Projects per year
Personal profile
Education
- 2000 PhD, Mechanical Engineering, Lehigh University
Research Interests
- Solid Mechanics
Experience
- 2011/08 ~ present Associate Professor, Department of Mechanical Engineering, National Cheng Kung University
Fingerprint Dive into the research topics where Tz-Cheng Chiu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 3 Similar Profiles
Soldering alloys
Engineering & Materials Science
Sheet molding compounds
Engineering & Materials Science
Ball grid arrays
Engineering & Materials Science
Cracks
Engineering & Materials Science
Constitutive models
Engineering & Materials Science
Delamination
Engineering & Materials Science
Energy release rate
Engineering & Materials Science
Fatigue of materials
Engineering & Materials Science
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Research Output 1999 2019
A viscoplastic-based fatigue reliability model for the polyimide dielectric thin film
Chang, Y. C., Chiu, T-C., Yang, Y. T., Tseng, Y. H. & Chen, X. H., 2019 May 1, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1359-1365 7 p. 8811235. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Dielectric films
Polyimides
Fatigue of materials
Thin films
Stress relaxation
Fatigue crack growth on the interface of copper and epoxy molding compound under mixed-mode loading
Chen, Y. J., Deng, Y. A. & Chiu, T-C., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 139-142 4 p. 8625759. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Sheet molding compounds
Fatigue crack propagation
Fatigue of materials
Copper
Cracks
Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging
Yang, C. Y., Chen, K-S., Yang, T-S., Chiu, T-C. & Ho, C-J., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Fans
Sensitivity analysis
Packaging
Processing
Sheet molding compounds
1
Citation
(Scopus)
An experimental setup for characterizing subcritical debonding of materials interface under mixed mode fatigue loading
Chiu, T-C., Lu, W. & Hua, C. A., 2018 Sep 1, In : International Journal of Fatigue. 114, p. 109-119 11 p.Research output: Contribution to journal › Article
Debonding
Mixed Mode
Fatigue
Fatigue of materials
Angle
1
Citation
(Scopus)
Interconversions between linear viscoelastic functions with a time-dependent bulk modulus
Chen, D. L., Chiu, T-C., Chen, T-C., Yang, P. F. & Jian, S. R., 2018 Jun 1, In : Mathematics and Mechanics of Solids. 23, 6, p. 879-895 17 p.Research output: Contribution to journal › Article
Bulk Modulus
Elastic moduli
Modulus
Monotonic Function
Poisson's Ratio
Thesis
316L不鏽鋼之選擇性雷射熔融積層製程應力與變形分析
Author: 詠迪, 鐘., 2018 Aug 22Supervisor: Chiu, T. (Supervisor)
Student thesis: Master's Thesis
具可調整骨釘角?之創新骨板設計
Author: 秉翰, 張., 2016 Aug 16Supervisor: Chiu, T. (Supervisor)
Student thesis: Master's Thesis
堆疊式封裝之封膠三維黏彈行為量測與翹曲模擬
Author: 東藝, 黃., 2014 Aug 5Supervisor: Chiu, T. (Supervisor)
Student thesis: Master's Thesis
封膠黏彈特性分析及其於條形封裝翹曲模擬之應用
Author: 煒傑, 殷., 2017 Aug 30Supervisor: Chiu, T. (Supervisor)
Student thesis: Master's Thesis
循環負載下聚醯亞胺薄膜之疲勞特性
Author: 宇辰, 張., 2015 Aug 21Supervisor: Chiu, T. (Supervisor)
Student thesis: Master's Thesis