Projects per year
Personal profile
Education
- 2000 PhD, Mechanical Engineering, Lehigh University
Research Interests
- Solid Mechanics
Experience
- 2011/08 ~ present Associate Professor, Department of Mechanical Engineering, National Cheng Kung University
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 9 Industry, Innovation, and Infrastructure
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 16 Finished
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Effect of Inelasticity on the Cracking of Materials and Interfaces in Heterogeneous Integration (Invited)
Lin, S. C., Wu, C. C. & Chiu, T. C., 2026, 2026 IEEE International Reliability Physics Symposium, IRPS 2026. Institute of Electrical and Electronics Engineers Inc., (IEEE International Reliability Physics Symposium Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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A Procedure for Evaluating the Chiplet-Module-System Interaction of a 2.5-D Package Under Reliability Test Condition
Huang, J. A., Huang, Z. Y. & Chiu, T. C., 2025, Proceedings - IEEE 75th Electronic Components and Technology Conference, ECTC 2025. Institute of Electrical and Electronics Engineers Inc., p. 1119-1125 7 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Interaction of Debonding Crack and the RDL Cu Trace in a 2.5-D Package Under Temperature Cycling Condition
Lai, P. Y. & Chiu, T. C., 2025, Proceedings - 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Energy-Efficient AI: From Cloud to Edge, IMPACT 2025. IEEE Computer Society, p. 527-530 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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A Fracture Mechanics Model for Interface Debonding in 2.5-D Package under Solder Reflow
Huang, B. R. & Chiu, T. C., 2024, Proceedings - 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2024. IEEE Computer Society, p. 166-169 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Evaluation of Vapor Pressure Induced Debonding Failure in Fan-Out Package Under Reflow Condition
Chen, B. S., Chiu, T. C., Yin, W. J., Kao, C. L. & Hung, C. P., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 150-156 7 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
6 Link opens in a new tab Citations (Scopus)