Projects per year
Personal profile
Education
- PhD, National Tsing Hua University
Research Interests
- Electronic Materials
- Energy Materials
- Structural Materials
Experience
- 2011/08 ~ 2015/08 Assistant Professor, National Cheng Kung University
- 2015/08 ~ present Associate Professor, National Cheng Kung University
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Dive into the research topics where Shih-kang Lin is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Projects
- 10 Finished
Research output
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Low temperature sintering of fully inorganic all-solid-state batteries – Impact of interfaces on full cell performance
Ihrig, M., Finsterbusch, M., Tsai, C. L., Laptev, A. M., Tu, C. H., Bram, M., Sohn, Y. J., Ye, R., Sevinc, S., Lin, S. K., Fattakhova-Rohlfing, D. & Guillon, O., 2021 Jan 15, In: Journal of Power Sources. 482, 228905.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
Charge-Transfer Kinetics of the Solid–Electrolyte Interphase on Li4Ti5O12 Thin-Film Electrodes
Nasara, R. N., Ma, W., Kondo, Y., Miyazaki, K., Miyahara, Y., Fukutsuka, T., Lin, C. A., Lin, S. K. & Abe, T., 2020 Aug 21, In: ChemSusChem. 13, 16, p. 3944 1 p.Research output: Contribution to journal › Comment/debate › peer-review
Open Access1 Citation (Scopus) -
Consideration of kinetics on intermetallics formation in solid-solution high entropy alloys
Chou, T. H., Huang, J. C., Yang, C. H., Lin, S. K. & Nieh, T. G., 2020 Aug 15, In: Acta Materialia. 195, p. 71-80 10 p.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions
Yang, T. L., Liu, Y. C., Yang, C. H., Kuo, Y. K. & Lin, S. K., 2020 Oct 1, In: JOM. 72, 10, p. 3538-3546 9 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
On the Schmid's Law for the electric current-induced deformation: An in situ EBSD study
Liu, Y. C., Lin, S. K. & Chiu, S. J., 2020 Feb 15, In: International Journal of Mechanical Sciences. 168, 105295.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus)