Projects per year
Personal profile
Education
- 1996 PhD, Mechanical Engineering, Massachusetts Institute of Technology
Research Interests
- Applied Mathematics
- Applied Mechanics
- Semiconductor Fabrication Processes
- Structural Vibration Control
- Wave Dynamics
Experience
- 1991年8月 ~ 1992年7月 國立臺灣大學助教
- 1996年1月 ~ 1999年1月 美國西北大學研究員
- 1999年2月 ~ 2003年7月 國立成功大學機械工程學系助理教授
- 2003年8月 ~ 2009年7月 國立成功大學機械工程學系副教授
- 2009年8月 ~ 迄今 國立成功大學機械工程學系教授
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Research output
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A numerical simulation validated experimentally for thermally developing convection characteristics of a phase change nanofluid flow in a circular tube
Ho, C. J., Chu, Y. C., Huang, Z. P., Yang, T. S., Chiu, T. C., Chen, B. L. & Yan, W. M., 2021 Jun, In: Case Studies in Thermal Engineering. 25, 100925.Research output: Contribution to journal › Article › peer-review
Open Access -
Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations
Chuang, C. F., Chen, K. S., Chiu, T. C., Yang, T. S. & Lin, M. C., 2020 Jan 1, In: Sensors and Actuators, A: Physical. 301, 111723.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
Reconstituted Wafer Deformation Analysis through Whole Process Emulation
Yang, C. Y., Chen, K. S. & Yang, T. S., 2020 Mar, In: IEEE Transactions on Device and Materials Reliability. 20, 1, p. 172-180 9 p., 8994086.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging
Yang, C. Y., Chen, K. S., Yang, T. S. G., Chiu, T. C. & Ho, C. J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
Enhancing convective heat transfer for laminar flow in a tube by inserting a concentric inner tube and controlling concurrent flows: a numerical assessment
Ho, C. J., Yen, J. Y., Kung, X. Y., Yang, T. S. & Wen, C. D., 2018 Dec, In: International Communications in Heat and Mass Transfer. 99, p. 26-36 11 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus)