Projects per year
Personal profile
Education
- 1984 PhD, Department of Materials Science and Engineering, Pennsylvania State University
Research Interests
- Electromigration
- Electronic Packaging Technology
- Soldering and Interfacial Reaction
- Solders and Soldering Technology
- Surface Engineering
Experience
- 1985/02 ~ 1985/07 Associate Professor, Institute of Mining and Mateirals Science, National Cheng Kung University
- 1985/08 ~ 1989/07 Associate Professor, Department of Metallurgy and Materials Engineering, National Cheng Kung University
- 1989/08 ~ present Professor, Department of Materials Science and Enginering, National Cheng Kung University
- 1991/08 ~ 1994/07 Director, Institute of Mining and Mateirals Science, National Cheng Kung University
- 1991/08 ~1994/07 Chairman, Department of Materials Science and Engineering, National Cheng Kung University
- 1997/08 ~ 1999/07 Deputy Director, Engineering Technology Promotion Center, Department of Engineering, National Science Council
- 1999/08 ~2002/07 Director, Precious Instrument Center, Natioanls Cheng Kung University
- 2001/12 ~ 2004/11 Coordinator, Metals and Ceramic Science, Department of Engineering, National Science Council
- 2002/08 ~ present Distinguished Professor, Department of Materials Science and Engineering, National Cheng Kung University
- 2005/01 ~ 2007/12 Director General, Department of International Cooperation, National Science Council
- 2009/02 ~ 2011/01 Deputy Executive Director, ITRI South
- 2009/02 ~ 2011/01 Director, Nanopowder and Thin Film Technology Center, ITRI South
- 2012/07 ~ present ASE Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
- 2014/08 ~ present Chair Professor, Department of Materials Science and Engineering, National Cheng Kung University
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 3 Good Health and Well-being -
SDG 6 Clean Water and Sanitation -
SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure -
SDG 17 Partnerships for the Goals
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 75 Finished
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Electromigration Reliability and Failure Mechanisms in Novel 3D Cu Stagger-via Interconnects for Advanced High-Density Fan-Out Packaging
Shao, K. J., Chiu, M. C., Hu, J. Y., Liang, C.-L., Tsai, M. Y., Lin, Y. S., Wang, C. C., Hung, C. P. & Lin, K. L., 2026, (Accepted/In press) In: JOM.Research output: Contribution to journal › Article › peer-review
2 Link opens in a new tab Citations (Scopus) -
The mechanism of electroplasticity of Ti6Al4V
Sie, Y. C. & Lin, K. L., 2026 Jan, In: Materials Science and Engineering: A. 951, 149603.Research output: Contribution to journal › Article › peer-review
2 Link opens in a new tab Citations (Scopus) -
An electromigration study of novel 3D Cu stack-via interconnects for advanced high-density fan-out packaging
Shao, K. J., Chiu, M. C., Liang, C. L., Tsai, M. Y., Lin, Y. S., Wang, C. C., Hung, C. P. & Lin, K. L., 2025 Mar 15, In: Materials Science in Semiconductor Processing. 188, 109256.Research output: Contribution to journal › Article › peer-review
10 Link opens in a new tab Citations (Scopus) -
Direct Observation of Void Nucleation and Growth in a 2-μm-Wide Cu Redistribution Line During In Situ Electromigration
Liang, C. L., Lin, Y. S., Tsai, M. Y., Chiu, M. C., Wang, S. B., Hung, C. P. & Lin, K. L., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 101-102 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
8 Link opens in a new tab Citations (Scopus) -
Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of Pure Copper
Wang, C. Y. & Lin, K. L., 2024, 2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution