• 525 Citations
  • 13 h-Index
1990 …2019
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Research Output 1990 2019

  • 525 Citations
  • 13 h-Index
  • 44 Article
  • 8 Conference contribution
  • 1 Paper
  • 1 Review article
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Conference contribution
2019

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Yang, C. Y., Chen, K-S., Yang, T-S., Chiu, T-C. & Ho, C-J., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fans
Sensitivity analysis
Packaging
Processing
Sheet molding compounds
2017
1 Citation (Scopus)

Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects

Hsiao, C. L., Yang, C. Y., Chen, H. C., Yang, T-S., Chen, K-S., Wu, T. H., Wang, Y. C. & Lee, S., 2017 Jul 1, IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 42-45 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2017-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sheet molding compounds
Curing
Defects
Kinetics
Molding
2 Citations (Scopus)

Process emulation for predicting die shift and wafer warpage in wafer reconstitution

Yang, C. Y., Liu, Y. C., Chen, K-S., Yang, T-S., Wang, Y. C. & Lee, S. S., 2017 Sep 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 215-220 6 p. 8046441. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Curing
Molding
Processing
Sheet molding compounds
Electronics packaging
2016
1 Citation (Scopus)

Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Chen, K. S., Yang, T. S., Hong, R. C., Chiu, T. C., Wen, A. C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2016 Jul 15, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Mita, Y., Rencz, M., Charlot, B., Schneider, P., Tas, N., Nouet, P. & Pressecq, F. (eds.). Institute of Electrical and Electronics Engineers Inc., 7514879. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Peeling
Glass
Defects
Lasers
Processing
2015
3 Citations (Scopus)

Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing

Yang, T. S., Chen, G. D., Chen, K. S., Hong, R. C., Chiu, T. C., Wen, C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2015 Jan 1, Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME), (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); vol. 10-2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Peeling
Thermoanalysis
Cracks
Glass
Lasers
2010

Effects of wafer carrier design on contact stress uniformity in CMP

Hu, I., Yang, T-S. & Chen, K-S., 2010 Dec 1, Advances in Abrasive Technology XIII. p. 305-310 6 p. (Advanced Materials Research; vol. 126-128).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rigidity
Contacts (fluid mechanics)
Fluids
Pressure distribution
Lubrication
2009
1 Citation (Scopus)

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

Ou, K. S., Chen, K-S., Yang, T-S. & Lee, S-Y., 2009 Dec 1, ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. p. 597-606 10 p. (Proceedings of the ASME Design Engineering Technical Conference; vol. 6).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Residual Stress
Electrostatics
Loads (forces)
Residual stresses
Actuators
1999
2 Citations (Scopus)

Optimal prechirping for dispersion-managed transmission of return-To-zero pulses

Yang, T-S., Kath, W. L. & Evangelides, S. G., 1999 Jan 1, OFC/IOOC 1999 - Optical Fiber Communication Conference and the International Conference on Integrated Optics and Optical Fiber Communication. Institute of Electrical and Electronics Engineers Inc., p. 249-251 3 p. 768124. (OFC/IOOC 1999 - Optical Fiber Communication Conference and the International Conference on Integrated Optics and Optical Fiber Communication; vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

fibers
Fibers
pulses