• 531 Citations
  • 13 h-Index
1990 …2020
If you made any changes in Pure these will be visible here soon.

Personal profile


  • 1996 PhD, Mechanical Engineering, Massachusetts Institute of Technology

Research Interests

  • Applied Mathematics
  • Applied Mechanics
  • Semiconductor Fabrication Processes
  • Structural Vibration Control
  • Wave Dynamics


  • 1991年8月 ~ 1992年7月 國立臺灣大學助教
  • 1996年1月 ~ 1999年1月 美國西北大學研究員
  • 1999年2月 ~ 2003年7月 國立成功大學機械工程學系助理教授
  • 2003年8月 ~ 2009年7月 國立成功大學機械工程學系副教授
  • 2009年8月 ~ 迄今 國立成功大學機械工程學系教授

Fingerprint Dive into the research topics where Tian-Shiang Yang is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 3 Similar Profiles
solitary waves Physics & Astronomy
Chemical mechanical polishing Engineering & Materials Science
Peeling Engineering & Materials Science
Cantilever beams Engineering & Materials Science
Solitons Engineering & Materials Science
Actuators Engineering & Materials Science
Derivatives Engineering & Materials Science
Glass Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Projects 1999 2018

Research Output 1990 2020

  • 531 Citations
  • 13 h-Index
  • 45 Article
  • 8 Conference contribution
  • 1 Paper
  • 1 Review article

Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations

Chuang, C. F., Chen, K. S., Chiu, T. C., Yang, T. S. & Lin, M. C., 2020 Jan 1, In : Sensors and Actuators, A: Physical. 301, 111723.

Research output: Contribution to journalArticle

Ultrafast lasers
crack propagation
Laser ablation
laser ablation
Crack propagation

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Yang, C. Y., Chen, K-S., Yang, T-S., Chiu, T-C. & Ho, C-J., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sensitivity analysis
Sheet molding compounds
convective heat transfer
laminar flow
Laminar flow

Performance analysis of a water tank with oscillating walls for wave energy harvesting

Chen, P. H. & Yang, T-S., 2018 Aug 1, In : Journal of Engineering Mathematics. 111, 1, p. 165-189 25 p.

Research output: Contribution to journalArticle

Water tanks
Energy Harvesting
Energy harvesting
Performance Analysis
2 Citations (Scopus)

Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Chen, K-S., Yang, T-S., Hong, R. C., Chiu, T-C. & Lin, M. C., 2018 Jan 1, In : Microsystem Technologies. 24, 1, p. 397-409 13 p.

Research output: Contribution to journalArticle



An Analytical Investigation into Valveless Pumping Effects in a Closed-loop Water-wave System

Author: 欣潔, 何., 2014 Aug 26

Supervisor: Yang, T. (Supervisor)

Student thesis: Master's Thesis

Experimental Performance Analysis of Thermal Management for Porous Adsorption/Desorption Reactors

Author: 尚賢, 林., 2014 Aug 28

Supervisor: Yang, T. (Supervisor)

Student thesis: Master's Thesis

Numerical Performance Simulation of a Metal Hydride Reactor with Spatially Distributed Metal-foam Volume Fraction

Author: 凱茜, 莊., 2016 May 4

Supervisor: Yang, T. (Supervisor)

Student thesis: Master's Thesis

Performance Analysis of a Model Water-Wave Energy Harvesting System with a Paddling-Wall Wave Tank

Author: 柏勳, 陳., 2015 Jul 29

Supervisor: Yang, T. (Supervisor)

Student thesis: Master's Thesis


Author: 敬霖, 蕭., 2018 Mar 13

Supervisor: Yang, T. (Supervisor)

Student thesis: Master's Thesis