Projects per year
Personal profile
Education
- 1984 PhD, Department of Materials Science and Engineering, Pennsylvania State University
Research Interests
- Electromigration
- Electronic Packaging Technology
- Soldering and Interfacial Reaction
- Solders and Soldering Technology
- Surface Engineering
Experience
- 1985/02 ~ 1985/07 Associate Professor, Institute of Mining and Mateirals Science, National Cheng Kung University
- 1985/08 ~ 1989/07 Associate Professor, Department of Metallurgy and Materials Engineering, National Cheng Kung University
- 1989/08 ~ present Professor, Department of Materials Science and Enginering, National Cheng Kung University
- 1991/08 ~ 1994/07 Director, Institute of Mining and Mateirals Science, National Cheng Kung University
- 1991/08 ~1994/07 Chairman, Department of Materials Science and Engineering, National Cheng Kung University
- 1997/08 ~ 1999/07 Deputy Director, Engineering Technology Promotion Center, Department of Engineering, National Science Council
- 1999/08 ~2002/07 Director, Precious Instrument Center, Natioanls Cheng Kung University
- 2001/12 ~ 2004/11 Coordinator, Metals and Ceramic Science, Department of Engineering, National Science Council
- 2002/08 ~ present Distinguished Professor, Department of Materials Science and Engineering, National Cheng Kung University
- 2005/01 ~ 2007/12 Director General, Department of International Cooperation, National Science Council
- 2009/02 ~ 2011/01 Deputy Executive Director, ITRI South
- 2009/02 ~ 2011/01 Director, Nanopowder and Thin Film Technology Center, ITRI South
- 2012/07 ~ present ASE Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
- 2014/08 ~ present Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.
- 22 Similar Profiles
Soldering alloys
Engineering & Materials Science
solders
Physics & Astronomy
Intermetallics
Engineering & Materials Science
intermetallics
Physics & Astronomy
Deposits
Engineering & Materials Science
Electromigration
Engineering & Materials Science
Wetting
Engineering & Materials Science
Substrates
Engineering & Materials Science
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Research Output 1983 2019
Athermal recrystallization behavior of (Sn) solid-solution at an intermetallic-free Cu/Sn interface induced by room temperature electromigration
Liang, C. L. & Lin, K-L., 2019 Feb 1, In : Materials Letters. 236, p. 607-610 4 p.Research output: Contribution to journal › Article
Nanocrystalline alloys
metallurgy
copper alloys
Electromigration
electromigration
Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing
Lin, C. Y., Chiu, T. C. & Lin, K-L., 2018 Mar 21, In : Journal of Applied Physics. 123, 11, 115102.Research output: Contribution to journal › Article
solders
intermetallics
dissolving
electric current
ambient temperature
Crystal Structure Variations of Sn Nanoparticles upon Heating
Mittal, J. & Lin, K-L., 2018 Apr 1, In : Journal of Electronic Materials. 47, 4, p. 2394-2401 8 p.Research output: Contribution to journal › Article
Tin
Metal nanoparticles
Calorimetry
High resolution transmission electron microscopy
Calorimeters
Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study
Mittal, J. & Lin, K-L., 2018 Jan 1, In : Soldering and Surface Mount Technology. 30, 3, p. 137-144 8 p.Research output: Contribution to journal › Article
solders
Soldering alloys
Aging of materials
intermetallics
Liquids
Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi
Chang, C. W. & Lin, K-L., 2018 Apr 27, (Accepted/In press) In : Journal of Materials Science: Materials in Electronics. p. 1-7 7 p.Research output: Contribution to journal › Article
solders
Toughness
toughness
mechanical properties
Mechanical properties