, Proceedings - 2019 IEEE International Conference on Mechatronics, ICM 2019. Institute of Electrical and Electronics Engineers Inc., p. 37-42 6 p. 8722868. (Proceedings - 2019 IEEE International Conference on Mechatronics, ICM 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Yang, C. Y., Chen, K. S., Yang, T. S. G., Chiu, T. C. & Ho, C. J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2018

A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation

Chuang, C. F. & Chen, K. S., 2018 Jun 22, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018. Marcelli, R., Mita, Y., Smith, S., Pressecq, F., Nouet, P., Mailly, F. & Schneider, P. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 1-5 5 p. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Damping Enhancement and Positioning Control of Compliant Stages by Incorporating Rubber Shear Dampers

Yula, Y. H., Lee, K. H., Chen, K. S. & Liu, Y. H., 2018 Oct 15, 2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018. Institute of Electrical and Electronics Engineers Inc., p. 533-538 6 p. 8492683. (2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Development of dual Wiimote-based 3D localization schemes for mobile robot and quadcopter integration

Zhan, H. Y., Li, T. H., Cheng, C. H., Kuo, S. H. & Chen, K. S., 2018 Jan 1, Mechatronics 2017 - Recent Technological and Scientific Advances. Brezina, T. & Jablonski, R. (eds.). Springer Verlag, p. 644-652 9 p. (Advances in Intelligent Systems and Computing; vol. 644).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Impedance Control of Self-Sensing Piezoelectric Actuator for Vibration Suppression

Chang, L. K., Tsai, M. C., Chen, K. S. & Lu, Z. L., 2018 Nov 27, ICEMS 2018 - 2018 21st International Conference on Electrical Machines and Systems. Institute of Electrical and Electronics Engineers Inc., p. 2533-2536 4 p. 8549428. (ICEMS 2018 - 2018 21st International Conference on Electrical Machines and Systems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Mechanical Properties Characterizations of Elastomer Pads and Control of a 3-DOF Rubber-Bearing Stage

Chen, Y. C., Chen, C. A., Chen, K. S. & Liu, Y. H., 2018 Oct 15, 2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018. Institute of Electrical and Electronics Engineers Inc., p. 539-544 6 p. 8492707. (2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Probabilistic reasoning in diagnostic expert system for smart homes

Vechet, S., Krejsa, J., Hrbacek, J. & Chen, K. S., 2018 Jan 1, Mechatronics 2017 - Recent Technological and Scientific Advances. Brezina, T. & Jablonski, R. (eds.). Springer Verlag, p. 708-715 8 p. (Advances in Intelligent Systems and Computing; vol. 644).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2017

Development of signal transmission and reduction modules for status monitoring and prediction of machine tools

Sun, I. C. & Chen, K. S., 2017 Nov 10, 2017 56th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2017. Institute of Electrical and Electronics Engineers Inc., p. 711-716 6 p. (2017 56th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2017; vol. 2017-November).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects

Hsiao, C. L., Yang, C. Y., Chen, H. C., Yang, T. S., Chen, K. S., Wu, T. H., Wang, Y. C. & Lee, S., 2017 Jul 1, IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 42-45 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2017-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Process emulation for predicting die shift and wafer warpage in wafer reconstitution

Yang, C. Y., Liu, Y. C., Chen, K. S., Yang, T. S., Wang, Y. C. & Lee, S. S., 2017 Sep 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 215-220 6 p. 8046441. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)
2016

Design and control of a one-dimensional stage based on elastomeric bearing technology

Teng, Y. C., Chen, K. S. & Chen, Y. C., 2016 Oct 7, MESA 2016 - 12th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 7587136. (MESA 2016 - 12th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications - Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Suppression of motion-induced vibration for a two-DoF system using state feedback control

Lin, W. T., Chen, K-S., Chen, Y. C. & Vechet, S., 2016 Nov 21, Proceedings - 2016 IEEE International Power Electronics and Motion Control Conference, PEMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 775-780 6 p. 7752091. (Proceedings - 2016 IEEE International Power Electronics and Motion Control Conference, PEMC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Chen, K. S., Yang, T. S., Hong, R. C., Chiu, T. C., Wen, A. C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2016 Jul 15, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Mita, Y., Rencz, M., Charlot, B., Schneider, P., Tas, N., Nouet, P. & Pressecq, F. (eds.). Institute of Electrical and Electronics Engineers Inc., 7514879. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2015

