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Personal profile

Education

  • 1984 PhD, Department of Materials Science and Engineering, Pennsylvania State University

Research Interests

  • Electromigration
  • Electronic Packaging Technology
  • Soldering and Interfacial Reaction
  • Solders and Soldering Technology
  • Surface Engineering

Experience

  • 1985/02 ~ 1985/07 Associate Professor, Institute of Mining and Mateirals Science, National Cheng Kung University
  • 1985/08 ~ 1989/07 Associate Professor, Department of Metallurgy and Materials Engineering, National Cheng Kung University
  • 1989/08 ~ present Professor, Department of Materials Science and Enginering, National Cheng Kung University
  • 1991/08 ~ 1994/07 Director, Institute of Mining and Mateirals Science, National Cheng Kung University
  • 1991/08 ~1994/07 Chairman, Department of Materials Science and Engineering, National Cheng Kung University
  • 1997/08 ~ 1999/07 Deputy Director, Engineering Technology Promotion Center, Department of Engineering, National Science Council
  • 1999/08 ~2002/07 Director, Precious Instrument Center, Natioanls Cheng Kung University
  • 2001/12 ~ 2004/11 Coordinator, Metals and Ceramic Science, Department of Engineering, National Science Council
  • 2002/08 ~ present Distinguished Professor, Department of Materials Science and Engineering, National Cheng Kung University
  • 2005/01 ~ 2007/12 Director General, Department of International Cooperation, National Science Council
  • 2009/02 ~ 2011/01 Deputy Executive Director, ITRI South
  • 2009/02 ~ 2011/01 Director, Nanopowder and Thin Film Technology Center, ITRI South
  • 2012/07 ~ present ASE Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
  • 2014/08 ~ present Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University

Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

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Soldering alloys Engineering & Materials Science
solders Physics & Astronomy
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intermetallics Physics & Astronomy
Deposits Engineering & Materials Science
Electromigration Engineering & Materials Science
Wetting Engineering & Materials Science
Substrates Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Projects 1995 2018

銲錫接點電遷移界面行為研究

Lin, K.

17-08-0118-07-31

Project: Research projectResearch

鋅-錫-x鈦無鉛銲錫開發研究

Lin, K.

17-08-0118-07-31

Project: Research projectResearch

銲錫接點電遷移界面行為研究

Lin, K.

16-08-0117-07-31

Project: Research projectResearch

鋅-錫-x鈦無鉛銲錫開發研究

Lin, K.

16-08-0117-07-31

Project: Research projectResearch

鋅-錫-x鈦無鉛銲錫開發研究

Lin, K.

15-08-0116-07-31

Project: Research projectResearch

Research Output 1983 2019

Nanocrystalline alloys
metallurgy
copper alloys
Electromigration
electromigration

Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing

Lin, C. Y., Chiu, T. C. & Lin, K-L., 2018 Mar 21, In : Journal of Applied Physics. 123, 11, 115102.

Research output: Contribution to journalArticle

solders
intermetallics
dissolving
electric current
ambient temperature

Crystal Structure Variations of Sn Nanoparticles upon Heating

Mittal, J. & Lin, K-L., 2018 Apr 1, In : Journal of Electronic Materials. 47, 4, p. 2394-2401 8 p.

Research output: Contribution to journalArticle

Tin
Metal nanoparticles
Calorimetry
High resolution transmission electron microscopy
Calorimeters
solders
Soldering alloys
Aging of materials
intermetallics
Liquids
1 Citations

Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

Chang, C. W. & Lin, K-L., 2018 Apr 27, (Accepted/In press) In : Journal of Materials Science: Materials in Electronics. p. 1-7 7 p.

Research output: Contribution to journalArticle

solders
Toughness
toughness
mechanical properties
Mechanical properties