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Personal profile

Education

  • 1984 PhD, Department of Materials Science and Engineering, Pennsylvania State University

Research Interests

  • Electromigration
  • Electronic Packaging Technology
  • Soldering and Interfacial Reaction
  • Solders and Soldering Technology
  • Surface Engineering

Experience

  • 1985/02 ~ 1985/07 Associate Professor, Institute of Mining and Mateirals Science, National Cheng Kung University
  • 1985/08 ~ 1989/07 Associate Professor, Department of Metallurgy and Materials Engineering, National Cheng Kung University
  • 1989/08 ~ present Professor, Department of Materials Science and Enginering, National Cheng Kung University
  • 1991/08 ~ 1994/07 Director, Institute of Mining and Mateirals Science, National Cheng Kung University
  • 1991/08 ~1994/07 Chairman, Department of Materials Science and Engineering, National Cheng Kung University
  • 1997/08 ~ 1999/07 Deputy Director, Engineering Technology Promotion Center, Department of Engineering, National Science Council
  • 1999/08 ~2002/07 Director, Precious Instrument Center, Natioanls Cheng Kung University
  • 2001/12 ~ 2004/11 Coordinator, Metals and Ceramic Science, Department of Engineering, National Science Council
  • 2002/08 ~ present Distinguished Professor, Department of Materials Science and Engineering, National Cheng Kung University
  • 2005/01 ~ 2007/12 Director General, Department of International Cooperation, National Science Council
  • 2009/02 ~ 2011/01 Deputy Executive Director, ITRI South
  • 2009/02 ~ 2011/01 Director, Nanopowder and Thin Film Technology Center, ITRI South
  • 2012/07 ~ present ASE Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
  • 2014/08 ~ present Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University

Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

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Deposits Engineering & Materials Science
Substrates Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Projects 1995 2018

銲錫接點電遷移界面行為研究

Lin, K.

17-08-0118-07-31

Project: Research project

鋅-錫-x鈦無鉛銲錫開發研究

Lin, K.

17-08-0118-07-31

Project: Research project

鋅-錫-x鈦無鉛銲錫開發研究

Lin, K.

16-08-0117-07-31

Project: Research project

銲錫接點電遷移界面行為研究

Lin, K.

16-08-0117-07-31

Project: Research project

銲錫接點電遷移界面行為研究

Lin, K.

15-08-0116-07-31

Project: Research project

Research Output 1983 2019

Electromigration
electromigration
Intermetallics
intermetallics
Solid solutions

High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Chang, C. W. & Lin, K-L., 2019 Jan 15, In : Journal of Electronic Materials. 48, 1, p. 135-141 7 p.

Research output: Contribution to journalArticle

solders
mechanical properties
Soldering alloys
Mechanical properties
elongation

Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration

Liang, C. L. & Lin, K-L., 2019 Jun 15, In : Journal of Alloys and Compounds. 789, p. 336-344 9 p.

Research output: Contribution to journalArticle

solders
Alloying
alloying
mechanical properties
Mechanical properties

Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing

Lin, C. Y., Chiu, T. C. & Lin, K-L., 2018 Mar 21, In : Journal of Applied Physics. 123, 11, 115102.

Research output: Contribution to journalArticle

solders
intermetallics
dissolving
electric current
ambient temperature