Electromechanical coupling characteristics of MEMS micro cantilevers with applications

Ou, K. S. & Chen, K. S., 2015 Jul 16, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015. Schropfer, G., Pressecq, F., Rencz, M., Schneider, P., Mita, Y., Charlot, B. & Nouet, P. (eds.). Institute of Electrical and Electronics Engineers Inc., 7161008. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing

Yang, T. S., Chen, G. D., Chen, K. S., Hong, R. C., Chiu, T. C., Wen, C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2015 Jan 1, Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME), (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); vol. 10-2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)
2014

A novel indoor localization scheme by integrating wiimote sensing and a controllable IR-LED array

Fu, Y. T. & Chen, K. S., 2014 Jan 1, Mechatronics 2013: Recent Technological and Scientific Advances. Springer Berlin, p. 567-574 8 p. (Mechatronics 2013: Recent Technological and Scientific Advances).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Buckling analysis for a rectangular membrane for touch panel applications

Chuang, C. H., Hong, R. C., Chen, K. S. & Chen, C. C., 2014 Oct 13, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. Bi, K., Tian, Z. & Xu, Z. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 1495-1498 4 p. 6922937. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Design, analysis, and experimental studies of a novel PVDF-based piezoelectric energy harvester with beating mechanisms

Chen, K-S., 2014 Jan 1, Dynamics, Vibration, and Control. American Society of Mechanical Engineers (ASME), (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); vol. 4B).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Hybrid navigation method for dynamic indoor environment based on mixed potential fields

Vechet, S., Chen, K-S. & Krejsa, J., 2014 Jan 1, Mechatronics 2013: Recent Technological and Scientific Advances. Springer Berlin, p. 575-582 8 p. (Mechatronics 2013: Recent Technological and Scientific Advances).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Sensor failure detection in autonomous mobile robot application

Vechet, S., Krejsa, J. & Chen, K. S., 2014 Jan 22, Proceedings of the 16th International Conference on Mechatronics, Mechatronika 2014. Brezina, T., Stefek, A. & Maga, D. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 375-380 6 p. 7018287. (Proceedings of the 16th International Conference on Mechatronics, Mechatronika 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

The investigation of buckling, deformation and interaction of elastic films for touch panel applications

Chuang, C. H., Chen, K. S., Chen, C. C. & Hong, R. C., 2014 Jan 1, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 105-108 4 p. 7048398. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2013

Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods

Chen, K. S. & Wu, S. L., 2013 Sep 2, 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013. 6559453. (2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2012

Design of Wiimote indoor localization technology for omni-directional vehicle trajectory control

Gu, D., Ou, K. S., Fu, Y. T. & Chen, K-S., 2012 Oct 9, CSAE 2012 - Proceedings, 2012 IEEE International Conference on Computer Science and Automation Engineering. p. 600-604 5 p. 6272667. (CSAE 2012 - Proceedings, 2012 IEEE International Conference on Computer Science and Automation Engineering; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

On the development of autonomously manipulation of group mobile robots for smart living and biomimetic applications

Chen, M. H., Fu, Y. T., Ou, K. S., Gu, D., Pi, C. H. & Chen, K-S., 2012 Oct 9, CSAE 2012 - Proceedings, 2012 IEEE International Conference on Computer Science and Automation Engineering. p. 259-263 5 p. 6272770. (CSAE 2012 - Proceedings, 2012 IEEE International Conference on Computer Science and Automation Engineering; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2011

Analysis, simulation, and experimental investigations of a one dimensional touch panel based on strain sensing

Pi, C. H., Ou, K. S., Chen, M. H. & Chen, K. S., 2011 Jan 1, SICE 2011 - SICE Annual Conference 2011, Final Program and Abstracts. Society of Instrument and Control Engineers (SICE), p. 1954-1959 6 p. 6060288. (Proceedings of the SICE Annual Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Mechanical properties characterization of PECVD nitride films with rapid thermal annealing using finite element simulation

Chiang, C. Y., Yan, H. Y., Huang, Z. K. & Chen, K. S., 2011 Nov 23, Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011. p. 20-23 4 p. (Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nanoindentation characterization of PECVD silicon nitride on silicon subjected to mechanical fatigue loading

