Projects per year
Personal profile
Education
- 1992 PhD, Mechanical Engineering, University of Illinois (Urbana-Champaign)
Research Interests
- Additive Manufacturing
- Computer Aided Material Processing Technology
- Energy and Material Economic Material Processing Technology
- IC Packaging
- Polymer Processing
Experience
- 1992/08 ~ 2005/07 Associate Professor, Department of Mechanical Engineering, National Cheng Kung University
- 2005/08 ~ present Professor, Department of Mechanical Engineering, National Cheng Kung University
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
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Projects
- 39 Finished
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Directed energy deposition process optimization and factor interaction analysis by response surface methodology
Qiu, J. R., Chen, Y. X., Hwang, Y. K., Chang, W. L. & Hwang, S. J., 2024 Jun, In: International Journal of Advanced Manufacturing Technology. 132, 11-12, p. 5329-5350 22 p.Research output: Contribution to journal › Article › peer-review
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Fan-out panel-level package warpage and reliability analyses considering the fabrication process
Liang, C. W., Sung, Y. C., Hwang, S. J., Shih, M. H., Liao, W. H., Lin, T. H. & Yang, D. Y., 2024 Jun 15, In: Journal of Manufacturing Processes. 119, p. 649-665 17 p.Research output: Contribution to journal › Article › peer-review
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Out-of-Mold Sensor-Based Process Parameter Optimization and Adaptive Process Quality Control for Hot Runner Thin-Walled Injection-Molded Parts
Cheng, F. J., Chang, C. H., Wen, C. H., Hwang, S. J., Peng, H. S. & Chu, H. Y., 2024 Apr, In: Polymers. 16, 8, 1057.Research output: Contribution to journal › Article › peer-review
Open Access -
Study on the Influence of Runner and Overflow Area Design on Flow–Fiber Coupling in a Multi-Cavity System
Hsieh, F. L., Chen, C. T., Hwang, S. S., Hwang, S. J., Huang, P. W., Peng, H. S., Jien, M. Y. & Huang, C. T., 2024 May, In: Polymers. 16, 9, 1279.Research output: Contribution to journal › Article › peer-review
Open Access1 Citation (Scopus) -
A Study of Underfill Dispensing Patterns in Flip-Chip Packaging
Chen, D. L., Chang, H. J., Chen, T. Y., Hu, Y. H., Chen, T. B., Pan, C. H., Yang, Y. S. & Hwang, S. J., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 115-116 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus)