Projects per year
Personal profile
Education
- 1996 PhD, Mechanical Engineering, Massachusetts Institute of Technology
Research Interests
- Applied Mathematics
- Applied Mechanics
- Semiconductor Fabrication Processes
- Structural Vibration Control
- Wave Dynamics
Experience
- 1991年8月 ~ 1992年7月 國立臺灣大學助教
- 1996年1月 ~ 1999年1月 美國西北大學研究員
- 1999年2月 ~ 2003年7月 國立成功大學機械工程學系助理教授
- 2003年8月 ~ 2009年7月 國立成功大學機械工程學系副教授
- 2009年8月 ~ 迄今 國立成功大學機械工程學系教授
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Projects
- 28 Finished
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Prediction of 3D natural convection heat transfer characteristics in a shallow enclosure with experimental data
Chen, H. T., Su, W. Y., Zheng, Y. J., Yang, T. S. & Chen, K. X., 2022 Nov, In: Progress in Nuclear Energy. 153, 104425.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
A numerical simulation validated experimentally for thermally developing convection characteristics of a phase change nanofluid flow in a circular tube
Ho, C. J., Chu, Y. C., Huang, Z. P., Yang, T. S., Chiu, T. C., Chen, B. L. & Yan, W. M., 2021 Jun, In: Case Studies in Thermal Engineering. 25, 100925.Research output: Contribution to journal › Article › peer-review
Open Access2 Citations (Scopus) -
Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations
Chuang, C. F., Chen, K. S., Chiu, T. C., Yang, T. S. & Lin, M. C., 2020 Jan 1, In: Sensors and Actuators, A: Physical. 301, 111723.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
Reconstituted Wafer Deformation Analysis through Whole Process Emulation
Yang, C. Y., Chen, K. S. & Yang, T. S., 2020 Mar, In: IEEE Transactions on Device and Materials Reliability. 20, 1, p. 172-180 9 p., 8994086.Research output: Contribution to journal › Article › peer-review
5 Citations (Scopus) -
Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging
Yang, C. Y., Chen, K. S., Yang, T. S. G., Chiu, T. C. & Ho, C. J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
4 Citations (Scopus)