Calculated based on number of publications stored in Pure and citations from Scopus
1983 …2024

Research activity per year

Network

Ying Ta Chiu

  • National Cheng Kung University
  • Advanced Semiconductor Engineering, Inc.
  • Advances Semiconductor Engineering, Inc.
  • Advances Semiconductor Engineering Group
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Central Product Solutions
  • Product Characterization
  • Central Product Solutions
  • Department of Materials Science and Engineering

External person

Jagjiwan Mittal

  • National Cheng Kung University
  • Amity University, Noida
  • Department of Materials Science and Engineering
  • Amity Institute of Nanotechnology
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Tsung Chieh Chiu

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Chemical Engineering
  • Department of Chemical Engineering
  • Department of Chemical Engineering

External person

Yi Shao Lai

  • Advanced Semiconductor Engineering, Inc.
  • Advances Semiconductor Engineering, Inc.
  • Group Research and Development
  • Central Labs
  • Central Product Solutions
  • Central Product Solutions
  • Group R and D
  • Stress-Reliability Laboratory
  • Central Product Solutions
  • Advanced Semiconductor Engineering, Inc.
  • Material Lab
  • National Cheng Kung University
  • Material Lab
  • Product Characterization
  • Department of Mechanical Engineering
  • Nantze Export Processing Zone

External person

U. S. Mohanty

  • Murdoch University
  • National Cheng Kung University
  • National Yang Ming Chiao Tung University
  • Department of Chemistry
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Applied Chemistry
  • Center for Micro/Nano Science and Technology
  • Department of Materials Science and Engineering

External person

Yu Wei Lin

  • National Cheng Kung University
  • Precision Packaging Materials Corp.

External person

Chun Jen Chen

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Shih Ming Kuo

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Center for Micro/Nano Science and Technology

External person

Po Cheng Shih

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

K. I. Chen

  • National Cheng Kung University
  • Tong Fang College of Technology and Commerce
  • Tung Fang Design University
  • Tung Fang Design Institute
  • Tung Fang Design Institute
  • Department of Materials Science and Engineering
  • Dept. of Electronics and Information
  • Department of Electronics Engineering and Computer Science
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Electronics Engineering and Computer Science
  • Department of Electronics Engineering and Computer Science
  • Department of Electronics Engineering and Computer Science
  • Tung Fang Design University
  • Tung Fang Design Institute

External person

Chwan Ying Lee

  • National Cheng Kung University
  • Department of Materials Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Jenn Ming Song

  • National Dong Hwa University
  • National Cheng Kung University
  • National Chung Hsing University
  • Nan Ya Plastics Corporation
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Albert T. Wu

  • National Central University
  • Department of Chemical and Materials Engineering

External person

Yung Sheng Lin

  • Advanced Semiconductor Engineering, Inc.

External person

C. M. Chuang

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Chin Li Kao

  • Advanced Semiconductor Engineering, Inc.
  • National Cheng Kung University
  • Department of Mechanical Engineering
  • Group R and D

External person

Shan Bo Wang

  • Advanced Semiconductor Engineering, Inc.
  • National Cheng Kung University

External person

Nai Shuo Liu

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Huey Chang Wang

  • National Cheng Kung University
  • Department of Materials Engineering

External person

Jin Kuo Ho

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Engineering
  • Department of Materials Science and Engineering

External person

Y. L. Huang

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Chang Ho Yu

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

David Tarng

  • Advanced Semiconductor Engineering, Inc.
  • National Cheng Kung University

External person

Chia Wei Huang

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Y. J. Ho

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science

External person

Chiu Wen Lee

  • Advanced Semiconductor Engineering, Inc.
  • Product Characterization
  • Material Lab
  • Central Product Solutions
  • National Cheng Kung University

External person

Yu Hsiang Hsiao

  • Advanced Semiconductor Engineering, Inc.
  • Product Characterization
  • Central Product Solutions

External person

Jen Che Hsu

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

B. Salam

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Xi Niu

  • National Cheng Kung University
  • Chongqing Vocational College of Public Transportation
  • Department of Materials Science and Engineering
  • Scientific Research Management Office

External person

Wei Luen Jang

  • National Cheng Kung University
  • National Synchrotron Radiation Research Center Taiwan
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Shou Chang Cheng

