Tei-Chen Chen

Professor

  • 707 Citations
  • 15 h-Index
1988 …2019
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Personal profile

Education

  • 1988 Ph.D., Mechanical Engineering, National Cheng Kung University, Taiwan

Research Interests

  • Solid Mechanics

Experience

  • 1979年5月 ~ 1983年7月 中國鋼鐵公司工程師
  • 1983年7月 ~ 1988年6月 國立成功大學機械工程學系講師
  • 1988年6月 ~ 1995年7月 國立成功大學機械工程學系副教授
  • 1995年8月 ~ 迄今 國立成功大學機械工程學系教授

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Molecular dynamics Engineering & Materials Science
Finite element method Engineering & Materials Science
Laplace transforms Engineering & Materials Science
Temperature distribution Engineering & Materials Science
Temperature Engineering & Materials Science
Annealing Engineering & Materials Science
Thermal stress Engineering & Materials Science
Preheating Engineering & Materials Science

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Projects 1995 2018

鎳基二元金屬玻璃之奈米力學特性分析

Chen, T.

16-08-0117-07-31

Project: Research project

GaNP奈米線的機械與電性研究

Chen, T.

15-08-0116-07-31

Project: Research project

鋰-空氣電池空氣電極氧還原與析氧反應之研究

Chen, T.

14-08-0115-07-31

Project: Research project

Research Output 1988 2019

Molecular dynamics simulation on mechanical behaviors of NixAl100-x nanowires under uniaxial compressive stress

Hsu, F. C. & Chen, T-C., 2019 Jan 1, In : AIMS Materials Science. 6, 3, p. 377-396 20 p.

Research output: Contribution to journalArticle

Open Access
Compressive stress
Nanowires
Molecular dynamics
Quenching
Computer simulation

Nanoscale mechanical and mechanically-induced electrical properties of silicon nanowires

Lin, Y. H. & Chen, T-C., 2019 May 1, In : Crystals. 9, 5, 240.

Research output: Contribution to journalArticle

Open Access
Silicon
Acoustic impedance
Nanowires
phase transformations
electrical resistance
1 Citation (Scopus)

Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes

Kao, C. L. & Chen, T-C., 2018 Mar 1, In : Microelectronics Reliability. 82, p. 204-212 9 p.

Research output: Contribution to journalArticle

solders
impact tests
Soldering alloys
balls
drop tests

Electrothermal coupling analysis and experimental verification for wirebond devices

Kao, C. L. & Chen, T-C., 2018 Jan 1, In : Transactions of the Canadian Society for Mechanical Engineering. 42, 3, p. 268-279 12 p.

Research output: Contribution to journalArticle

Sheet molding compounds
Wire
Spreaders
Failure modes
Thermal conductivity
1 Citation (Scopus)

Interconversions between linear viscoelastic functions with a time-dependent bulk modulus

Chen, D. L., Chiu, T-C., Chen, T-C., Yang, P. F. & Jian, S. R., 2018 Jun 1, In : Mathematics and Mechanics of Solids. 23, 6, p. 879-895 17 p.

Research output: Contribution to journalArticle

Bulk Modulus
Elastic moduli
Modulus
Monotonic Function
Poisson's Ratio

Thesis

Evaluation of surface azimuthal anchoring energy between grating surface and nematic liquid crystal layer using geometric model

Author: 進龍, 林., 2017 Jan 24

Supervisor: Chen, T. (Supervisor)

Student thesis: Doctoral Thesis

Investigation of Electromigration Reliability of Flip-chip Packages by Electrothermal Coupling Analysis

Author: 金利, 高., 2018 Jul 6

Supervisor: Chen, T. (Supervisor)

Student thesis: Doctoral Thesis

Material Property Analysis of Amorphous Metallic Thin Films as Diffusion Barrier Layer

Author: 柏賢, 宋., 2018 Jul 10

Supervisor: Chen, T. (Supervisor)

Student thesis: Doctoral Thesis

Ni-Al金屬玻璃薄膜阻障層與多晶銅間機械性質與擴散行為之分子動力學模擬

Author: 欣平, 林., 2018 Aug 1

Supervisor: Chen, T. (Supervisor)

Student thesis: Master's Thesis

以分子動力學分析Cu-Al金屬玻璃阻障層與多晶銅間之擴散行為與機械性質

Author: 元瑋, 許., 2018 Aug 7

Supervisor: Chen, T. (Supervisor)

Student thesis: Master's Thesis