Projects per year
Personal profile
Education
- 1992 PhD, Mechanical Engineering, University of Illinois (Urbana-Champaign)
Research Interests
- Additive Manufacturing
- Computer Aided Material Processing Technology
- Energy and Material Economic Material Processing Technology
- IC Packaging
- Polymer Processing
Experience
- 1992/08 ~ 2005/07 Associate Professor, Department of Mechanical Engineering, National Cheng Kung University
- 2005/08 ~ present Professor, Department of Mechanical Engineering, National Cheng Kung University
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 39 Finished
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Nozzle Pressure- and Screw Position-Based CAE Scientific Process Parameter Setup for Injection Molding Process
Tseng, R. H., Wen, C. H., Chang, C. H., Chen, Y. H., Tsai, C. H. & Hwang, S. J., 2025 Jan, In: Polymers. 17, 2, 198.Research output: Contribution to journal › Article › peer-review
Open Access1 Citation (Scopus) -
Scientific Molding and Adaptive Process Quality Control with External Sensors for Injection Molding Process
Chang, C. H., Wen, C. H., Tseng, R. H., Tsai, C. H., Chen, Y. H., Hwang, S. J. & Peng, H. S., 2025 Mar, In: Technologies. 13, 3, 97.Research output: Contribution to journal › Article › peer-review
Open Access -
Accurate numerical simulations of capillary underfill process for flip-chip packages
Cheng, Y. C., Chen, Y. H., Hung, H. H., Hwang, S. J., Chen, D. L., Chang, H. J., Huang, B. Y., Huang, H. H., Wang, C. C. & Hung, C. P., 2024, (Accepted/In press) In: Engineering with Computers.Research output: Contribution to journal › Article › peer-review
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Analysis of flip-chip ball grid array underfill flow process
Hung, H. H., Cheng, Y. C., Hwang, S. J., Chen, D. L., Chang, H. J., Huang, B. Y., Huang, H. H., Wang, C. C. & Hung, C. P., 2024 Oct, In: International Journal of Advanced Manufacturing Technology. 134, 9-10, p. 4851-4870 20 p.Research output: Contribution to journal › Article › peer-review
2 Citations (Scopus) -
Analysis of warpage and reliability of very thin profile fine pitch ball grid array
Lo, C. H., Chang, T. Y., Lee, T. Y. & Hwang, S. J., 2024 Aug 15, In: Heliyon. 10, 15, e35459.Research output: Contribution to journal › Article › peer-review
Open Access