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Kwang-Lung Lin

Professor

  • 3541 Citations
  • 32 h-Index
1983 …2020
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Personal profile

Education

  • 1984 PhD, Department of Materials Science and Engineering, Pennsylvania State University

Research Interests

  • Electromigration
  • Electronic Packaging Technology
  • Soldering and Interfacial Reaction
  • Solders and Soldering Technology
  • Surface Engineering

Experience

  • 1985/02 ~ 1985/07 Associate Professor, Institute of Mining and Mateirals Science, National Cheng Kung University
  • 1985/08 ~ 1989/07 Associate Professor, Department of Metallurgy and Materials Engineering, National Cheng Kung University
  • 1989/08 ~ present Professor, Department of Materials Science and Enginering, National Cheng Kung University
  • 1991/08 ~ 1994/07 Director, Institute of Mining and Mateirals Science, National Cheng Kung University
  • 1991/08 ~1994/07 Chairman, Department of Materials Science and Engineering, National Cheng Kung University
  • 1997/08 ~ 1999/07 Deputy Director, Engineering Technology Promotion Center, Department of Engineering, National Science Council
  • 1999/08 ~2002/07 Director, Precious Instrument Center, Natioanls Cheng Kung University
  • 2001/12 ~ 2004/11 Coordinator, Metals and Ceramic Science, Department of Engineering, National Science Council
  • 2002/08 ~ present Distinguished Professor, Department of Materials Science and Engineering, National Cheng Kung University
  • 2005/01 ~ 2007/12 Director General, Department of International Cooperation, National Science Council
  • 2009/02 ~ 2011/01 Deputy Executive Director, ITRI South
  • 2009/02 ~ 2011/01 Director, Nanopowder and Thin Film Technology Center, ITRI South
  • 2012/07 ~ present ASE Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
  • 2014/08 ~ present Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University

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  • 21 Similar Profiles
Soldering alloys Engineering & Materials Science
solders Physics & Astronomy
Intermetallics Engineering & Materials Science
intermetallics Physics & Astronomy
Electromigration Engineering & Materials Science
Wetting Engineering & Materials Science
Deposits Engineering & Materials Science
Substrates Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Projects 1995 2020

金屬材料電致晶粒細化機制研究

Lin, K.

19-08-01 → 20-07-31

Project: Research project

高溫無鉛銲錫Zn-25Sn-xTi的可靠性研究

Lin, K.

19-08-01 → 20-07-31

Project: Research project

鋅-錫-x鈦無鉛銲錫開發研究

Lin, K.

17-08-01 → 18-07-31

Project: Research project

銲錫接點電遷移界面行為研究

Lin, K.

17-08-01 → 18-07-31

Project: Research project

銲錫接點電遷移界面行為研究

Lin, K.

16-08-01 → 17-07-31

Project: Research project

Research Output 1983 2019

Athermal recrystallization behavior of (Sn) solid-solution at an intermetallic-free Cu/Sn interface induced by room temperature electromigration

Liang, C. L. & Lin, K-L., 2019 Feb 1, In : Materials Letters. 236, p. 607-610 4 p.

Research output: Contribution to journal › Article

Electromigration
electromigration
Intermetallics
intermetallics
Solid solutions
3 Citations (Scopus)

High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Chang, C. W. & Lin, K-L., 2019 Jan 15, In : Journal of Electronic Materials. 48, 1, p. 135-141 7 p.

Research output: Contribution to journal › Article

solders
mechanical properties
Soldering alloys
Mechanical properties
elongation

Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

Lin, J. C., Liang, C. L. & Lin, K-L., 2019 Sep 23, In : Materials Science and Engineering A. 765, 138323.

Research output: Contribution to journal › Article

solders
mechanical properties
Soldering alloys
Mechanical properties
Microhardness

Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration

Liang, C. L. & Lin, K-L., 2019 Jun 15, In : Journal of Alloys and Compounds. 789, p. 336-344 9 p.

Research output: Contribution to journal › Article

Electromigration
Supersaturation
Cathodes
Temperature
Electrodes
2 Citations (Scopus)

The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders

Guo, W. T., Liang, C. L. & Lin, K-L., 2019 Mar 18, In : Materials Science and Engineering A. 750, p. 117-124 8 p.

Research output: Contribution to journal › Article

solders
Alloying
alloying
mechanical properties
Mechanical properties

Thesis

Ag-xPd合金線與鋁打線接合經不同測試環境界面反應探討

Author: 蔚翔, 黃., 2016 Aug 24

Supervisor: Lin, K. (Supervisor)

Student thesis: Master's Thesis

Effects of the Al Pr Additions on the Wetting Oxidation and Mechanical Properties of Zn-25Sn High Temperature Pb-free Solder Alloys

Author: 禧, 牛., 2017 Feb 9

Supervisor: Lin, K. (Supervisor)

Student thesis: Doctoral Thesis

Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow

Author: 詩良, 吳., 2018 Jul 18

Supervisor: Lin, K. (Supervisor)

Student thesis: Master's Thesis

The Material Interaction Behaviors in a Cu/Sn/Cu Interconnect Induced by Room Temperature Electromigration

Author: 鍵隴, 梁., 2019

Supervisor: Lin, K. (Supervisor)

Student thesis: Doctoral Thesis

Thermodynamic Calculations and Characteristics Analysis of Inclusions in Al-Ti-Mg Complex Deoxidized Steel

Author: 瑞鴻, 陳., 2017 Aug 17

Supervisor: Lin, K. (Supervisor)

Student thesis: Master's Thesis