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Research Output 2004 2019

2019
1 Citation (Scopus)

Ab initio phase stability and electronic conductivity of the doped-Li4Ti5O12 anode for Li-ion batteries

Tsai, P. C., Nasara, R. N., Shen, Y. C., Liang, C. C., Chang, Y. W., Hsu, W-D., Thuy Tran, N. T. & Lin, S., 2019 Aug 15, In : Acta Materialia. 175, p. 196-205 10 p.

Research output: Contribution to journalArticle

Phase stability
Anodes
Kinetics
Doping (additives)
Durability

A computational thermodynamics-assisted development of Sn-Bi-In-Ga quaternary alloys as low-temperature Pb-free solders

Yang, C. H., Zhou, S., Lin, S. & Nishikawa, H., 2019 Feb 20, In : Materials. 12, 4, 631.

Research output: Contribution to journalArticle

Open Access
Soldering alloys
Thermodynamics
Elongation
Cooling
Eutectics

A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on the Effects of Electric Current Upon Alloy Phase Stability

Liu, Y. C. & Lin, S., 2019 Sep 15, In : JOM. 71, 9, p. 3094-3106 13 p.

Research output: Contribution to journalReview article

Phase stability
Electromigration
Electric currents
Phase equilibria
Integrated circuits

Advanced Electronic Interconnection

Lin, S., 2019 Sep 15, In : JOM. 71, 9, p. 2996-2997 2 p.

Research output: Contribution to journalComment/debate

Open Access

A novel TLP bonding based on sub-micron Ga particles

Lin, S., Liao, H. M., Yeh, C. Y. & Yang, C. H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 240-241 2 p. 8733446. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gallium
Liquids
Metallurgy
Nickel
Packaging
2 Citations (Scopus)

CALPHAD-assisted morphology control of manganese sulfide inclusions in free-cutting steels

Lin, S. G., Yang, H. H., Su, Y. H., Chang, K. L., Yang, C. H. & Lin, S., 2019 Mar 30, In : Journal of Alloys and Compounds. 779, p. 844-855 12 p.

Research output: Contribution to journalArticle

Steel
Manganese
Sulfur
Machinability
Thermodynamics

Defects in Li4Ti5O12 induced by carbon deposition: An analysis of unidentified bands in Raman spectra

Pelegov, D. V., Nasara, R. N., Tu, C. H. & Lin, S. K., 2019 Jan 1, In : Physical Chemistry Chemical Physics. 21, 37, p. 20757-20763 7 p.

Research output: Contribution to journalArticle

Raman scattering
Carbon
Raman spectra
Defects
carbon

Development of Sn-Bi-In-Ga quaternary low-Temperature solders

Yang, C. H., Zhou, S., Lin, S. & Nishikawa, H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 367-369 3 p. 8733565. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gallium
Indium
Soldering alloys
Intermetallics
Temperature
4 Citations (Scopus)

Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy

Zhou, S., Yang, C. H., Lin, S., AlHazaa, A. N., Mokhtari, O., Liu, X. & Nishikawa, H., 2019 Jan 28, In : Materials Science and Engineering A. 744, p. 560-569 10 p.

Research output: Contribution to journalArticle

eutectic alloys
Titanium
Eutectics
titanium
mechanical properties

Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study

Liu, Y. C., Yu, Y. S., Lin, S. & Chiu, S. J., 2019 Dec 1, In : Scripta Materialia. 173, p. 134-138 5 p.

Research output: Contribution to journalArticle

Electromigration
electromigration
strip
Electrons
failure modes
1 Citation (Scopus)

Exploring effective charge in electromigration using machine learning

Liu, Y. C., Afflerbach, B., Jacobs, R., Lin, S. & Morgan, D., 2019 Jun 1, In : MRS Communications. 9, 2, p. 567-575 9 p.

Research output: Contribution to journalArticle

Electromigration
Learning systems
Extrapolation
Mean square error
Impurities

Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates

Tseng, T. H., Yang, C. H., Chiang, J. Y., Huang, J. J., Chen, C. H., Lin, S., Wang, C. M. & Wu, A. T., 2019 Jun 24, In : Materials Science and Engineering A. 759, p. 506-513 8 p.

Research output: Contribution to journalArticle

Surface chemistry
Intermetallics
intermetallics
Melting
melting

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

Shen, Y. A., Zhou, S., Li, J., Yang, C. H., Huang, S., Lin, S. & Nishikawa, H., 2019 Dec 5, In : Materials and Design. 183, 108144.

Research output: Contribution to journalArticle

Open Access
Soldering alloys
Composite materials
Temperature
Brittleness
Electron diffraction
2 Citations (Scopus)

The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength

Zhou, S., Yang, C. H., Shen, Y. A., Lin, S. & Nishikawa, H., 2019 Jun 1, In : Materialia. 6, 100300.

Research output: Contribution to journalArticle

Melting point
Ductility
Tensile strength
Ternary systems
Soldering alloys

The study of Sn-45Bi-2.6Zn alloy before and after thermal aging

Zhou, S., Yang, C. H., Shen, Y. A., Lin, S. & Nishikawa, H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 333-336 4 p. 8733417. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal aging
Eutectics
Elongation
Ternary systems
Soldering alloys

Using the high-temperature phase transition of iron sulfide minerals as an indicator of fault slip temperature

Chen, Y. H., Chen, Y-H., Hsu, W-D., Chang, Y. C., Sheu, H. S., Lee, J. J. & Lin, S., 2019 May 28, In : Scientific reports. 9, 1, 1 p.

Research output: Contribution to journalArticle

Open Access
Phase Transition
Sulfides
Minerals
Iron
Earthquakes
2018
10 Citations (Scopus)

Ab Initio -Aided Sensitizer Design for Mn 4+ -Activated Mg 2 TiO 4 as an Ultrabright Fluoride-Free Red-Emitting Phosphor

Huang, C. S., Huang, C-L., Liu, Y. C., Lin, S., Chan, T. S. & Tu, H. W., 2018 Mar 13, In : Chemistry of Materials. 30, 5, p. 1769-1775 7 p.

Research output: Contribution to journalArticle

Fluorides
Phosphors
X ray absorption spectroscopy
Synchrotron radiation
Rare earths

Electric current-induced plastic deformation: An in situ experimental study

Liu, Y. C. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 197-198 2 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric currents
Plastic deformation
Electromigration
Twinning
Current density

Ga-based submicron particle and applications

Liao, H. M., Yeh, C. Y. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 396-398 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sonochemistry
Organic solvents
Oxides
Intermetallics
Solid solutions
2 Citations (Scopus)

Integrated investigation of the Li4Ti5O12 phase stability

Asadikiya, M., Zhu, Y., Gopalan, S., Chuang, Y. C., Tsai, P. C., Nasara, R. N., Lin, S. & Zhong, Y., 2018 Mar 1, In : Ionics. 24, 3, p. 707-713 7 p.

Research output: Contribution to journalArticle

Phase stability
molten salts
Salts
Molten materials
synthesis

Mechanical properties of Sn-Bi-In-Ga low melting temperature solder alloys

Yang, C. H., Zhou, S., Nishikawa, H. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 409-410 2 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Melting point
Mechanical properties
Chemical elements
Yield stress
6 Citations (Scopus)

On the formation mechanism of solid-solution Cu-to-Cu joints in the Cu/Ni/Ga/Ni/Cu system

Lin, S., Yeh, C. Y. & Wang, M. J., 2018 Mar 1, In : Materials Characterization. 137, p. 14-23 10 p.

Research output: Contribution to journalArticle

Gallium
Nickel
gallium
Solid solutions
solid solutions
2017
9 Citations (Scopus)

High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy

Lin, S., Wang, M. J., Yeh, C. Y., Chang, H. M. & Liu, Y. C., 2017 Jan 1, In : Journal of Alloys and Compounds. 702, p. 561-567 7 p.

Research output: Contribution to journalArticle

Gallium
Metallurgy
Nickel
Molten materials
Shear strength
5 Citations (Scopus)
Amorphous carbon
Oxygen vacancies
Anodes
Lithium
Coatings

Revisit the electromigration effect: In situ synchrotron X-ray and scanning electron microscopy and ab initio calculations

Lin, S., Liu, Y. C., Chiu, S. J., Liu, Y. T. & Lee, H. Y., 2017 Jun 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 517-518 2 p. 7939436. (2017 International Conference on Electronics Packaging, ICEP 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Synchrotrons
X rays
Scanning electron microscopy
X ray diffraction analysis
9 Citations (Scopus)

The electromigration effect revisited: Non-uniform local tensile stress-driven diffusion

Lin, S., Liu, Y. C., Chiu, S. J., Liu, Y. T. & Lee, H. Y., 2017 Dec 1, In : Scientific reports. 7, 1, 03324.

Research output: Contribution to journalArticle

electromigration
tensile stress
electrons
causes
elastic deformation
15 Citations (Scopus)

The mechanism of the sodiation and desodiation in Super P carbon electrode for sodium-ion battery

Wu, C. M., Pan, P. I., Cheng, Y. W., Liu, C-P., Chang, C. C., Avdeev, M. & Lin, S., 2017 Feb 1, In : Journal of Power Sources. 340, p. 14-21 8 p.

Research output: Contribution to journalArticle

electric batteries
Carbon
Sodium
sodium
Ions
2016

A novel approach for forming ductile Cu-to-Cu interconnection

Yeh, C. Y., Kuo, Y. K. & Lin, S., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 479-484 6 p. 7486873. (2016 International Conference on Electronics Packaging, ICEP 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electronics packaging
Electronics industry
Silicon
Processing
Soldering alloys
3 Citations (Scopus)

A novel mechanism of silver microflakes sinter joining

Zhang, H., Nagao, S., Lin, S., Yokoi, E., Chen, C. & Suganuma, K., 2016 May 2, China Semiconductor Technology International Conference 2016, CSTIC 2016. Wu, H., Lung, H-L., Shi, Y., Chen, D., Huang, D., Wang, Q., Wu, K., Zhang, Y., Claeys, C., Liang, S., Huang, R., Zhang, B., Song, P., Yan, J., Lin, Q. & Lai, K. (eds.). Institute of Electrical and Electronics Engineers Inc., 7463950. (China Semiconductor Technology International Conference 2016, CSTIC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver
Joining
Sintering
Diffusion bonding
Nucleation
35 Citations (Scopus)

Nano-volcanic eruption of silver

Lin, S., Nagao, S., Yokoi, E., Oh, C., Zhang, H., Liu, Y. C., Lin, S. G. & Suganuma, K., 2016 Oct 5, In : Scientific reports. 6, 34769.

Research output: Contribution to journalArticle

Volcanic Eruptions
Silver
Coatings
Grain boundaries
Electronic medical equipment
1 Citation (Scopus)

Thin-Film Photoluminescent Properties and the Atomistic Model of Mg 2 TiO 4 as a Non-rare Earth Matrix Material for Red-Emitting Phosphor

Huang, C. S., Chang, M. C., Huang, C-L. & Lin, S., 2016 Dec 1, In : Journal of Electronic Materials. 45, 12, p. 6214-6221 8 p.

Research output: Contribution to journalArticle

matrix materials
Phosphors
phosphors
Earth (planet)
spinel
2015
92 Citations (Scopus)

Ab initio study of sodium intercalation into disordered carbon

Tsai, P. C., Chung, S. C., Lin, S. & Yamada, A., 2015 May 14, In : Journal of Materials Chemistry A. 3, 18, p. 9763-9768 6 p.

Research output: Contribution to journalArticle

Intercalation
Carbon
Sodium
Graphite
Anodes
1 Citation (Scopus)

Erratum: Ab initio energetics of charge compensating point defects: A case study on MgO (Comput. Mater. Sci. (2013) 73 (41-55))

Lin, S., Yeh, C. K., Puchala, B., Lee, Y. L., Wu, H. & Morgan, D., 2015 Jul 21, In : Computational Materials Science. 109, 1 p., 6624.

Research output: Contribution to journalComment/debate

Point Defects
Point defects
point defects
Charge
13 Citations (Scopus)

Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits

Lin, S., Chang, H. M., Cho, C. L., Liu, Y. C. & Kuo, Y. K., 2015 Jul 25, In : Electronic Materials Letters. 11, 4, p. 687-694 8 p.

Research output: Contribution to journalArticle

Metallurgy
Soldering alloys
Solid solutions
Wetting
Substrates

Simulations of domain pattern in lead-titanate by molecular dynamics simulations aided q-state Potts model

Dezfoli, A. R. A., Lin, S. & Hsu, W-D., 2015 Dec 1, In : Computational Materials Science. 110, p. 221-226 6 p., 6664.

Research output: Contribution to journalArticle

Potts model
Potts Model
Molecular Dynamics Simulation
Molecular dynamics
Lead
2 Citations (Scopus)

Solid-state reactions between Sn-20.0 wt.%In-x wt.%Zn solders and Ag and Ni substrates

Lin, S., Chang, R. B., Chen, S. W., Tsai, M. Y. & Hsu, C. M., 2015 Mar 15, In : Materials Chemistry and Physics. 154, p. 60-65 6 p.

Research output: Contribution to journalArticle

solders
Solid state reactions
Soldering alloys
solid state
Doping (additives)
2 Citations (Scopus)

Strong coupling effects during Cu/In/Ni interfacial reactions at 280 °c

Lin, S., Wang, Y. H. & Kuo, H. C., 2015 Jan 1, In : Intermetallics. 58, p. 91-97 7 p.

Research output: Contribution to journalArticle

Indium
Surface chemistry
Heat sinks
Sandwich structures
Diffusion barriers

高錳鋼連續鑄造之高溫熱機械性質量測與 CALPHAD熱力學解析

Lin, S., 2015 Jul, In : 礦冶季刊.

Research output: Contribution to journalArticle

2014
36 Citations (Scopus)

Effective suppression of interfacial intermetallic compound growth between Sn-58 wt.% Bi solders and Cu substrates by minor Ga addition

Lin, S., Nguyen, T. L., Wu, S. C. & Wang, Y. H., 2014 Jan 1, In : Journal of Alloys and Compounds. 586, p. 319-327 9 p.

