Projects per year
Personal profile
Education
- 1984 PhD, Department of Materials Science and Engineering, Pennsylvania State University
Research Interests
- Electromigration
- Electronic Packaging Technology
- Soldering and Interfacial Reaction
- Solders and Soldering Technology
- Surface Engineering
Experience
- 1985/02 ~ 1985/07 Associate Professor, Institute of Mining and Mateirals Science, National Cheng Kung University
- 1985/08 ~ 1989/07 Associate Professor, Department of Metallurgy and Materials Engineering, National Cheng Kung University
- 1989/08 ~ present Professor, Department of Materials Science and Enginering, National Cheng Kung University
- 1991/08 ~ 1994/07 Director, Institute of Mining and Mateirals Science, National Cheng Kung University
- 1991/08 ~1994/07 Chairman, Department of Materials Science and Engineering, National Cheng Kung University
- 1997/08 ~ 1999/07 Deputy Director, Engineering Technology Promotion Center, Department of Engineering, National Science Council
- 1999/08 ~2002/07 Director, Precious Instrument Center, Natioanls Cheng Kung University
- 2001/12 ~ 2004/11 Coordinator, Metals and Ceramic Science, Department of Engineering, National Science Council
- 2002/08 ~ present Distinguished Professor, Department of Materials Science and Engineering, National Cheng Kung University
- 2005/01 ~ 2007/12 Director General, Department of International Cooperation, National Science Council
- 2009/02 ~ 2011/01 Deputy Executive Director, ITRI South
- 2009/02 ~ 2011/01 Director, Nanopowder and Thin Film Technology Center, ITRI South
- 2012/07 ~ present ASE Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
- 2014/08 ~ present Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
Fingerprint Dive into the research topics where Kwang-Lung Lin is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 21 Similar Profiles
Soldering alloys
Engineering & Materials Science
solders
Physics & Astronomy
Intermetallics
Engineering & Materials Science
intermetallics
Physics & Astronomy
Electromigration
Engineering & Materials Science
Wetting
Engineering & Materials Science
Deposits
Engineering & Materials Science
Substrates
Engineering & Materials Science
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Projects 1995 2020
Research Output 1983 2019
Athermal recrystallization behavior of (Sn) solid-solution at an intermetallic-free Cu/Sn interface induced by room temperature electromigration
Liang, C. L. & Lin, K-L., 2019 Feb 1, In : Materials Letters. 236, p. 607-610 4 p.Research output: Contribution to journal › Article
Electromigration
electromigration
Intermetallics
intermetallics
Solid solutions
2
Citations
(Scopus)
High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders
Chang, C. W. & Lin, K-L., 2019 Jan 15, In : Journal of Electronic Materials. 48, 1, p. 135-141 7 p.Research output: Contribution to journal › Article
solders
mechanical properties
Soldering alloys
Mechanical properties
elongation
Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders
Lin, J. C., Liang, C. L. & Lin, K-L., 2019 Sep 23, In : Materials Science and Engineering A. 765, 138323.Research output: Contribution to journal › Article
solders
mechanical properties
Soldering alloys
Mechanical properties
Microhardness
Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration
Liang, C. L. & Lin, K-L., 2019 Jun 15, In : Journal of Alloys and Compounds. p. 336-344 9 p.Research output: Contribution to journal › Article
Electromigration
Supersaturation
Cathodes
Temperature
Electrodes
2
Citations
(Scopus)
The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders
Guo, W. T., Liang, C. L. & Lin, K-L., 2019 Mar 18, In : Materials Science and Engineering A. 750, p. 117-124 8 p.Research output: Contribution to journal › Article
solders
Alloying
alloying
mechanical properties
Mechanical properties
Thesis
Ag-xPd合金線與鋁打線接合經不同測試環境界面反應探討
Author: 蔚翔, 黃., 2016 Aug 24Supervisor: Lin, K. (Supervisor)
Student thesis: Master's Thesis
Effects of the Al Pr Additions on the Wetting Oxidation and Mechanical Properties of Zn-25Sn High Temperature Pb-free Solder Alloys
Author: 禧, 牛., 2017 Feb 9Supervisor: Lin, K. (Supervisor)
Student thesis: Doctoral Thesis
Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow
Author: 詩良, 吳., 2018 Jul 18Supervisor: Lin, K. (Supervisor)
Student thesis: Master's Thesis
The Material Interaction Behaviors in a Cu/Sn/Cu Interconnect Induced by Room Temperature Electromigration
Author: 鍵隴, 梁., 2019Supervisor: Lin, K. (Supervisor)
Student thesis: Doctoral Thesis
Thermodynamic Calculations and Characteristics Analysis of Inclusions in Al-Ti-Mg Complex Deoxidized Steel
Author: 瑞鴻, 陳., 2017 Aug 17Supervisor: Lin, K. (Supervisor)
Student thesis: Master's Thesis