Projects per year
Personal profile
Education
- 2000 PhD, Mechanical Engineering, Lehigh University
Research Interests
- Solid Mechanics
Experience
- 2011/08 ~ present Associate Professor, Department of Mechanical Engineering, National Cheng Kung University
Fingerprint
Dive into the research topics where Tz-Cheng Chiu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Network
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Research output
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A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect
Liu, W. T., Yang, C. M., Chiu, T. C., Chen, D. L., Hsiao, C. L. & Tarng, D., 2021, Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc., p. 816-822 7 p. (Proceedings - Electronic Components and Technology Conference; vol. 2021-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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A numerical simulation validated experimentally for thermally developing convection characteristics of a phase change nanofluid flow in a circular tube
Ho, C. J., Chu, Y. C., Huang, Z. P., Yang, T. S., Chiu, T. C., Chen, B. L. & Yan, W. M., 2021 Jun, In: Case Studies in Thermal Engineering. 25, 100925.Research output: Contribution to journal › Article › peer-review
Open Access -
A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions
Yang, H. C. & Chiu, T. C., 2021 Apr, In: Microelectronics Reliability. 119, 114086.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
Numerical implementation of a unified viscoplastic model for considering solder joint response under board-level temperature cycling
Yang, H. C. & Chiu, T. C., 2021, In: CMES - Computer Modeling in Engineering and Sciences. 128, 2, p. 639-668 30 p.Research output: Contribution to journal › Article › peer-review
Open Access1 Citation (Scopus) -
The Effect of Viscoelastic Behavior on the Debonding of Underfill-Silicon Interface
Wu, C. C. & Chiu, T. C., 2021, 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2021 - Proceedings. IEEE Computer Society, p. 97-100 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2021-December).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution