Kuo-Tsai Wu

Project Assistant Research Fellow

  • 9 Citations
  • 2 h-Index
20152020

Research output per year

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Research Output

  • 9 Citations
  • 2 h-Index
  • 9 Article
  • 3 Conference contribution
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Conference contribution
2019

Effects of substrate structure on the warpage of flip chip IC packages

Lee, Y. S., Lin, P. Y., Wu, K. T., Lee, H. H. & Hwang, S. J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 66-70 5 p. 8625738. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Injection Molding Process Control of Servo-Hydraulic System

Lin, C. Y., Shen, F. C., Wu, K. T., Hwang, S. J. & Lee, H. H., 2019 Oct, 2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019. Meen, T-H. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 242-245 4 p. 8942784. (2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2015

Simulation of film structures for CMOS image sensors

Wu, K. T., Hwang, S. J. & Tsai, W. M., 2015 Dec 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 365-368 4 p. 7365252. (2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution