Projects per year
Personal profile
Education
- 2000 PhD, Mechanical Engineering, Lehigh University
Research Interests
- Solid Mechanics
Experience
- 2011/08 ~ present Associate Professor, Department of Mechanical Engineering, National Cheng Kung University
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
Fingerprint
Dive into the research topics where Tz-Cheng Chiu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Network
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 16 Finished
-
Cohesive-zone based fracture mechanics model of an edge delamination in bimaterial beam under mixed-mode bending test
Liu, C. W. & Chiu, T. C., 2023 May 1, In: European Journal of Mechanics, A/Solids. 99, 104928.Research output: Contribution to journal › Article › peer-review
-
Development and Application of the Moisture-Dependent Viscoelastic Model of Polyimide in Hygro-Thermo-Mechanical Analysis of Fan-Out Interconnect
Yang, C. M., Chiu, T. C., Yin, W. J., Chen, D. L., Kao, C. L. & Tarng, D., 2022, Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. Institute of Electrical and Electronics Engineers Inc., p. 746-753 8 p. (Proceedings - Electronic Components and Technology Conference; vol. 2022-May).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
The Effects of Time-Dependent Inelastic Behaviors on the Debonding of Cu-Polyimide Interface
Wang, C. Y. & Chiu, T. C., 2022, Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022. IEEE Computer Society, (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2022-October).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
-
A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect
Liu, W. T., Yang, C. M., Chiu, T. C., Chen, D. L., Hsiao, C. L. & Tarng, D., 2021, Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc., p. 816-822 7 p. (Proceedings - Electronic Components and Technology Conference; vol. 2021-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
A numerical simulation validated experimentally for thermally developing convection characteristics of a phase change nanofluid flow in a circular tube
Ho, C. J., Chu, Y. C., Huang, Z. P., Yang, T. S., Chiu, T. C., Chen, B. L. & Yan, W. M., 2021 Jun, In: Case Studies in Thermal Engineering. 25, 100925.Research output: Contribution to journal › Article › peer-review
Open Access2 Citations (Scopus)