• 1326 Citations
  • 12 h-Index
19992020

Research output per year

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Personal profile

Education

  • 2000 PhD, Mechanical Engineering, Lehigh University

Research Interests

  • Solid Mechanics

Experience

  • 2011/08 ~ present Associate Professor, Department of Mechanical Engineering, National Cheng Kung University

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Projects

Research Output

  • 1326 Citations
  • 12 h-Index
  • 38 Conference contribution
  • 25 Article
  • 6 Conference article
  • 1 Review article
  • A viscoplastic-based fatigue reliability model for the polyimide dielectric thin film

    Chang, Y. C., Chiu, T. C., Yang, Y. T., Tseng, Y. H. & Chen, X. H., 2019 May, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1359-1365 7 p. 8811235. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package

    Wu, J. Y., Chen, T. W., Chiu, T. C., Chen, D. L., Chen, T. Y. & Shih, M. K., 2019 Oct, IMPACT 2019 - 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceeding. IEEE Computer Society, p. 76-79 4 p. 9024983. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2019-October).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Fatigue crack growth on the interface of copper and epoxy molding compound under mixed-mode loading

    Chen, Y. J., Deng, Y. A. & Chiu, T. C., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 139-142 4 p. 8625759. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

    Yang, C. Y., Chen, K. S., Yang, T. S. G., Chiu, T. C. & Ho, C. J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Thesis

    316L不鏽鋼之選擇性雷射熔融積層製程應力與變形分析

    Author: 詠迪, 鐘., 2018 Aug 22

    Supervisor: Chiu, T. (Supervisor)

    Student thesis: Master's Thesis

    具可調整骨釘角?之創新骨板設計

    Author: 秉翰, 張., 2016 Aug 16

    Supervisor: Chiu, T. (Supervisor)

    Student thesis: Master's Thesis

    堆疊式封裝之封膠三維黏彈行為量測與翹曲模擬

    Author: 東藝, 黃., 2014 Aug 5

    Supervisor: Chiu, T. (Supervisor)

    Student thesis: Master's Thesis

    封膠黏彈特性分析及其於條形封裝翹曲模擬之應用

    Author: 煒傑, 殷., 2017 Aug 30

    Supervisor: Chiu, T. (Supervisor)

    Student thesis: Master's Thesis

    循環負載下聚醯亞胺薄膜之疲勞特性

    Author: 宇辰, 張., 2015 Aug 21

    Supervisor: Chiu, T. (Supervisor)

    Student thesis: Master's Thesis