Huang, Z. K., Ou, K. S. & Chen, K-S., 2011 Sep 30, Microelectromechanical Systems - Materials and Devices IV. p. 173-178 6 p. (Materials Research Society Symposium Proceedings; vol. 1299).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Vibration control on single axis flexible piezoelectric positioning stage by PID controller

Liu, Y. H., Chao, C. M., Lu, C. T. & Chen, K-S., 2011 Jan 1, Advances in Environmental Vibration - Proceedings of the 5th International Symposium on Environmental Vibration, ISEV 2011. Takemiya, H., De Roeck, G., Zhai, W. & Tutumluer, E. (eds.). Science Press, p. 883-889 7 p. (Advances in Environmental Vibration - Proceedings of the 5th International Symposium on Environmental Vibration, ISEV 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Wireless group manipulation of autonomously guided mobile robots for smart living space applications

Chen, M. H., Gu, D., Fu, Y. D., Pi, C. H., Ou, K. S. & Chen, K. S., 2011 Jan 1, SICE 2011 - SICE Annual Conference 2011, Final Program and Abstracts. Society of Instrument and Control Engineers (SICE), p. 2143-2148 6 p. 6060326. (Proceedings of the SICE Annual Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)
2010

Development of device-level chemical-mechanical polishing simulation module using cellular automata method

Yeh, H. M. & Chen, K. S., 2010 Nov 9, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010. p. 669-672 4 p. (Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effects of wafer carrier design on contact stress uniformity in CMP

Hu, I., Yanga, T. S. & Chen, K. S., 2010, Advances in Abrasive Technology XIII. p. 305-310 6 p. (Advanced Materials Research; vol. 126-128).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

IR indoor localization and wireless transmission for motion control in smart building applications based on wiimote technology

Chen, P. W., Ou, K. S. & Chen, K. S., 2010 Jan 1, Proceedings of SICE Annual Conference 2010, SICE 2010 - Final Program and Papers. Society of Instrument and Control Engineers (SICE), p. 1781-1785 5 p. 5602939. (Proceedings of the SICE Annual Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

33 Citations (Scopus)

Mechanical characterization of atomic layer deposited (ALD) alumina for applications in corrosive environments

Ou, K. S., Lin, I. K., Wu, P. H., Huang, Z. K., Chen, K. S. & Zhang, X., 2010 Aug 30, Microelectromechanical Systems - Materials and Devices III. p. 111-116 6 p. (Materials Research Society Symposium Proceedings; vol. 1222).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

The tunability in mechanical properties and fracture toughness of sputtered silicon oxynitride thin films for MEMS-based infrared detectors

Lin, I. K., Wu, P. H., Ou, K. S., Chen, K. S. & Zhang, X., 2010 Aug 30, Microelectromechanical Systems - Materials and Devices III. p. 123-128 6 p. (Materials Research Society Symposium Proceedings; vol. 1222).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2009

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

Ou, K. S., Chen, K-S., Yang, T-S. & Lee, S-Y., 2009 Dec 1, ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. p. 597-606 10 p. (Proceedings of the ASME Design Engineering Technical Conference; vol. 6).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Cellular force measurement in cardiac myocytes using polymer micropillar array with viscoelastic characterization

Lin, I. K., Ou, K. S., Chen, K-S. & Zhang, X., 2009, Proceedings of Conference, MicroTAS 2009 - The 13th International Conference on Miniaturized Systems for Chemistry and Life Sciences. Chemical and Biological Microsystems Society, p. 269-271 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2008

Elastic and viscoelastic characterization of polydimethylsiloxane (PDMS) for cell-mechanics applications

Lin, I. K., Liao, Y. M., Liu, Y., Chen, K. S. & Zhang, X., 2008 Jun 30, Microelectromechanical Systems - Materials and Devices. p. 81-86 6 p. (Materials Research Society Symposium Proceedings; vol. 1052).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Indentation characterization of fracture toughness and interfacial strength of PECVD nitrides after rapid thermal annealing

Yan, H. Y., Ou, K. S. & Chen, K. S., 2008 Jun 30, Microelectromechanical Systems - Materials and Devices. p. 59-64 6 p. (Materials Research Society Symposium Proceedings; vol. 1052).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2007

Mechanical properties characteristics or rubber O-rings by digital image correlation and nanoindentation

Chen, K. S., Chen, T. Y., Yan, H. Y., Huang, I. T. & Chen, J. K., 2007 Nov 19, Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007. p. 286-293 8 p. (Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)