Projects per year
Personal profile
Education
- 1993 PhD, Michigan State University, U.S.A.
Research Interests
- Computer-Aided Design
- Digital Communication
- VLSI Architecture for Digital Signal Processing
- VLSI Design and Test
Experience
- 1988/06~1989/08 Engineer, R&D Division, United Microelectronic Corporation
- 1993/08~2002/07 Associate Professor, Department of Electronic Engineering, National Yunlin University of Science & Technology
- 1999/07~2000/06, 2001/02~2001/12 Consultant, Industrial Technology Research Institute
- 1999/08~2002/07 Chairman, Department of Electronic Engineering, National Yunlin University of Science & Technology
- 2002/01~2002/12 Consultant, Electron Technology Information Magazine
- 2002/08~2009/07 Associate Professor, Department of Electrical Engineering, National Cheng Kung University
- 2005/01~2009/12 Consultant, National Chip Implementation Center
- 2009/08~present Professor, Department of Electrical Engineering, National Cheng Kung University
- 2010/02~2014/01 Deputy General Director, Information and Communications Research Laboratories, Industrial Technology Research Institute
- 2010/02~2014/01 Vice Chair, Taiwan Semiconductor Industry Association, IC Design Committee
- 2010/08~2012/07 Vice Chair, Taiwan IC Design Society
- 2012/05~2014/01 Director, Semiconductor Industry Promotion Office, Industrial Development Bureau, Ministry of Economic Affairs
- 2014/02~present Senior Research Consultant, Information and Communications Research Laboratories, Industrial Technology Research Institute
- 2014/08~present Chairman, Department of Electrical Engineering, National Cheng Kung University
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
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Projects
- 23 Finished
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On-the-Fly Twiddle Factor Generator Design for Efficient Memory Management of Negative Wrapped Convolution
Jheng, C. S., Wu, Y. T. & Shieh, M. D., 2024, 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Area-Efficient VLSI Architecture of Key Switching for BGV Fully Homomorphic Encryption
Chen, K. Y. & Shieh, M. D., 2023, ICECS 2023 - 2023 30th IEEE International Conference on Electronics, Circuits and Systems: Technosapiens for Saving Humanity. Institute of Electrical and Electronics Engineers Inc., (ICECS 2023 - 2023 30th IEEE International Conference on Electronics, Circuits and Systems: Technosapiens for Saving Humanity).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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FETCH: A cloud-native searchable encryption scheme enabling efficient pattern search on encrypted data within cloud services
Chung, S. M., Shieh, M. D. & Chiueh, T. C., 2023 Jan 10, In: International Journal of Communication Systems. 36, 1, e4141.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
VLSI Design of Number Theoretic Transform for BGV Fully Homomorphic Encryption
Chen, K. Y. & Shieh, M. D., 2023, 2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 537-538 2 p. (2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
A Decision Tree-Based Screening Method for Improving Test Quality of Memory Chips
Cheng, Y. C., Tan, P. Y., Wu, C. W., Shieh, M. D., Chuang, C. H. & Liao, G., 2022, Proceedings - 2022 IEEE International Test Conference in Asia, ITC-Asia 2022. Institute of Electrical and Electronics Engineers Inc., p. 19-24 6 p. (Proceedings - 2022 IEEE International Test Conference in Asia, ITC-Asia 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus)