• 2112 Citations
  • 27 h-Index
1989 …2019

Research output per year

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Research Output

2019

Simulation of the Resin Infiltration in Fiber Bundles Using the Lattice Boltzmann Method

Yang, W. K., Chang, S. C. & Young, W. B., 2019 Sep 1, In : Journal of Aeronautics, Astronautics and Aviation. 51, 3, p. 321-334 14 p.

Research output: Contribution to journalArticle

The mechanical, hygral, and interfacial strength of continuous bamboo fiber reinforced epoxy composites

Huang, J. K. & Young, W. B., 2019 Jun 1, In : Composites Part B: Engineering. 166, p. 272-283 12 p.

Research output: Contribution to journalArticle

9 Citations (Scopus)
2018

Application of lattice Boltzmann method in free surface flow simulation of micro injection molding

Chen, Y. X., Chang, S. C. & Young, W. B., 2018 Apr 1, In : Computers and Mathematics with Applications. 75, 7, p. 2374-2386 13 p.

Research output: Contribution to journalArticle

5 Citations (Scopus)

Design of the printing pattern on film for three-dimensional molded interconnect devices

Liu, R. H., Young, W. B. & Ming, H. P., 2018 Oct, In : Advances in Polymer Technology. 37, 6, p. 1722-1731 10 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2 Citations (Scopus)

Theoretical approach to simulate efficient selective solar absorbers with micro or nano structured arrays

Chiu, J. S. & Young, W. B., 2018 Jan 1, In : Materials Research. 21, 3, e20171026.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2017

Lattice Boltzmann simulation of polymer melt flow with a low Reynolds number

Young, W-B., 2017 Jan 1, In : International Journal of Heat and Mass Transfer. 115, p. 784-792 9 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2015

A two-dimensional simulation model for the molded underfill process in flip chip packaging

Guo, X. R. & Young, W-B., 2015 Jul 23, In : Journal of Mechanical Science and Technology. 29, 7, p. 2967-2974 8 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)
5 Citations (Scopus)

Vacuum effect on the void formation of the molded underfill process in flip chip packaging

Guo, X. R. & Young, W. B., 2015 Feb 1, In : Microelectronics Reliability. 55, 3-4, p. 613-622 10 p.

Research output: Contribution to journalArticle

9 Citations (Scopus)
2014

Fabrication of bamboo fiber reinforced polylactide biocomposites

Young, W-B., Tian, B. Y. & Tsau, Y. C., 2014 Jan 1, Lecture Notes in Mechanical Engineering. Pleiades Publishing, p. 277-284 8 p. (Lecture Notes in Mechanical Engineering; vol. 0).

Research output: Chapter in Book/Report/Conference proceedingChapter

Modeling and numerical study of thermal-compression bonding in the packaging process using NCA

Chang, C. H. & Young, W-B., 2014 Jan 1, In : Applied Mathematical Modelling. 38, 11-12, p. 3016-3030 15 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

The application of carbon black and printing ink technology in molded interconnect devices

Liu, R. H. & Young, W. B., 2014 Jul 1, In : Journal of Polymer Engineering. 34, 5, p. 395-403 9 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)
2013

A two-layer model for the simulation of the vartm process with resin distribution layer

Young, W. B., 2013 Dec 1, In : Applied Composite Materials. 20, 6, p. 1305-1319 15 p.

Research output: Contribution to journalArticle

9 Citations (Scopus)

Study on bump arrangement to accelerate the underfill flow in flip-chip packaging

Lin, S. W. & Young, W-B., 2013 Jan 1, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 1, p. 40-45 6 p., 6363586.

Research output: Contribution to journalArticle

4 Citations (Scopus)

The effective permeability of the underfill flow domain in flip-chip packaging

Yang, C. & Young, W. B., 2013 Feb 1, In : Applied Mathematical Modelling. 37, 3, p. 1177-1186 10 p.

Research output: Contribution to journalArticle

11 Citations (Scopus)
2 Citations (Scopus)

Two-component injection molding of molded interconnect devices

Chen, J. Y. & Young, W-B., 2013 Feb 1, Manufacturing Engineering and Technology for Manufacturing Growth. p. 78-82 5 p. (Advanced Materials Research; vol. 628).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)
2012

Structural analysis and design of the composite wind turbine blade

Wu, W. H. & Young, W. B., 2012 Jun 1, In : Applied Composite Materials. 19, 3-4, p. 247-257 11 p.

Research output: Contribution to journalArticle

9 Citations (Scopus)
2011

Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA

Chang, C. H. & Young, W-B., 2011 Apr 1, In : Microelectronics Reliability. 51, 4, p. 860-865 6 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
5 Citations (Scopus)

Experimental study on the filling of nano structures with infrared mold surface heating

Lin, H. Y., Chang, C. H. & Young, W-B., 2011 Dec 1, In : International Polymer Processing. 26, 1, p. 73-81 9 p.

Research output: Contribution to journalArticle

15 Citations (Scopus)
3 Citations (Scopus)

Optimization of the skin thickness distribution in the composite wind turbine blade

Young, W-B. & Wu, W. H., 2011 Nov 10, Proceedings of 2011 International Conference on Fluid Power and Mechatronics, FPM 2011. p. 62-66 5 p. 6045730. (Proceedings of 2011 International Conference on Fluid Power and Mechatronics, FPM 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)
2010

Application of the underfill model to bump arrangement and dispensing process design

Peng, S. W. & Young, W-B., 2010 Apr 1, In : IEEE Transactions on Electronics Packaging Manufacturing. 33, 2, p. 122-128 7 p.

Research output: Contribution to journalArticle

7 Citations (Scopus)

Experimental and analytical study on filling of nano structures in micro injection molding

Lin, H. Y., Chang, C. H. & Young, W-B., 2010 Dec 1, In : International Communications in Heat and Mass Transfer. 37, 10, p. 1477-1486 10 p.

Research output: Contribution to journalArticle

42 Citations (Scopus)

Fabrication of the plastic component for photonic crystal using micro injection molding

Chang, C. H. & Young, W-B., 2010 Jun 1, In : Microsystem Technologies. 16, 6, p. 941-946 6 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)

Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation

Young, W-B., 2010 Jul 1, In : Microelectronics Reliability. 50, 7, p. 995-999 5 p.

Research output: Contribution to journalArticle

13 Citations (Scopus)

The filling behavior of reinforcing glass fiber in micro injection molding

Liou, G. L. & Young, W. B., 2010 Aug 30, In : International Polymer Processing. 25, 4, p. 264-269 6 p.

Research output: Contribution to journalArticle

4 Citations (Scopus)
2009

Analysis of the filling capability to the microstructures in micro-injection molding

Lin, H. Y. & Young, W-B., 2009 Sep 1, In : Applied Mathematical Modelling. 33, 9, p. 3746-3755 10 p.

Research output: Contribution to journalArticle

47 Citations (Scopus)

Development of a helicopter landing gear prototype using resin infusion molding

Young, W-B., 2009 Apr 1, In : Journal of Reinforced Plastics and Composites. 28, 7, p. 833-849 17 p.

Research output: Contribution to journalArticle

10 Citations (Scopus)

Experimental study of filling behaviors in the underfill encapsulation of a flip-chip

Shih, M. F. & Young, W-B., 2009 Dec 1, In : Microelectronics Reliability. 49, 12, p. 1555-1562 8 p.

