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Research Output 2004 2019

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Conference contribution
2019

A novel TLP bonding based on sub-micron Ga particles

Lin, S., Liao, H. M., Yeh, C. Y. & Yang, C. H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 240-241 2 p. 8733446. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gallium
Liquids
Metallurgy
Nickel
Packaging

Development of Sn-Bi-In-Ga quaternary low-Temperature solders

Yang, C. H., Zhou, S., Lin, S. & Nishikawa, H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 367-369 3 p. 8733565. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gallium
Indium
Soldering alloys
Intermetallics
Temperature

The study of Sn-45Bi-2.6Zn alloy before and after thermal aging

Zhou, S., Yang, C. H., Shen, Y. A., Lin, S. & Nishikawa, H., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 333-336 4 p. 8733417. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal aging
Eutectics
Elongation
Ternary systems
Soldering alloys
2018

Electric current-induced plastic deformation: An in situ experimental study

Liu, Y. C. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 197-198 2 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric currents
Plastic deformation
Electromigration
Twinning
Current density

Ga-based submicron particle and applications

Liao, H. M., Yeh, C. Y. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 396-398 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sonochemistry
Organic solvents
Oxides
Intermetallics
Solid solutions

Mechanical properties of Sn-Bi-In-Ga low melting temperature solder alloys

Yang, C. H., Zhou, S., Nishikawa, H. & Lin, S., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 409-410 2 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Melting point
Mechanical properties
Chemical elements
Yield stress
2017

Revisit the electromigration effect: In situ synchrotron X-ray and scanning electron microscopy and ab initio calculations

Lin, S., Liu, Y. C., Chiu, S. J., Liu, Y. T. & Lee, H. Y., 2017 Jun 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 517-518 2 p. 7939436. (2017 International Conference on Electronics Packaging, ICEP 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromigration
Synchrotrons
X rays
Scanning electron microscopy
X ray diffraction analysis
2016

A novel approach for forming ductile Cu-to-Cu interconnection

Yeh, C. Y., Kuo, Y. K. & Lin, S., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 479-484 6 p. 7486873. (2016 International Conference on Electronics Packaging, ICEP 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electronics packaging
Electronics industry
Silicon
Processing
Soldering alloys
3 Citations (Scopus)

A novel mechanism of silver microflakes sinter joining

Zhang, H., Nagao, S., Lin, S., Yokoi, E., Chen, C. & Suganuma, K., 2016 May 2, China Semiconductor Technology International Conference 2016, CSTIC 2016. Wu, H., Lung, H-L., Shi, Y., Chen, D., Huang, D., Wang, Q., Wu, K., Zhang, Y., Claeys, C., Liang, S., Huang, R., Zhang, B., Song, P., Yan, J., Lin, Q. & Lai, K. (eds.). Institute of Electrical and Electronics Engineers Inc., 7463950. (China Semiconductor Technology International Conference 2016, CSTIC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver
Joining
Sintering
Diffusion bonding
Nucleation
2012
1 Citation (Scopus)

PEMFC nanoparticle catalyst dealloying from kinetic Monte Carlo simulations

Puchala, B., Lin, S., Wang, L. & Morgan, D., 2012 Dec 1, Polymer Electrolyte Fuel Cells 12, PEFC 2012. 2 ed. p. 1643-1649 7 p. (ECS Transactions; vol. 50, no. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Proton exchange membrane fuel cells (PEMFC)
Dissolution
Nanoparticles
Catalysts
Kinetics