Research output: Contribution to journalArticle

Soldering alloys
Intermetallics
Substrates
Doping (additives)
Diffusion barriers
2 Citations (Scopus)

Effects of zinc on the interfacial reactions of tin-indium solder joints with copper

Lin, S., Chang, R. B., Chen, S. W., Tsai, M. Y. & Hsu, C. M., 2014 May 1, In : Journal of Materials Science. 49, 10, p. 3805-3815 11 p.

Research output: Contribution to journalArticle

Indium
Tin
Surface chemistry
Soldering alloys
Zinc
8 Citations (Scopus)

Formation of alternating interfacial layers in Au-12Ge/Ni joints

Lin, S., Tsai, M. Y., Tsai, P. C. & Hsu, B. H., 2014 Apr 2, In : Scientific reports. 4, 4557.

Research output: Contribution to journalArticle

thermodynamics
packaging
nucleation
liquids
18 Citations (Scopus)

Geometric and electronic properties of edge-decorated graphene nanoribbons

Chang, S. L., Lin, S. Y., Lin, S., Lee, C. H. & Lin, M-F., 2014 Aug 15, In : Scientific reports. 4, 6038.

Research output: Contribution to journalArticle

Carbon Nanotubes
Graphite
Electronic properties
Atoms
Boron
22 Citations (Scopus)

Interfacial reactions in Cu/Ga and Cu/Ga/Cu couples

Lin, S., Cho, C. L. & Chang, H. M., 2014 Jan 1, In : Journal of Electronic Materials. 43, 1, p. 204-211 8 p.

Research output: Contribution to journalArticle

Surface chemistry
Liquids
Diffusion bonding
Addition reactions
Microstructural evolution
2013
11 Citations (Scopus)

Ab initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressing

Lin, S., Yeh, C. K., Xie, W., Liu, Y. C. & Yoshimura, M., 2013 Oct 8, In : Scientific reports. 3, 2731.

Research output: Contribution to journalArticle

Physical Phenomena
Thermodynamics
Joints
Equipment and Supplies
6 Citations (Scopus)

Ab initio energetics of charge compensating point defects: A case study on MgO

Lin, S., Yeh, C. K., Puchala, B., Lee, Y. L. & Morgan, D., 2013 Apr 2, In : Computational Materials Science. 73, p. 41-55 15 p.

Research output: Contribution to journalArticle

Point Defects
Point defects
point defects
Defects
Charge
7 Citations (Scopus)

Interfacial reactions in Sn-20In-2.8Ag/Cu couples

Lin, S., Hsu, C. W., Chen, S. W. & Hsu, C. M., 2013 Oct 15, In : Materials Chemistry and Physics. 142, 1, p. 268-275 8 p.

Research output: Contribution to journalArticle

Surface chemistry
Soldering alloys
Intermetallics
Indium
Solid state reactions
4 Citations (Scopus)

Reaction evolution in Sn-20.0 wt% In-2.8 wt% Ag/Ni couples

Chen, S. W., Hsu, C. W., Lin, S. & Hsu, C. M., 2013 Dec 14, In : Journal of Materials Research. 28, 23, p. 3257-3260 4 p.

Research output: Contribution to journalArticle

liquid phases
Solidification
Liquids
solidification
Surface chemistry
2012
1 Citation (Scopus)

PEMFC nanoparticle catalyst dealloying from kinetic Monte Carlo simulations

Puchala, B., Lin, S., Wang, L. & Morgan, D., 2012 Dec 1, Polymer Electrolyte Fuel Cells 12, PEFC 2012. 2 ed. p. 1643-1649 7 p. (ECS Transactions; vol. 50, no. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Proton exchange membrane fuel cells (PEMFC)
Dissolution
Nanoparticles
Catalysts
Kinetics
1 Citation (Scopus)

Phase Diagrams and Their Applications in Pb-Free Soldering

Chen, S. W., Wu, H. J., Gierlotka, W. & Lin, S., 2012 Mar 15, Lead-free Solders: Materials Reliability for Electronics. Wiley-Blackwell, p. 12-44 33 p.

Research output: Chapter in Book/Report/Conference proceedingChapter

Soldering
Phase diagrams
Surface chemistry
Intermetallics
Melting
22 Citations (Scopus)

Phase equilibria of Sn-Sb-Cu system

Chen, S. W., Zi, A. R., Gierlotka, W., Yang, C. F., Wang, C. H., Lin, S. & Hsu, C. M., 2012 Feb 15, In : Materials Chemistry and Physics. 132, 2-3, p. 703-715 13 p.

Research output: Contribution to journalArticle

liquidus
Phase equilibria
projection
Thermodynamics
thermodynamics