If you made any changes in Pure these will be visible here soon.

Personal profile

Education

  • 1984 PhD, Department of Materials Science and Engineering, Pennsylvania State University

Research Interests

  • Electromigration
  • Electronic Packaging Technology
  • Soldering and Interfacial Reaction
  • Solders and Soldering Technology
  • Surface Engineering

Experience

  • 1985/02 ~ 1985/07 Associate Professor, Institute of Mining and Mateirals Science, National Cheng Kung University
  • 1985/08 ~ 1989/07 Associate Professor, Department of Metallurgy and Materials Engineering, National Cheng Kung University
  • 1989/08 ~ present Professor, Department of Materials Science and Enginering, National Cheng Kung University
  • 1991/08 ~ 1994/07 Director, Institute of Mining and Mateirals Science, National Cheng Kung University
  • 1991/08 ~1994/07 Chairman, Department of Materials Science and Engineering, National Cheng Kung University
  • 1997/08 ~ 1999/07 Deputy Director, Engineering Technology Promotion Center, Department of Engineering, National Science Council
  • 1999/08 ~2002/07 Director, Precious Instrument Center, Natioanls Cheng Kung University
  • 2001/12 ~ 2004/11 Coordinator, Metals and Ceramic Science, Department of Engineering, National Science Council
  • 2002/08 ~ present Distinguished Professor, Department of Materials Science and Engineering, National Cheng Kung University
  • 2005/01 ~ 2007/12 Director General, Department of International Cooperation, National Science Council
  • 2009/02 ~ 2011/01 Deputy Executive Director, ITRI South
  • 2009/02 ~ 2011/01 Director, Nanopowder and Thin Film Technology Center, ITRI South
  • 2012/07 ~ present ASE Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
  • 2014/08 ~ present Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University

Fingerprint Dive into the research topics where Kwang-Lung Lin is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 14 Similar Profiles

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Projects

金屬材料電致晶粒細化機制研究

Lin, K.

19-08-0120-07-31

Project: Research project

高溫無鉛銲錫Zn-25Sn-xTi的可靠性研究

Lin, K.

19-08-0120-07-31

Project: Research project

銲錫接點電遷移界面行為研究

Lin, K.

17-08-0118-07-31

Project: Research project

鋅-錫-x鈦無鉛銲錫開發研究

Lin, K.

17-08-0118-07-31

Project: Research project

銲錫接點電遷移界面行為研究

Lin, K.

16-08-0117-07-31

Project: Research project

Research Output

Electro-work hardening of metals induced by the athermal electromigration effect

Shu, C. C., Liang, C. L. & Lin, K. L., 2020 Jan 20, In : Materials Science and Engineering A. 772, 138689.

Research output: Contribution to journalArticle

  • 1 Citation (Scopus)

    High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

    Chang, C. W. & Lin, K. L., 2019 Jan 15, In : Journal of Electronic Materials. 48, 1, p. 135-141 7 p.

    Research output: Contribution to journalArticle

  • 3 Citations (Scopus)
  • Thesis

    Ag-xPd合金線與鋁打線接合經不同測試環境界面反應探討

    Author: 蔚翔, 黃., 2016 Aug 24

    Supervisor: Lin, K. (Supervisor)

    Student thesis: Master's Thesis

    Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow

    Author: 詩良, 吳., 2018 Jul 18

    Supervisor: Lin, K. (Supervisor)

    Student thesis: Master's Thesis

    The Material Interaction Behaviors in a Cu/Sn/Cu Interconnect Induced by Room Temperature Electromigration

    Author: 鍵隴, 梁., 2019

    Supervisor: Lin, K. (Supervisor)

    Student thesis: Doctoral Thesis

    Thermodynamic Calculations and Characteristics Analysis of Inclusions in Al-Ti-Mg Complex Deoxidized Steel

    Author: 瑞鴻, 陳., 2017 Aug 17

    Supervisor: Lin, K. (Supervisor)

    Student thesis: Master's Thesis