Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
-
SDG 3 Good Health and Well-being -
SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure
Fingerprint
Dive into the research topics where Yu-Chen Liu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 1 Finished
-
Lattice-Matched InAlN/GaN D-Mode MIS-HEMT on SiC for High-Current Operation and Low-Loss 100-V Double-Pulse Switching
Huang, S. J., Shen, T. Y., Liu, Y. C., Chen, Y. W., Chen, J. K., Lin, C. Y., Wang, Z. H., Yoda, T., Ohba, T., Wu, M. C. & Su, Y. K., 2026, (Accepted/In press) In: IEEE Access.Research output: Contribution to journal › Article › peer-review
Open Access -
Microstructure and thermal stability of 316 stainless steel in nitrate-based phase change materials for thermal energy storage
Kung, K. C., Chen, H. C., Liu, Y. C., Lin, S. K. & Chen, W.-H., 2026 Mar, In: Materials Characterization. 233, 116104.Research output: Contribution to journal › Article › peer-review
-
A Machine Learning Model for Vickers Hardness of Sn-In-X Low-Temperature Solder
Kuo, H. W. & Liu, Y. C., 2025, 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025. Institute of Electrical and Electronics Engineers Inc., p. 49-50 2 p. (2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
-
Critical lattice strain for electromigration - revisiting the Blech critical product
Liu, Y. C., Lin, K. H., Chiu, S. J., Lee, J. J., Lin, Y. G. & Lin, S. K., 2025 Oct, In: Materials Characterization. 228, 115384.Research output: Contribution to journal › Article › peer-review
-
Design High Shear Strength Sn-Bi-X Low-Temperature Solders on Cu Substrate using a Machine Learning Approach
Wu, P. Z. & Liu, Y. C., 2025, 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025. Institute of Electrical and Electronics Engineers Inc., p. 31-32 2 p. (2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution