• 506 Citations
  • 13 h-Index
20042018
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Personal profile

Education

  • PhD, National Tsing Hua University

Research Interests

  • Electronic Materials
  • Energy Materials
  • Structural Materials

Experience

  • 2011/08 ~ 2015/08 Assistant Professor, National Cheng Kung University
  • 2015/08 ~ present Associate Professor, National Cheng Kung University

Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

Soldering alloys Chemical Compounds
Surface chemistry Engineering & Materials Science
solders Physics & Astronomy
Indium Chemical Compounds
Substrates Engineering & Materials Science
Soldering Engineering & Materials Science
Electromigration Engineering & Materials Science
Phase diagrams Engineering & Materials Science

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Projects 2011 2018

Research Output 2004 2018

3 Citations

Ab Initio -Aided Sensitizer Design for Mn4+-Activated Mg2TiO4 as an Ultrabright Fluoride-Free Red-Emitting Phosphor

Huang, C. S., Huang, C-L., Liu, Y. C., Lin, S., Chan, T. S. & Tu, H. W., 2018 Mar 13, In : Chemistry of Materials. 30, 5, p. 1769-1775 7 p.

Research output: Contribution to journalArticle

Fluorides
Phosphors
X ray absorption spectroscopy
Synchrotron radiation
Rare earths

Electric current-induced plastic deformation: An in situ experimental study

Liu, Y. C. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 197-198 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lattice theory
Electronics packaging
Electromigration
Electric currents
Stress relaxation
1 Citations

Integrated investigation of the Li4Ti5O12 phase stability

Asadikiya, M., Zhu, Y., Gopalan, S., Chuang, Y. C., Tsai, P. C., Nasara, R. N., Lin, S. & Zhong, Y., 2018 Mar 1, In : Ionics. 24, 3, p. 707-713 7 p.

Research output: Contribution to journalArticle

Phase stability
molten salts
Salts
Molten materials
synthesis

Mechanical properties of Sn-Bi-In-Ga low melting temperature solder alloys

Yang, C. H., Zhou, S., Nishikawa, H. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 409-410 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Indium alloys
Electronics packaging
Binary alloys
Tensile testing
Soldering alloys
2 Citations

On the formation mechanism of solid-solution Cu-to-Cu joints in the Cu/Ni/Ga/Ni/Cu system

Lin, S., Yeh, C. Y. & Wang, M. J., 2018 Mar 1, In : Materials Characterization. 137, p. 14-23 10 p.

Research output: Contribution to journalArticle

Gallium
Nickel
gallium
Solid solutions
solid solutions