  • Tung Fang Design University
  • Tong Fang College of Technology and Commerce
  • National Cheng Kung University
  • Tung Fang Design Institute
  • Department of Electronics Engineering and Computer Science
  • Department of Materials Science and Engineering
  • Department of Electronics Engineering and Computer Science
  • Department of Electronics Engineering and Computer Science
  • Tung Fang Design University

External person

D. S. Liu

  • National Chung Cheng University
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering

External person

K. Osseo-Asare

  • Pennsylvania State University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Ping Feng Yang

  • Advanced Semiconductor Engineering, Inc.
  • Advanced Semiconductor Engineering, Inc.
  • Central Product Solutions
  • Material Lab
  • Central Labs
  • Material Lab
  • Group R and D
  • Product Characterization
  • Central Product Solutions

External person

Pei Chi Liu

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Hui Min Hsu

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Shiuh Yuan Chang

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Chiao Wen Chen

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Chia Ling Shih

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Chien Cheng Pan

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Ju Tung Lee

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Metallurgy and Materials Engineering
  • Materials Corrosion Prevention Center
  • Department of Materials Science

External person

Chien Tai Lin

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Department of Materials Science and Engineering

External person

Yeh Hsiu Liu

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Yun Ching Hung

  • Advanced Semiconductor Engineering, Inc.
  • National Cheng Kung University

External person

Po Jen Lai

  • National Cheng Kung University
  • Department of Materials Engineering

External person

Che Wei Chang

  • National Cheng Kung University
  • Lunghwa University of Science and Technology
  • Chinese Culture University

External person

Yi Cheng Liu

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Po Jen Cheng

  • Advanced Semiconductor Engineering, Inc.

External person

Ting Chun Lin

  • Advanced Semiconductor Engineering, Inc.

External person

Tzy Pin Liu

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

T. K. Yeh

  • National Cheng Kung University

External person

Shih Hung Lin

  • National Cheng Kung University
  • Tunghai University
  • National Taiwan University
  • Chung Shan Medical University
  • Institute of Electro-Optical Science and Engineering
  • Advanced Optoelectronic Technology Center
  • Department of Photonics
  • Department of Chemistry and Advanced Optoelectronic Technology Center
  • Department of Optometry

External person

Ren You Wang

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

R. Weil

  • Stevens Institute of Technology

External person

Wei Yu Chen

  • National Cheng Kung University

External person

C. T. Kuo

  • National Sun Yat-sen University
  • National Cheng Kung University
  • Department of Physics
  • Department of Materials and Optoelectronic Science/Center for Nanoscience and Nanotechnology
  • Physics
  • Advanced Optoelectronic Technology Center
  • Shu-Zen College of Medicine and Management

External person

Jun Wen Chen

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

C. Robert Kao

  • National Central University
  • National Taiwan University

External person

Ming Yeong Hwang

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

G. S. Shen

  • ChipMOS Technologies, Inc.
  • ChipMOS Technologies
  • ChipMOS Technologies, Inc.
  • New Product Development Management Center
  • Research and Strategy Development Center
  • Research and Strategy Development Center
  • ChipMOS Technologies, Inc.
  • National Cheng Kung University

External person

Chang Lin Hsu

  • National Chung Cheng University
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering

External person

Kun Tzu Hsu

  • United Microelectronics Corporation

External person

Wun Bin Ke

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

T. D. Ji

  • National Cheng Kung University
  • Institute of Electro-Optical Science and Engineering
  • Advanced Optoelectronic Technology Center

External person

Yi Han Liao

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Srini Chada

  • Honeywell
  • Medtronic, Inc.

External person

Chia Yuan Kuo

  • National Chung Cheng University
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering

External person

Teng Chun Hsuan

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

James P. Lucas

  • Michigan State University

External person

I. Sheng Wang

  • National Cheng Kung University

External person

Gao Tian Lin

  • VIACPU Technologies

External person

R. S. Lai

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Po Cheng Shi

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Jeng Chi Lin

  • Department of Materials Science and Engineering
  • National Cheng Kung University

External person

Andy Y G Fuh

  • National Cheng Kung University
  • Advanced Optoelectronic Technology Center
  • Institute of Electro-Optical Science and Engineering
  • Department of Physics
  • Department of Physiology
  • Department of Physics
  • Department of Photonics

