Projects per year
Personal profile
Education
- 2002 EMBA, Institute of Material Science, National Sun Yat Sen University
Research Interests
- Electronic Ceramic
- Organic thin film transistors
- RF ceramic components for wireless communication
- System In Package
- The Thin Film Semiconductor Processing
- The Thin Film Solar Cell
Experience
- 1991~1996 R&D (chief) engineer, Taiwan Philips Electronic Building Elements Incorporation
- 1996~1998 R&D section manager, Taiwan Philips Electronic Building Elements Incorporation
- 1998~1999 Researcher, Germany Philips Aachen Lab.
- 1999~2000 ceramic materials R&D manager, Taiwan Philips Kaohsiung Passive Components BU
- 2000~2003 HF Ceramic Products Development Manager, Phycomp Ltd.
- 2003 Assistant Professor, Department of Materials Engineering, I-Shou University
- 2007 ~ present Assistant Professor, Department of Electronic Engineering, National Kaohsiung University of Applied Science
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
Fingerprint
Dive into the research topics where Wen-Shi Lee is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 34 Finished
-
Improvements in the efficiency of p-type bifacial Si solar cells with a rear Cu electrode using galvanic replacement reactions
Kuo, T. C., Kuo, C. R. & Lee, W. H., 2022 Jan, In: Solar Energy Materials and Solar Cells. 234, 111411.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
Advanced low damage manufacturing processes to fabricate SOI FinFETs and measurement of electrical properties
Kumar, A., Lee, W. H. & Wang, Y. L., 2021 May, In: Microelectronics Reliability. 120, 114115.Research output: Contribution to journal › Article › peer-review
2 Citations (Scopus) -
A Novel Fabricating a Thick Film Cu-Ni Alloy Resistor by Screen Printing an Al Electrode and Galvanic Replacement Reaction
Kuo, C. R., Kuo, T. C. & Lee, W. H., 2021 Nov 1, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11, 11, p. 1997-2002 6 p.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
A Novel Method to Fabricate a Thick-Film Cu Electrode Fired in Air through Printing Al Electrode and Reduction-Oxidation Substitution Reaction
Kuo, T. C., Kuo, C. R. & Lee, W. H., 2021 Mar, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11, 3, p. 485-492 8 p., 9321716.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
Fesicr alloy powder to carbonyl iron powder mixing ratio effects on the magnetic properties of the iron-based alloy powder cores prepared using screen printing
Hsiang, H. I., Chuang, K. H. & Lee, W. H., 2021 Feb 2, In: Materials. 14, 4, p. 1-8 8 p., 1034.Research output: Contribution to journal › Article › peer-review
Open Access14 Citations (Scopus)