Projects per year
Personal profile
Education
- 1984 PhD, Department of Materials Science and Engineering, Pennsylvania State University
Research Interests
- Electromigration
- Electronic Packaging Technology
- Soldering and Interfacial Reaction
- Solders and Soldering Technology
- Surface Engineering
Experience
- 1985/02 ~ 1985/07 Associate Professor, Institute of Mining and Mateirals Science, National Cheng Kung University
- 1985/08 ~ 1989/07 Associate Professor, Department of Metallurgy and Materials Engineering, National Cheng Kung University
- 1989/08 ~ present Professor, Department of Materials Science and Enginering, National Cheng Kung University
- 1991/08 ~ 1994/07 Director, Institute of Mining and Mateirals Science, National Cheng Kung University
- 1991/08 ~1994/07 Chairman, Department of Materials Science and Engineering, National Cheng Kung University
- 1997/08 ~ 1999/07 Deputy Director, Engineering Technology Promotion Center, Department of Engineering, National Science Council
- 1999/08 ~2002/07 Director, Precious Instrument Center, Natioanls Cheng Kung University
- 2001/12 ~ 2004/11 Coordinator, Metals and Ceramic Science, Department of Engineering, National Science Council
- 2002/08 ~ present Distinguished Professor, Department of Materials Science and Engineering, National Cheng Kung University
- 2005/01 ~ 2007/12 Director General, Department of International Cooperation, National Science Council
- 2009/02 ~ 2011/01 Deputy Executive Director, ITRI South
- 2009/02 ~ 2011/01 Director, Nanopowder and Thin Film Technology Center, ITRI South
- 2012/07 ~ present ASE Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
- 2014/08 ~ present Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
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Projects
Research output
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Fundamentals of Solder Alloys in 3D Packaging
Lin, K. L., 2021, Springer Series in Advanced Microelectronics. Springer Science and Business Media Deutschland GmbH, p. 329-346 18 p. (Springer Series in Advanced Microelectronics; vol. 64).Research output: Chapter in Book/Report/Conference proceeding › Chapter
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A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property
Liao, Y. H., Chen, C. H., Liang, C. L., Lin, K. L. & Wu, A. T., 2020 Nov, In: Acta Materialia. 200, p. 200-210 11 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density
Liang, C. L., Lin, Y. S., Kao, C. L., Tarng, D., Wang, S. B., Hung, Y. C., Lin, G. T. & Lin, K. L., 2020 Dec 1, In: Materials Chemistry and Physics. 256, 123680.Research output: Contribution to journal › Article › peer-review
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Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging
Liang, C. L., Lin, Y. S., Kao, C. L., Tarng, D., Wang, S. B., Hung, Y. C. & Lin, K. L., 2020 Jun, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 361-366 6 p. 9159312. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Electromigration Reliability of Advanced High-Density Fan-Out Packaging with Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
Liang, C. L., Lin, Y. S., Kao, C. L., Tarng, D., Wang, S. B., Hung, Y. C., Lin, G. T. & Lin, K. L., 2020 Sep, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 9, p. 1438-1445 8 p., 9099960.Research output: Contribution to journal › Article › peer-review