External person

Jia Wei Hwang

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Chung Li Dong

  • National Synchrotron Radiation Research Center Taiwan
  • Tamkang University
  • Department of Physics
  • Scientific Research Division
  • Department of Physics

External person

T. S. Mo

  • Kun Shan University
  • National Cheng Kung University
  • Department of Electronic Engineering
  • Department of Physiology
  • Department of Electronic Engineering
  • Department of Electronic Engineering
  • Department of Electro-Optical Engineering
  • Department of Electrical Engineering
  • Advanced Optoelectronic Technology Center
  • Department of Physics
  • Nano Technology RandD Center

External person

Jieh Ting Chang

  • National Cheng Kung University
  • Department of Materials Science and Engineering (29)

External person

Wei Hsiang Huang

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Electrical Engineering

External person

Cheng Dau Wu

  • Metal Industries Research & Development Centre
  • Metal Industries Research and Development Center

External person

H. C. Yeh

  • National Kaohsiung First University of Science and Technology
  • National Cheng Kung University
  • Graduate Institute of Electro-Optical Engineering
  • Institute of Electro-Optical Science and Engineering
  • Institute of Electrical Engineering
  • Advanced Optoelectronic Technology Center
  • Graduate Institute of Electrical Engineering
  • National Kaohsiung University of Science and Technology
  • Graduate Institute of Electro-Optical Engineering
  • Graduate Institute of Electrical Engineering

External person

Tai Siang Wang

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

C. F. Yang

  • National Cheng Kung University

External person

Wen Hsiuan Chao

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Laura Turbini

  • Research in Motion
  • University of Toronto

External person

Li Hsiang Wen

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Louie Huang

  • National Cheng Kung University
  • Advanced Semiconductor Engineering, Inc.
  • Department of Materials Science and Engineering

External person

Min Yan Tsai

  • Advanced Semiconductor Engineering, Inc.

External person

Tzu Hsing Chiang

  • Advanced Semiconductor Engineering, Inc.

External person

Fang I. Li

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

S. C. Liu

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Bradford J. Factor

  • Advanced Semiconductor Engineering, Inc.
  • Packaging Technology

External person

Ya Te Liu

  • United Microelectronics Corporation
  • United Microelectronics Corporated, Ltd.

External person

Jin Yu

  • Korea Advanced Institute of Science and Technology

External person

Ching Hwei Chue

  • National Cheng Kung University
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering

External person

Wei Ting Guo

  • Department of Materials Science and Engineering
  • National Cheng Kung University

External person

Chen Yi Lin

  • National Cheng Kung University
  • Department of Environmental Engineering

External person

Takahiro Nakamura

  • Tohoku University
  • Institute of Multidisciplinary Research for Advanced Materials

External person

Richard Markuszewski

  • United States Department of Energy

External person

J. T. Chang

  • National Cheng Kung University

External person

Jin Kuo Ho Ho

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Yin Fa Chen

  • Advanced Semiconductor Engineering, Inc.

External person

Min Chieh Yang

  • Industrial Technology Research Institute of Taiwan

External person

Yu Lan Chang

  • Department of Materials Science and Engineering
  • National Cheng Kung University

External person

Jun Jia Huang

  • National Cheng Kung University

External person

Chih Chun Hsiao

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Jen Kuang Fang

  • Advanced Semiconductor Engineering, Inc.

External person

Ger Pin Lin

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Chien I. Lin

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Jud Ready

  • MicroCoating Technologies

External person

Yau Wen Hu

  • Industrial Technology Research Institute of Taiwan
  • Electronic Research Organization Service

External person

I. M. Hsu

  • National Cheng Kung University
  • Department of Materials Engineering

External person

C. J. Hsu

  • National Cheng Kung University
  • Department of Materials Engineering

External person

S. H. Lee

  • Advanced Semiconductor Engineering, Inc.
  • Product Characterization

External person

Chih Chao Yang

  • Industrial Technology Research Institute of Taiwan
  • Nano-Powder and Thin Film Technology Center
  • Nano-Powder and Thin Film Technology Center
  • National Taiwan University

External person

Yuan Po Lee

  • National Cheng Kung University
  • Department of Materials Engineering

External person

Y. M. Shu

  • National Cheng Kung University

External person

Ssu Wei Lee

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Su Yau Chen

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

n. C.Y. Lee

  • National Cheng Kung University

External person

Ming Jin Chung

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Mu Chang Shieh

  • Institute of Nuclear Energy Research Taiwan
  • Institute of Nuclear Energy Research

External person

M. W. Frischa

  • National Cheng Kung University

External person

Chien Lung Liang

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

P. H. Tsai

  • University of New South Wales

External person

Chih Hau Wu

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

I. Ting Lin

  • Advanced Semiconductor Engineering, Inc.

