Engineering & Materials Science
Ball grid arrays
10%
Camera lenses
47%
Colloids
16%
Compression molding
31%
Computer simulation
7%
Control system stability
8%
Controllers
19%
Curing
11%
Defects
16%
Delamination
14%
Derivatives
10%
Dilution
9%
Electronic properties
9%
Energy release rate
17%
Error compensation
30%
Experiments
25%
Finite element method
49%
Gases
9%
Hydraulics
56%
Hydroelectric power
9%
Image sensors
52%
Injection molding
100%
Lasers
12%
Leakage currents
39%
Light emitting diodes
48%
Machining
15%
Metals
19%
Molding
8%
Oxide semiconductors
11%
Position control
26%
Powders
11%
Pressure control
33%
Pressure distribution
15%
Process control
68%
Sampling
27%
Strain energy
10%
Substrates
17%
System stability
12%
Temperature
11%
Thermal effects
9%
Thermal expansion
20%
Thin films
30%
Turbines
19%
Ultraviolet radiation
32%
Velocity control
32%
Vents
10%
Viscosity index
37%
Wire
9%
Physics & Astronomy
adjusting
15%
cameras
24%
chips
19%
CMOS
11%
compressing
6%
computerized simulation
5%
controllers
38%
cracks
7%
curing
13%
fabrication
6%
fracture mechanics
5%
hydraulic equipment
74%
hydraulic pumps
8%
hydraulics
5%
injection
25%
injection molding
90%
leakage
20%
lenses
22%
light emitting diodes
39%
metals
12%
mounting
5%
nonlinear systems
5%
nonuniformity
6%
performance
15%
predictions
13%
pressure distribution
12%
pressure sensors
5%
productivity
5%
products
18%
programming
5%
requirements
6%
sampling
26%
sensors
15%
simulation
11%
specifications
9%
strain energy release rate
14%
systems stability
13%
thin films
9%
trends
5%
tuning
18%
ultraviolet radiation
24%
viscosity
14%
voids
25%
wafers
23%
warpage
9%
wire
7%
Chemical Compounds
Colloid
11%
Cooling
5%
Curing
11%
Delamination
29%
Energy
9%
Film Material
8%
Flow
15%
Fracture Mechanics
12%
Gas
13%
Hydraulic System
20%
Leakage Current
48%
Liquid Film
23%
Metal Oxide
8%
Pressure
35%
Process Control
28%
Pump
12%
Residual Stress
8%
Sampling
41%
Semiconductor
7%
Simulation
57%
Strain Energy
20%
Thermal Expansion
15%
Time
7%
Velocity
20%