Tz-Cheng Chiu

Professor

Department of Mechanical Engineering

https://orcid.org/0000-0001-9195-3971

Phone886 6 2757575 ext 62181
Emailtcchiu@mail.ncku.edu.tw

Source: Scopus
Calculated based on no. of publications stored in Pure and citations from Scopus

Research activity per year

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Personal profile

Education

2000 PhD, Mechanical Engineering, Lehigh University

Research Interests

Solid Mechanics

Experience

2011/08 ~ present Associate Professor, Department of Mechanical Engineering, National Cheng Kung University

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14 Finished

製程相依高分子黏彈特性及其於系統級電子封裝製程翹曲模擬之應用
Chiu, T.
17-08-01 → 18-07-31
Project: Research project
金屬粉末雷射熔融積層製程參數模擬最佳化分析(2/3)
Chiu, T.
17-05-01 → 18-04-30
Project: Research project
界面裂紋受混合模式疲勞作用下之次臨界成長行為(II)
Chiu, T.
16-08-01 → 17-07-31
Project: Research project
金屬粉末雷射熔融積層製程參數模擬最佳化分析(1/3)
Chiu, T.
16-05-01 → 17-04-30
Project: Research project
界面裂紋受混合模式疲勞作用下之次臨界成長行為(II)
Chiu, T.
15-08-01 → 16-07-31
Project: Research project

1410 Citations
13 h-Index
40 Conference contribution
24 Article
7 Conference article
1 Review article

A Cyclic-Softening Viscoplastic Model for Considering the Temperature-Cycling Reliability of SAC305 Solder Joints
Yang, H. C. & Chiu, T. C., 2020 Oct 21, International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings. IEEE Computer Society, p. 157-160 4 p. 9268606. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2020-October).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package
Chiu, T. C., Wu, J. Y., Liu, W. T., Liu, C. W., Chen, D. L., Shih, M. K. & Tarng, D., 2020 Jun, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 1205-1211 7 p. 9159182. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations
Chuang, C. F., Chen, K. S., Chiu, T. C., Yang, T. S. & Lin, M. C., 2020 Jan 1, In: Sensors and Actuators, A: Physical. 301, 111723.
Research output: Contribution to journal › Article › peer-review
2 Citations (Scopus)
A viscoplastic-based fatigue reliability model for the polyimide dielectric thin film
Chang, Y. C., Chiu, T. C., Yang, Y. T., Tseng, Y. H. & Chen, X. H., 2019 May, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1359-1365 7 p. 8811235. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package
Wu, J. Y., Chen, T. W., Chiu, T. C., Chen, D. L., Chen, T. Y. & Shih, M. K., 2019 Oct, IMPACT 2019 - 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceeding. IEEE Computer Society, p. 76-79 4 p. 9024983. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2019-October).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution