Projects per year
Personal profile
Education
- 1992 PhD, Mechanical Engineering, University of Illinois (Urbana-Champaign)
Research Interests
- Additive Manufacturing
- Computer Aided Material Processing Technology
- Energy and Material Economic Material Processing Technology
- IC Packaging
- Polymer Processing
Experience
- 1992/08 ~ 2005/07 Associate Professor, Department of Mechanical Engineering, National Cheng Kung University
- 2005/08 ~ present Professor, Department of Mechanical Engineering, National Cheng Kung University
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
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Projects
- 39 Finished
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產業升級創新平台輔導計畫(含協助傳統產業技術開發計畫)──多功能田間作業專用充電機開發計畫
Hwang, S.-J. (PI)
21-04-01 → 21-11-30
Project: Research project
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Compression Molding Flow Behavior and Void Optimization of an Integrated Circuit Package with Shielding-Metal-Frame
Lee, T. Y., Chen, Y. L., Hwang, S. J., Cheng, W. L. & Ko, C. Y., 2025 May, In: Polymers. 17, 10, 1301.Research output: Contribution to journal › Article › peer-review
Open Access -
Effect of process parameters and their interactions on packaging process in SiP packaging: A simulation and optimization study
Chen, Y. L., Huang, L. T., Hung, C. C. & Hwang, S. J., 2025 Sept, In: Results in Engineering. 27, 106248.Research output: Contribution to journal › Article › peer-review
Open Access -
Nozzle Pressure- and Screw Position-Based CAE Scientific Process Parameter Setup for Injection Molding Process
Tseng, R. H., Wen, C. H., Chang, C. H., Chen, Y. H., Tsai, C. H. & Hwang, S. J., 2025 Jan, In: Polymers. 17, 2, 198.Research output: Contribution to journal › Article › peer-review
Open Access2 Citations (Scopus) -
Scientific Molding and Adaptive Process Quality Control with External Sensors for Injection Molding Process
Chang, C. H., Wen, C. H., Tseng, R. H., Tsai, C. H., Chen, Y. H., Hwang, S. J. & Peng, H. S., 2025 Mar, In: Technologies. 13, 3, 97.Research output: Contribution to journal › Article › peer-review
Open Access1 Citation (Scopus) -
Viscoelastic Warpage and Stress Analysis in SIP Packaging: Numerical simulation and experimental validation
Lee, T. Y., Chen, Y. L., Hwang, S. J., Ko, C. Y. & Cheng, W. L., 2025 Jun, In: Results in Engineering. 26, 105323.Research output: Contribution to journal › Article › peer-review
Open Access1 Citation (Scopus)