Kuo-Tsai Wu

Project Assistant Research Fellow

  • 9 Citations
  • 2 h-Index
20152020

Research output per year

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Research Output

  • 9 Citations
  • 2 h-Index
  • 9 Article
  • 3 Conference contribution
2020

Cutting force validation and volumetric errors compensation of thin workpieces with sensory tool holder

Chen, Y. W., Huang, Y. F., Wu, K. T., Hwang, S. J. & Lee, H-H., 2020 May 1, In : International Journal of Advanced Manufacturing Technology. 108, 1-2, p. 299-312 14 p.

Research output: Contribution to journalArticle

Injection molding process control of servo-hydraulic system

Lin, C. Y., Shen, F. C., Wu, K. T., Lee, H. H. & Hwang, S. J., 2020 Jan 1, In : Applied Sciences (Switzerland). 10, 1, 71.

Research output: Contribution to journalArticle

Open Access
2019

Adaptive process control of the changeover point for injection molding process

Chen, Y. S., Wu, K. T., Tsai, M. H., Hwang, S. J., Lee, H. H., Peng, H. S. & Chu, H. Y., 2019 Jan 1, (Accepted/In press) In : Journal of Low Frequency Noise Vibration and Active Control.

Research output: Contribution to journalArticle

Open Access
1 Citation (Scopus)

Effects of substrate structure on the warpage of flip chip IC packages

Lee, Y. S., Lin, P. Y., Wu, K. T., Lee, H. H. & Hwang, S. J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 66-70 5 p. 8625738. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Injection Molding Process Control of Servo-Hydraulic System

Lin, C. Y., Shen, F. C., Wu, K. T., Hwang, S. J. & Lee, H. H., 2019 Oct, 2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019. Meen, T-H. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 242-245 4 p. 8942784. (2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Study of exposure uniformity of UV LED exposure system for wafer-level camera lenses

Wu, K. T., Hwang, S. J. & Lee, H. H., 2019 Oct 1, In : Applied Sciences (Switzerland). 9, 19, 4110.

Research output: Contribution to journalArticle

Open Access
1 Citation (Scopus)
2018
2 Citations (Scopus)

Finite element analysis of multi-level interconnection under cyclic thermomechanical loads

Wu, K. T., Hwang, S. J., Lee, H. H. & Lin, B. Y., 2018 Feb 1, In : Microsystem Technologies. 24, 2, p. 1003-1016 14 p.

Research output: Contribution to journalArticle

2017
4 Citations (Scopus)

Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Wu, K. T., Hwang, S. J. & Lee, H. H., 2017 Aug 1, In : Journal of Electronic Materials. 46, 8, p. 5094-5106 13 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2015

Simulation of film structures for CMOS image sensors

Wu, K. T., Hwang, S. J. & Tsai, W. M., 2015 Dec 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 365-368 4 p. 7365252. (2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution