Projects per year
Personal profile
Education
- 1992 PhD, Mechanical Engineering, University of Illinois (Urbana-Champaign)
Research Interests
- Additive Manufacturing
- Computer Aided Material Processing Technology
- Energy and Material Economic Material Processing Technology
- IC Packaging
- Polymer Processing
Experience
- 1992/08 ~ 2005/07 Associate Professor, Department of Mechanical Engineering, National Cheng Kung University
- 2005/08 ~ present Professor, Department of Mechanical Engineering, National Cheng Kung University
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 39 Finished
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Correlation Between Fiber Orientation and Geometrical Shrinkage of Injected Parts Under the Influence of Flow-Fiber Coupling Effect
Huang, C. T., Wang, J. Z., Lai, C. H., Hwang, S. J., Huang, P. W. & Peng, H. S., 2023 Jul, In: International Journal of Precision Engineering and Manufacturing - Green Technology. 10, 4, p. 1039-1060 22 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
Optimize Injection-Molding Process Parameters and Build an Adaptive Process Control System Based on Nozzle Pressure Profile and Clamping Force
Liou, G. Y., Su, W. J., Cheng, F. J., Chang, C. H., Tseng, R. H., Hwang, S. J., Peng, H. S. & Chu, H. Y., 2023 Feb, In: Polymers. 15, 3, 610.Research output: Contribution to journal › Article › peer-review
Open Access -
Research on deposition toolpath planning and laser head Z-axis rising height setting for directed energy deposition
Chang, Y. Y., Qiu, J. R., Chen, Y. X. & Hwang, S. J., 2023 Jun, In: Optics and Laser Technology. 161, 109198.Research output: Contribution to journal › Article › peer-review
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Warpage and residual stress analyses of post-mold cure process of IC packages
Lin, M. Y., Zeng, Y. J., Hwang, S. J., Wang, M. H., Liu, H. P. & Fang, C. L., 2023 Jan, In: International Journal of Advanced Manufacturing Technology. 124, 3-4, p. 1017-1039 23 p.Research output: Contribution to journal › Article › peer-review
Open Access1 Citation (Scopus) -
Development of an Online Quality Control System for Injection Molding Process
Tsai, M. H., Fan-Jiang, J. C., Liou, G. Y., Cheng, F. J., Hwang, S. J., Peng, H. S. & Chu, H. Y., 2022 Apr 1, In: Polymers. 14, 8, 1607.Research output: Contribution to journal › Article › peer-review
Open Access7 Citations (Scopus)