Tian-Shiang Yang

Professor

Department of Mechanical Engineering

https://orcid.org/0000-0003-3624-312X

Phone886 6 2757575 ext 62268-16
Emailtsyang@mail.ncku.edu.tw

Source: Scopus
Calculated based on no. of publications stored in Pure and citations from Scopus

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Personal profile

Education

1996 PhD, Mechanical Engineering, Massachusetts Institute of Technology

Research Interests

Applied Mathematics
Applied Mechanics
Semiconductor Fabrication Processes
Structural Vibration Control
Wave Dynamics

Experience

1991年8月 ~ 1992年7月國立臺灣大學助教
1996年1月 ~ 1999年1月美國西北大學研究員
1999年2月 ~ 2003年7月國立成功大學機械工程學系助理教授
2003年8月 ~ 2009年7月國立成功大學機械工程學系副教授
2009年8月 ~ 迄今國立成功大學機械工程學系教授

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26 Finished

多孔吸附濾清器熱質傳效能之數值計算及其工業應用實驗研究
Yang, T.
19-08-01 → 20-07-31
Project: Research project
運用共振水波槽之海浪獵能器開發：觀念設計、非線性動態分析、及原型系統建置
Yang, T.
17-08-01 → 18-07-31
Project: Research project
多孔性吸附反應器之熱質傳分析與實驗研究
Yang, T.
16-08-01 → 17-07-31
Project: Research project
多孔性吸附反應器之熱質傳分析與實驗研究
Yang, T.
15-08-01 → 16-07-31
Project: Research project
多孔性吸附反應器之熱質傳分析與實驗研究
Yang, T.
14-08-01 → 15-07-31
Project: Research project

561 Citations
14 h-Index
46 Article
8 Conference contribution
1 Paper
1 Review article

Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations
Chuang, C. F., Chen, K. S., Chiu, T. C., Yang, T. S. & Lin, M. C., 2020 Jan 1, In: Sensors and Actuators, A: Physical. 301, 111723.
Research output: Contribution to journal › Article › peer-review
2 Citations (Scopus)
Reconstituted Wafer Deformation Analysis through Whole Process Emulation
Yang, C. Y., Chen, K. S. & Yang, T. S., 2020 Mar, In: IEEE Transactions on Device and Materials Reliability. 20, 1, p. 172-180 9 p., 8994086.
Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus)
Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging
Yang, C. Y., Chen, K. S., Yang, T. S. G., Chiu, T. C. & Ho, C. J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus)
Enhancing convective heat transfer for laminar flow in a tube by inserting a concentric inner tube and controlling concurrent flows: a numerical assessment
Ho, C. J., Yen, J. Y., Kung, X. Y., Yang, T. S. & Wen, C. D., 2018 Dec, In: International Communications in Heat and Mass Transfer. 99, p. 26-36 11 p.
Research output: Contribution to journal › Article › peer-review
Performance analysis of a water tank with oscillating walls for wave energy harvesting
Chen, P. H. & Yang, T. S., 2018 Aug 1, In: Journal of Engineering Mathematics. 111, 1, p. 165-189 25 p.
Research output: Contribution to journal › Article › peer-review