Tz-Cheng Chiu

Chen, Y. J., Deng, Y. A. & Chiu, T-C., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 139-142 4 p. 8625759. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Sheet molding compounds

Fatigue crack propagation

Fatigue of materials

Copper

Cracks

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Yang, C. Y., Chen, K-S., Yang, T-S., Chiu, T-C. & Ho, C-J., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fans

Sensitivity analysis

Packaging

Processing

Sheet molding compounds

1 Citation (Scopus)

An experimental setup for characterizing subcritical debonding of materials interface under mixed mode fatigue loading

Chiu, T-C., Lu, W. & Hua, C. A., 2018 Sep 1, In : International Journal of Fatigue. 114, p. 109-119 11 p.

Research output: Contribution to journal › Article

Debonding

Mixed Mode

Fatigue

Fatigue of materials

Angle

Development of consistent interconversions between linear viscoelastic functions for multiaxial viscoelastic models

Chen, D. L., Chiu, T-C., Lee, S. H., Sung, P. H., Shih, M. K., Tarng, D. & Hung, C. P., 2018 Jan 12, IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 282-285 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2017-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Packaging materials

Mathematical models

Physical aging of epoxy molding compound and its influences on the warpage of reconstituted wafer

Chiu, T-C., Yin, W. J., Yeh, E. Y., Yang, Y. T., Chen, D. L. & Tseng, Y. H., 2018 Aug 7, Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1848-1855 8 p. 8429790. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Sheet molding compounds

Aging of materials

Creep

Experiments

Constitutive models