Projects per year
Personal profile
Education
- PhD, National Tsing Hua University
Research Interests
- Electronic Materials
- Energy Materials
- Structural Materials
Experience
- 2011/08 ~ 2015/08 Assistant Professor, National Cheng Kung University
- 2015/08 ~ present Associate Professor, National Cheng Kung University
Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.
Soldering alloys
Engineering & Materials Science
Surface chemistry
Engineering & Materials Science
solders
Physics & Astronomy
Indium
Chemical Compounds
Substrates
Engineering & Materials Science
Soldering
Engineering & Materials Science
Phase diagrams
Engineering & Materials Science
Intermetallics
Chemical Compounds
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Research Output 2004 2019
A computational thermodynamics-assisted development of Sn-Bi-In-Ga quaternary alloys as low-temperature Pb-free solders
Yang, C. H., Zhou, S., Lin, S. & Nishikawa, H., 2019 Feb 20, In : Materials. 12, 4, 631.Research output: Contribution to journal › Article
Open Access
CALPHAD-assisted morphology control of manganese sulfide inclusions in free-cutting steels
Lin, S. G., Yang, H. H., Su, Y. H., Chang, K. L., Yang, C. H. & Lin, S., 2019 Mar 30, In : Journal of Alloys and Compounds. 779, p. 844-855 12 p.Research output: Contribution to journal › Article
Steel
Manganese
Sulfur
Machinability
Thermodynamics
7
Citations
(Scopus)
Ab Initio -Aided Sensitizer Design for Mn4+-Activated Mg2TiO4 as an Ultrabright Fluoride-Free Red-Emitting Phosphor
Huang, C. S., Huang, C-L., Liu, Y. C., Lin, S., Chan, T. S. & Tu, H. W., 2018 Mar 13, In : Chemistry of Materials. 30, 5, p. 1769-1775 7 p.Research output: Contribution to journal › Article
Fluorides
Phosphors
X ray absorption spectroscopy
Synchrotron radiation
Rare earths
Electric current-induced plastic deformation: An in situ experimental study
Liu, Y. C. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 197-198 2 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Electric currents
Plastic deformation
Electromigration
Twinning
Current density
Ga-based submicron particle and applications
Liao, H. M., Yeh, C. Y. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 396-398 3 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Sonochemistry
Organic solvents
Oxides
Intermetallics
Solid solutions