Research output: Contribution to journalArticle

17 Citations (Scopus)

Study on mold filling behaviors of micro channels in injection molding

Li, J. H. & Young, W. B., 2009 Jan 1, In : International Polymer Processing. 24, 5, p. 421-427 7 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)

Study on Mold Filling Behaviors of Micro Channels in Injection Molding

Li, J. & Young, W., 2009 Nov 1, In : International Polymer Processing. 24, 5, p. 421-427

Research output: Contribution to journalArticle

2008

Analysis of the isothermal compression in nanoimprint lithography assuming a power-law fluid

Hsin, I. C. & Young, W. B., 2008 Mar 1, In : International Polymer Processing. 23, 1, p. 24-29 6 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2007

Analysis of filling distance in cylindrical microfeatures for microinjection molding

Young, W. B., 2007 Sep 1, In : Applied Mathematical Modelling. 31, 9, p. 1798-1806 9 p.

Research output: Contribution to journalArticle

26 Citations (Scopus)

Micro-injection molding with the infrared assisted mold heating system

Yu, M. C., Young, W-B. & Hsu, P. M., 2007 Jul 15, In : Materials Science and Engineering A. 460-461, p. 288-295 8 p.

Research output: Contribution to journalArticle

91 Citations (Scopus)

Process analysis of a helicopter landing gear prototype using resin infusion molding

Young, W-B., 2007, Proceedings of the 16th IASTED International Conference on Applied Simulation and Modelling, ASM 2007. p. 44-49 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The effect of contact angle and solder bump arrangement on underfill process

Young, W-B., 2007 Oct 12, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06. 4198855. (2006 7th International Conference on Electronics Packaging Technology, ICEPT '06).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2006

Analysis of the residual stresses in the process of nanoimprint lithography

Young, W. B., 2006 Jul, In : International Polymer Processing. 21, 3, p. 290-294 5 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

The thrust and lift of an ornithopter's membrane wings with simple flapping motion

Lin, C. S., Hwu, C. & Young, W. B., 2006 Mar 1, In : Aerospace Science and Technology. 10, 2, p. 111-119 9 p.

Research output: Contribution to journalArticle

63 Citations (Scopus)

Underfill of flip-chip: The effect of contact angle and solder bump arrangement

Young, W. B. & Yang, W. L., 2006 Aug 1, In : IEEE Transactions on Advanced Packaging. 29, 3, p. 647-653 7 p.

Research output: Contribution to journalArticle

24 Citations (Scopus)
2005

Analysis of the nanoimprint lithography with a viscous model

Young, W-B., 2005 Apr 1, In : Microelectronic Engineering. 77, 3-4, p. 405-411 7 p.

Research output: Contribution to journalArticle

78 Citations (Scopus)

Effect of process parameters on injection compression molding of pickup lens

Young, W. B., 2005 Oct 1, In : Applied Mathematical Modelling. 29, 10, p. 955-971 17 p.

Research output: Contribution to journalArticle

39 Citations (Scopus)

Experimental study on the filling of a micro injection molding with cylindrical dot patterns

Chang, H. C. & Young, W. B., 2005 Sep, In : International Polymer Processing. 20, 3, p. 245-249 5 p.

Research output: Contribution to journalArticle

8 Citations (Scopus)

Simulation of the filling process in molding components with micro channels

Young, W-B., 2005 Jun 1, In : Microsystem Technologies. 11, 6, p. 410-415 6 p.

Research output: Contribution to journalArticle

34 Citations (Scopus)

Study on residual stresses of thin-walled injection molding

Wang, T. H. & Young, W. B., 2005 Oct 1, In : European Polymer Journal. 41, 10, p. 2511-2517 7 p.

Research output: Contribution to journalArticle

75 Citations (Scopus)
2004

A model for underfill viscous flow considering the resistance induced by solder bumps

Lai, C. L. & Young, W. B., 2004 Jun 1, In : Journal of Electronic Packaging, Transactions of the ASME. 126, 2, p. 186-194 9 p.

Research output: Contribution to journalArticle

10 Citations (Scopus)

Analysis of capillary flows in non-uniform cross-sectional capillaries

Young, W-B., 2004 Feb 26, In : Colloids and Surfaces A: Physicochemical and Engineering Aspects. 234, 1-3, p. 123-128 6 p.

Research output: Contribution to journalArticle

47 Citations (Scopus)