Kuo-Tsai Wu

Project Assistant Research Fellow

Tainan Hydraulics Laboratory

Phone886 6 2371938 ext 122
Emailqaz77966@hotmail.com

Source: Scopus
Calculated based on no. of publications stored in Pure and citations from Scopus

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12 Citations
2 h-Index
10 Article
3 Conference contribution

Cutting force validation and volumetric errors compensation of thin workpieces with sensory tool holder
Chen, Y. W., Huang, Y. F., Wu, K. T., Hwang, S. J. & Lee, H. H., 2020 May 1, In: International Journal of Advanced Manufacturing Technology. 108, 1-2, p. 299-312 14 p.
Research output: Contribution to journal › Article › peer-review
Injection molding process control of servo-hydraulic system
Lin, C. Y., Shen, F. C., Wu, K. T., Lee, H. H. & Hwang, S. J., 2020 Jan 1, In: Applied Sciences (Switzerland). 10, 1, 71.
Research output: Contribution to journal › Article › peer-review

Open Access
Process optimization for directed energy deposition of SS316L components
Lin, P. Y., Shen, F. C., Wu, K. T., Hwang, S. J. & Lee, H. H., 2020 Nov 1, In: International Journal of Advanced Manufacturing Technology. 111, 5-6, p. 1387-1400 14 p.
Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus)
Adaptive process control of the changeover point for injection molding process
Chen, Y. S., Wu, K. T., Tsai, M. H., Hwang, S. J., Lee, H. H., Peng, H. S. & Chu, H. Y., 2019 Jan 1, (Accepted/In press) In: Journal of Low Frequency Noise Vibration and Active Control.
Research output: Contribution to journal › Article › peer-review

Open Access
1 Citation (Scopus)
Effects of substrate structure on the warpage of flip chip IC packages
Lee, Y. S., Lin, P. Y., Wu, K. T., Lee, H. H. & Hwang, S. J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 66-70 5 p. 8625738. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus)

Cutting force validation and volumetric errors compensation of thin workpieces with sensory tool holder

Injection molding process control of servo-hydraulic system

Process optimization for directed energy deposition of SS316L components

Adaptive process control of the changeover point for injection molding process

Effects of substrate structure on the warpage of flip chip IC packages