Projects per year
Personal profile
Education
- PhD, National Tsing Hua University
Research Interests
- Electronic Materials
- Energy Materials
- Structural Materials
Experience
- 2011/08 ~ 2015/08 Assistant Professor, National Cheng Kung University
- 2015/08 ~ present Associate Professor, National Cheng Kung University
Fingerprint Dive into the research topics where Shih-kang Lin is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
Soldering alloys
Engineering & Materials Science
Surface chemistry
Engineering & Materials Science
Electromigration
Engineering & Materials Science
Indium
Chemical Compounds
solders
Physics & Astronomy
Intermetallics
Engineering & Materials Science
Substrates
Engineering & Materials Science
Gallium
Chemical Compounds
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Projects 2011 2020
Research Output 2004 2019
Ab initio phase stability and electronic conductivity of the doped-Li4Ti5O12 anode for Li-ion batteries
Tsai, P. C., Nasara, R. N., Shen, Y. C., Liang, C. C., Chang, Y. W., Hsu, W-D., Thuy Tran, N. T. & Lin, S., 2019 Aug 15, In : Acta Materialia. 175, p. 196-205 10 p.Research output: Contribution to journal › Article
Phase stability
Anodes
Kinetics
Doping (additives)
Durability
A computational thermodynamics-assisted development of Sn-Bi-In-Ga quaternary alloys as low-temperature Pb-free solders
Yang, C. H., Zhou, S., Lin, S. & Nishikawa, H., 2019 Feb 20, In : Materials. 12, 4, 631.Research output: Contribution to journal › Article
Open Access
Soldering alloys
Thermodynamics
Elongation
Cooling
Eutectics
A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on the Effects of Electric Current Upon Alloy Phase Stability
Liu, Y. C. & Lin, S., 2019 Sep 15, In : JOM. 71, 9, p. 3094-3106 13 p.Research output: Contribution to journal › Review article
Phase stability
Electromigration
Electric currents
Phase equilibria
Integrated circuits
Advanced Electronic Interconnection
Lin, S., 2019 Sep 15, In : JOM. 71, 9, p. 2996-2997 2 p.Research output: Contribution to journal › Comment/debate
Open Access
A novel TLP bonding based on sub-micron Ga particles
Lin, S., Liao, H. M., Yeh, C. Y. & Yang, C. H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 240-241 2 p. 8733446. (2019 International Conference on Electronics Packaging, ICEP 2019).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Gallium
Liquids
Metallurgy
Nickel
Packaging
Thesis
Ab initio-aided CALPHAD thermodynamic modeling for the Mo-V and Mo-Zr binary systems
Author: 牧輝, 馬., 2015 Jun 25Supervisor: Lin, S. (Supervisor)
Student thesis: Master's Thesis
Alkali Earth Metal Oxide Solid Solution as Heterogeneous Catalyst for Tranesterification in Biodiesel Production
Author: 文詩, 羅., 2017 Aug 29Supervisor: Lin, S. (Supervisor)
Student thesis: Master's Thesis
CALPHAD Assisted Analyses of Alloying Elements on Solidification and Segregation of the SUJ2 Bearing Steels
Author: 知克, ?., 2019Supervisor: Lin, S. (Supervisor)
Student thesis: Master's Thesis
CALPHAD-assisted morphology control of manganese sulfide inclusions in free-cutting steels
Author: 士桂, 林., 2016 Aug 31Supervisor: Lin, S. (Supervisor)
Student thesis: Master's Thesis
Ga摻雜對Sn-0 7Cu/Cu界面反應的影響及應用(Cu Ga)奈米粒子於Cu對Cu連結之研究
Author: 亦凱, 郭., 2015 Jul 7Supervisor: Lin, S. (Supervisor)
Student thesis: Master's Thesis