External person

Jr Wei Peng

  • Advanced Semiconductor Engineering, Inc.

External person

Fu Guo

  • Beijing University of Technology
  • Michigan State University

External person

Michael H.M. Lin

  • Industrial Technology Research Institute of Taiwan
  • Electronic Research Organization Service

External person

An Hsuan Hsu

  • Advanced Semiconductor Engineering, Inc.

External person

Jian Yang He

  • Department of Materials Science and Engineering
  • National Cheng Kung University

External person

Pin Chu Liang

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Shin Kuo Chen

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Mei Chen Su

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Chiao Chan Huang

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Shuan Yu Huang

  • Chung Shan Medical University
  • Kaohsiung Medical University
  • National Cheng Kung University
  • Department of Optometry
  • School of Optometry
  • Department of Ophthalmology
  • Department of Optometry
  • Advanced Optoelectronic Technology Center
  • Department of Optometry
  • Taiwan Department of Ophthalmology Chung Shan Medical University Hospital
  • School of Optometry
  • College of Shu Zen Medicine and Management

External person

Kuen Song Lin

  • National Cheng Kung University
  • Yuan Ze University
  • WuFeng University
  • Department of Environmental Engineering
  • Department of Environmental Engineering
  • Department of Chemical Engineering
  • Department of Chemical Engineering and Materials Science
  • Chen-Kong University

External person

Li Min Sun

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Shoji Uegaki

  • Marketing and Service
  • ASE Group

External person

Han Chie Huang

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Jenq Gong Duh

  • National Tsing Hua University
  • Department of Material Science and Engineering
  • Department of Materials Science and Engineering

External person

Chin Li Kao

  • Advanced Semiconductor Engineering, Inc.
  • National Cheng Kung University

External person

Wei Cheng Chen

  • National Cheng Kung University

External person

Jang Jien-Ming

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Chien Fan Chen

  • Advanced Semiconductor Engineering, Inc.
  • Bumping Process Engineering Division

External person

Po Yi Yeh

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Nik Chawla

  • Arizona State University

External person

Dong Chang Liu

  • United States Department of Energy

External person

Yao Ling Kuo

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Lin Tai-Horng

  • National Cheng Kung University

External person

W. J. Deng

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

M. H. Chen

  • Advanced Semiconductor Engineering, Inc.

External person

Hsin Yi Lee

  • National Synchrotron Radiation Research Center Taiwan
  • Research Division

External person

Jr Wei Peng

  • Advanced Semiconductor Engineering, Inc.

External person

Yong Sheng Zou

  • Advanced Semiconductor Engineering, Inc.

External person

Yun Kai Cheng

  • Precision Packaging Materials Corp.

External person

Chia Hao Liu

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Wei Liang Chen

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Yen Hsiang Fang

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Charles Hwang

  • National Kaohsiung Institute of Marine Technology
  • Department of Electronic Communication Engineering
  • Department of Electronic Communication Engineering
  • National Kaohsiung University of Science and Technology

External person

Yu Hsiu Shao

  • Advanced Semiconductor Engineering, Inc.
  • Central Product Solutions

External person

Y. K. Wu

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Yi Chen

  • Advanced Semiconductor Engineering, Inc.

