Projects per year
Fingerprint
Dive into the research topics where Yu-Chen Liu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 1 Finished
-
A machine learning model for flank wear prediction in face milling of Inconel 718
Banda, T., Liu, Y. C., Farid, A. A. & Lim, C. S., 2023 May, In: International Journal of Advanced Manufacturing Technology. 126, 3-4, p. 935-945 11 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
B2-strengthened Al-Co-Cr-Fe-Ni high entropy alloy with high ductility
Yen, S. Y., Liu, Y. C., Chu, S. H., Chang, C. W., Lin, S. K. & Tsai, M. H., 2022 Oct 15, In: Materials Letters. 325, 132828.Research output: Contribution to journal › Article › peer-review
7 Citations (Scopus) -
Computational thermodynamics-assisted design of nitrate-based phase change materials for waste heat recovery
Huang, W. Y., Liu, Y. C., Lin, S. K. & Chen, W. H., 2022 Aug, In: International Journal of Energy Research. 46, 10, p. 14452-14461 10 p.Research output: Contribution to journal › Article › peer-review
Open Access -
High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling1
Yang, C. H., Liu, Y. C., Hirata, Y., Nishikawa, H. & Lin, S. K., 2022, In: Science and Technology of Welding and Joining. 27, 7, p. 572-578 7 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
High thermal stability Cu-to-Cu joints fabricated by using Ga-based paste
Huang, T. H., Liu, Y. C., Cheng, C. E., Huang, C. W., Yang, C. H., Lin, C. F., Wang, C. C. & Lin, S. K., 2022, 2022 International Conference on Electronics Packaging, ICEP 2022. Institute of Electrical and Electronics Engineers Inc., p. 127-128 2 p. (2022 International Conference on Electronics Packaging, ICEP 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution