Projects per year
Personal profile
Education
- PhD, National Tsing Hua University
Research Interests
- Electronic Materials
- Energy Materials
- Structural Materials
Experience
- 2011/08 ~ 2015/08 Assistant Professor, National Cheng Kung University
- 2015/08 ~ present Associate Professor, National Cheng Kung University
Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.
Soldering alloys
Chemical Compounds
Surface chemistry
Engineering & Materials Science
solders
Physics & Astronomy
Indium
Chemical Compounds
Substrates
Engineering & Materials Science
Soldering
Engineering & Materials Science
Electromigration
Engineering & Materials Science
Phase diagrams
Engineering & Materials Science
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Projects 2011 2018
- 8 Finished
Research Output 2004 2018
Ab Initio -Aided Sensitizer Design for Mn4+-Activated Mg2TiO4 as an Ultrabright Fluoride-Free Red-Emitting Phosphor
Huang, C. S., Huang, C-L., Liu, Y. C., Lin, S., Chan, T. S. & Tu, H. W., 2018 Mar 13, In : Chemistry of Materials. 30, 5, p. 1769-1775 7 p.Research output: Contribution to journal › Article
Fluorides
Phosphors
X ray absorption spectroscopy
Synchrotron radiation
Rare earths
Electric current-induced plastic deformation: An in situ experimental study
Liu, Y. C. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 197-198 2 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Lattice theory
Electronics packaging
Electromigration
Electric currents
Stress relaxation
Integrated investigation of the Li4Ti5O12 phase stability
Asadikiya, M., Zhu, Y., Gopalan, S., Chuang, Y. C., Tsai, P. C., Nasara, R. N., Lin, S. & Zhong, Y., 2018 Mar 1, In : Ionics. 24, 3, p. 707-713 7 p.Research output: Contribution to journal › Article
Phase stability
molten salts
Salts
Molten materials
synthesis
Mechanical properties of Sn-Bi-In-Ga low melting temperature solder alloys
Yang, C. H., Zhou, S., Nishikawa, H. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 409-410 2 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Indium alloys
Electronics packaging
Binary alloys
Tensile testing
Soldering alloys
On the formation mechanism of solid-solution Cu-to-Cu joints in the Cu/Ni/Ga/Ni/Cu system
Lin, S., Yeh, C. Y. & Wang, M. J., 2018 Mar 1, In : Materials Characterization. 137, p. 14-23 10 p.Research output: Contribution to journal › Article
Gallium
Nickel
gallium
Solid solutions
solid solutions