External person

Peishan Hsieh

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Hui Tzu Hung

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Long Charng-Shyang

  • National Cheng Kung University
  • Department of Materials Engineering

External person

Chih Pin Hung

  • Advanced Semiconductor Engineering, Inc.
  • Material Lab

External person

Joseph Lik Hang Chau

  • Industrial Technology Research Institute of Taiwan
  • Nano-Powder and Thin Film Technology Center
  • Nanopowder Research Department
  • Nano-Powder and Thin Film Technology Center

External person

Shunichi Sato

  • Tohoku University
  • Institute of Multidisciplinary Research for Advanced Materials

External person

Thomas Bieler

  • Michigan State University

External person

Chang Chi Lee

  • Advanced Semiconductor Engineering, Inc.
  • National Cheng Kung University
  • Department of Engineering Science
  • Central Labs
  • Thermal Laboratory

External person

Chung Wei Cheng

  • Industrial Technology Research Institute of Taiwan
  • MIRL/ITRI
  • National Yang Ming Chiao Tung University
  • National Cheng Kung University
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Laser Application Technology Center
  • Center for Measurement Standards Industrial Technology

External person

S. Y. Huang

  • Chung Shan Medical University
  • National Cheng Kung University
  • Institute of Electro-Optical Science and Engineering

External person

Sheng Wen Yang

  • Advanced Semiconductor Engineering, Inc.

External person

Iver Anderson

  • Iowa State University
  • Ames Laboratory

External person

Wen Jung Li

  • National Cheng Kung University

External person

Steven Yao

  • Win Bond Electronics Corporation

External person

C. L. Chen

  • Winbond Electronics Corporation
  • National Cheng Kung University
  • Winbond Electronics Corporation

External person

Min Lung Huang

  • Advanced Semiconductor Engineering, Inc.

External person

Darwin Sarwono

  • Department of Materials Science and Engineering
  • National Cheng Kung University

External person

Wu Chien Liu

  • National Cheng Kung University
  • Department of Materials Engineering

External person

Ting Hui Wang

  • National Cheng Kung University

External person

K. Desai

  • Stevens Institute of Technology

External person

Tzy Ping Liu

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Wei Chieh Wang

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Yen Cheng Huang

  • National Cheng Kung University

External person

Jiang Long Liang

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Chun Yen Chen

  • Industrial Technology Research Institute of Taiwan
  • Nano-Powder and Thin Film Technology Center
  • National Taiwan University

External person

Renato G. Bautista

  • United States Department of Energy

External person

Chin Wei Liu

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Min Chi Liu

  • Advanced Semiconductor Engineering, Inc.
  • Bumping Process Engineering Division

External person

Buo Ching Kou

  • National Cheng Kung University
  • Department of Mechanical Engineering

External person

H. Y. Kung

  • Advanced Semiconductor Engineering, Inc.
  • Product Characterization

External person

Andre Lee

  • Michigan State University

External person

Yi Feng Lai

  • National Cheng Kung University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Chih Chi Shu

  • Department of Materials Science and Engineering
  • National Cheng Kung University

External person

Wei Chih Huang

  • National Cheng Kung University

External person

Sean Wu

  • Tong Fang College of Technology and Commerce
  • Tung Fang Design Institute
  • Tung Fang Design Institute
  • Tung-Fang Design University
  • Tung Fang Design Institute
  • Department of Electronics Engineering and Computer Science
  • Department of Electronics Engineering and Computer Sciences
  • Department of Electronics Engineering and Computer Science
  • Department of Electrical Engineering
  • Department of Electronics Engineering and Computer Science
  • Department of Electronics Engineering and Computer Science
  • Dept. of Electronics Engineering
  • Department of Electronics Engineering and Computer Science
  • Department of Electronics Engineering and Computer Science
  • Tung Fang Design University

External person

S. L I Chan

  • University of New South Wales
  • School of Materials Science and Engineering

External person

P. J. Tsai

  • School of Materials Science and Engineering
  • University of New South Wales

External person

Fu Jung Yeh

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Yu Chien Wang

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Chung Mei Hwang

  • National Cheng Kung University
  • Department of Materials Engineering

External person

Te Ping Shih

  • Tainan Technology and Industrial Park
  • Solar Technology

External person

Chi Pin Hung

  • Advanced Semiconductor Engineering, Inc.

External person

Chang Hsien Chen

  • National Cheng Kung University

External person

Pu Hsin Ku

  • National Cheng Kung University

External person

Chia Ling Shi

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Min Lin Chu

  • Institute of Nuclear Energy Research Taiwan

External person

Fu Chih Chung

  • National Cheng Kung University
  • Department of Materials Science and Engineering

External person

Yan Siang Chen

  • Advanced Semiconductor Engineering, Inc.

External person